Skip Nav Destination
Issues
December 2016
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Review Article
Flow Boiling in Microgaps for Thermal Management of High Heat Flux Microsystems
J. Electron. Packag. December 2016, 138(4): 040801.
doi: https://doi.org/10.1115/1.4034317
Topics:
Boiling
,
Flow (Dynamics)
,
Heat flux
,
Water
,
Temperature
,
Pressure
,
Heat transfer coefficients
,
Heat sinks
Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials
J. Electron. Packag. December 2016, 138(4): 040802.
doi: https://doi.org/10.1115/1.4034605
Topics:
Temperature
,
Thermal conductivity
,
Thin films
,
Transients (Dynamics)
,
Heat
,
Steady state
,
Sensors
,
Bulk solids
,
Thermoreflectance
,
Lasers
Research Papers
Optimal Shock Pulse in a Drop Test Simulation of Standardized Board for Uniform Shock Response
J. Electron. Packag. December 2016, 138(4): 041001.
doi: https://doi.org/10.1115/1.4034187
Topics:
Electrons
,
Finite element analysis
,
Lumber
,
Shock (Mechanics)
,
Simulation
,
Stress
,
Solder joints
,
Modeling
,
Symmetry (Physics)
,
Boundary-value problems
Modular Microfluidic Filters Based on Transparent Membranes
J. Electron. Packag. December 2016, 138(4): 041002.
doi: https://doi.org/10.1115/1.4034369
Topics:
Filters
,
Filtration
,
Membranes
,
Microfluidics
,
Particulate matter
,
Transparency
,
Manufacturing
,
Microparticles
Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions
J. Electron. Packag. December 2016, 138(4): 041003.
doi: https://doi.org/10.1115/1.4034454
Topics:
Adhesion
,
Deflection
,
Pressure
,
Testing
,
Polymer films
,
Copper
,
Delamination
Modeling of a Smart Heat Pump Made of Laminated Thermoelectric and Electrocaloric Materials
J. Electron. Packag. December 2016, 138(4): 041004.
doi: https://doi.org/10.1115/1.4034751
Topics:
Cooling
,
Heat
,
Heat pumps
,
Temperature
,
Insulation
,
Wave functions
Effect of Solder Joint Thickness on Intermetallic Compound Growth Rate of Cu/Sn/Cu Solder Joints During Thermal Aging
J. Electron. Packag. December 2016, 138(4): 041005.
doi: https://doi.org/10.1115/1.4034819
Topics:
Solder joints
,
Solders
,
Tin
,
Diluents
,
Intermetallic compounds
Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples
J. Electron. Packag. December 2016, 138(4): 041006.
doi: https://doi.org/10.1115/1.4034842
Topics:
Annealing
,
Intermetallic compounds
,
Solders
,
Temperature
,
Tin
,
Diffusion (Physics)
,
Carbon
,
Steel
Single- and Two-Phase Particle Image Velocimetry Characterization of Fluid Flow Within a Liquid Immersion Cooled Electronics Module
J. Electron. Packag. December 2016, 138(4): 041007.
doi: https://doi.org/10.1115/1.4034854
Topics:
Coolants
,
Electronics
,
Flow (Dynamics)
,
Fluids
,
Particulate matter
,
Design
,
Boiling
,
Fluid dynamics
,
Cooling
A Finite Difference Lattice Boltzmann Method to Simulate Multidimensional Subcontinuum Heat Conduction
J. Electron. Packag. December 2016, 138(4): 041008.
doi: https://doi.org/10.1115/1.4034856
Topics:
Diffusion (Physics)
,
Heat conduction
,
Lattice Boltzmann methods
,
Phonons
,
Silicon
,
Temperature
,
Thermal conductivity
,
Density
,
Heat
,
Equilibrium (Physics)
Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks
Thomas Brunschwiler, Jonas Zürcher, Luca Del Carro, Gerd Schlottig, Brian Burg, Severin Zimmermann, Uwe Zschenderlein, Bernhard Wunderle, Florian Schindler-Saefkow, Rahel Stässle
J. Electron. Packag. December 2016, 138(4): 041009.
doi: https://doi.org/10.1115/1.4034927
Topics:
Fillers (Materials)
,
Particulate matter
,
Cavities
,
Nanoparticles
Optimization of a Thermoelectric Cooler for Time-Varying Heat Load and Sink Temperature
J. Electron. Packag. December 2016, 138(4): 041010.
doi: https://doi.org/10.1115/1.4034861
Topics:
Heat
,
Stress
,
Temperature
,
Thermoelectric coolers
,
Thermal conductivity
,
Cycles
,
Electrical conductance
Email alerts
RSS Feeds
Correlation Study on Voiding in Underfill of Large Quantity Ball Grid Array Chip Using Machine Learning
J. Electron. Packag (March 2025)
Effect of Dispensing Type On Void Formation Using Convolutional Neural Network
J. Electron. Packag
Constant Strain-Rate Garofalo Creep Behavior of Intermediate 83Pb/10Sb/5Sn/2Ag and 91.5Sn/8.5Sb Solder Materials
J. Electron. Packag (September 2024)