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Journal Articles

Investigation of Strip Warpage Behavior in Wire Bonding Process

Wan-Chun Chuang, Wei-Long Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021002.
Paper No: EP-19-1067
https://doi.org/10.1115/1.4045362
Published Online: February 3, 2020
View Article titled, Investigation of Strip Warpage Behavior in Wire Bonding Process
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Topics: Strips, Temperature, Warping, Molding, Assembly lines
Journal Articles

Fatigue Prediction for Molded Wafer-Level Package During Temperature Cycling

Wan-Chun Chuang, Wei-Long Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011007.
Paper No: EP-19-1042
https://doi.org/10.1115/1.4044489
Published Online: October 10, 2019
View Article titled, Fatigue Prediction for Molded Wafer-Level Package During Temperature Cycling
Open the PDF for Fatigue Prediction for Molded Wafer-Level Package During Temperature Cycling in another window
Topics: Cycles, Fatigue life, Semiconductor wafers, Simulation models, Solders, Stress, Temperature, Creep, Assembly lines, Simulation results
Journal Articles

Fine Pitch Stencil Printing Process Modeling and Optimization

Y. Li, R. L. Mahajan, N. Nikmanesh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1996, 118(1): 1–6.
https://doi.org/10.1115/1.2792121
Published Online: March 1, 1996
View Article titled, Fine Pitch Stencil Printing Process Modeling and Optimization
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Topics: Modeling, Optimization, Printing, Solders, Design, Neural network models, Algorithms, Assembly lines, Engineering simulation, Machinery