1-3 of 3
Assembly lines
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Investigation of Strip Warpage Behavior in Wire Bonding Process

Wan-Chun Chuang, Wei-Long Chen
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021002.
Paper No: EP-19-1067
DOI: https://doi.org/10.1115/1.4045362
Published Online: February 3, 2020
View Article
PDF
Topics: Strips, Temperature, Warping, Molding, Assembly lines
Journal Articles

Fatigue Prediction for Molded Wafer-Level Package During Temperature Cycling

Wan-Chun Chuang, Wei-Long Chen
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011007.
Paper No: EP-19-1042
DOI: https://doi.org/10.1115/1.4044489
Published Online: October 10, 2019
View Article
PDF
Topics: Cycles, Fatigue life, Semiconductor wafers, Simulation models, Solders, Stress, Temperature, Creep, Assembly lines, Simulation results
Journal Articles

Fine Pitch Stencil Printing Process Modeling and Optimization

Y. Li, R. L. Mahajan, N. Nikmanesh
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. March 1996, 118(1): 1–6.
DOI: https://doi.org/10.1115/1.2792121
Published Online: March 1, 1996
View Article
PDF
Topics: Modeling, Optimization, Printing, Solders, Design, Neural network models, Algorithms, Assembly lines, Engineering simulation, Machinery