Topics: Atoms , Carbon nanotubes , Chain , Displacement , Failure , Molecular dynamics simulation , Nanotubes , Simulation , Single-walled carbon nanotubes , Stress

Synthesis of Double Wall Carbon Nanotubes Using Sulfur as Catalyst

O. A. Al-Hartomy, M. A. SHAH

J. Electron. Packag. June 2011, 133(2): 020904. doi: https://doi.org/10.1115/1.4003867

Abstract

View articletitled, Synthesis of Double Wall Carbon Nanotubes Using Sulfur as Catalyst

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Topics: Carbon nanotubes , Catalysts , Chemical vapor deposition , Nanotubes , Sulfur

Oxidized Graphite Nanoplatelets as an Improved Filler for Thermally Conducting Epoxy-Matrix Composites

Xiaobo Sun, Aiping Yu, Palanisamy Ramesh, Elena Bekyarova, Mikhail E. Itkis, Robert C. Haddon

J. Electron. Packag. June 2011, 133(2): 020905. doi: https://doi.org/10.1115/1.4003988

Abstract

View articletitled, Oxidized Graphite Nanoplatelets as an Improved Filler for Thermally Conducting Epoxy-Matrix Composites

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Topics: Carbon nanotubes , Composite materials , Epoxy adhesives , Epoxy resins , Fillers (Materials) , Graphite , Oxidation , Particle size , Polymers , Thermal conductivity

A Review of Carbon Nanotube Ensembles as Flexible Electronics and Advanced Packaging Materials

Satish Kumar, Baratunde A. Cola, Roderick Jackson, Samuel Graham

J. Electron. Packag. June 2011, 133(2): 020906. doi: https://doi.org/10.1115/1.4004220

Abstract

View articletitled, A Review of Carbon Nanotube Ensembles as Flexible Electronics and Advanced Packaging Materials

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Topics: Carbon nanotubes , Electrodes

Palladium Thiolate Bonding of Carbon Nanotube Thermal Interfaces

Stephen L. Hodson, Thiruvelu Bhuvana, Baratunde A. Cola, Xianfan Xu, G. U. Kulkarni, Timothy S. Fisher

J. Electron. Packag. June 2011, 133(2): 020907. doi: https://doi.org/10.1115/1.4004094

Abstract

View articletitled, Palladium Thiolate Bonding of Carbon Nanotube Thermal Interfaces

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Topics: Carbon nanotubes , Palladium , Nanoparticles

Electrical Contact Resistance at the Carbon Nanotube/Pd and Carbon Nanotube/Al Interfaces in End-Contact by First-Principles Calculations

Feng Gao, Jianmin Qu, Matthew Yao

J. Electron. Packag. June 2011, 133(2): 020908. doi: https://doi.org/10.1115/1.4004095

Abstract

View articletitled, Electrical Contact Resistance at the Carbon Nanotube/Pd and Carbon Nanotube/Al Interfaces in End-Contact by First-Principles Calculations

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Topics: Carbon nanotubes , Contact resistance , Electrodes , Electron configuration

Research Papers

Effects of Cycling Parameters on the Thermal Fatigue Life of Mixed SnAgCu/SnPb Solder Joints

M. Meilunas, P. Borgesen

J. Electron. Packag. June 2011, 133(2): 021001. doi: https://doi.org/10.1115/1.4003863

Abstract

View articletitled, Effects of Cycling Parameters on the Thermal Fatigue Life of Mixed SnAgCu/SnPb Solder Joints

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Topics: Reliability , Solder joints , Solders , Temperature , Ball-Grid-Array packaging , Fatigue life , Manufacturing , Alloys

Thermal Transport in Self-Assembled Conductive Networks for Thermal Interface Materials

Lin Hu, William Evans, Pawel Keblinski

J. Electron. Packag. June 2011, 133(2): 021002. doi: https://doi.org/10.1115/1.4003865

Abstract

View articletitled, Thermal Transport in Self-Assembled Conductive Networks for Thermal Interface Materials

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Topics: Composite materials , Nanoparticles , Particulate matter , Simulation , Thermal conductivity , Wetting , Self-assembly , Molecular dynamics simulation

Low Temperature Solid State Gold Bonding of Si Chips to Alumina Substrates

Chu-Hsuan Sha, Chin C. Lee

J. Electron. Packag. June 2011, 133(2): 021003. doi: https://doi.org/10.1115/1.4003868

Abstract

View articletitled, Low Temperature Solid State Gold Bonding of Si Chips to Alumina Substrates

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Topics: Bonding , Silicon chips , Pressure , Shear (Mechanics) , Silicon , Thermal expansion , Low temperature , Temperature

Influence of Intermetallic Characteristics on the Solder Joint Strength of Halogen-Free Printed Circuit Board Assembly

Hung-Jen Chang, Jung-Hua Chou, Tao-Chih Chang, Chau-Jie Zhan, Min-Hsiung Hon, Chi-Shiung Hsi

J. Electron. Packag. June 2011, 133(2): 021004. doi: https://doi.org/10.1115/1.4003989

Abstract

View articletitled, Influence of Intermetallic Characteristics on the Solder Joint Strength of Halogen-Free Printed Circuit Board Assembly

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Topics: Alloys , Ball-Grid-Array packaging , Intermetallic compounds , Lead-free solders , Solder joints , Solders , Tin , Fracture (Materials) , Finishes , Printed circuit board assemblies

Microstructure and Surface Treatment of 304 Stainless Steel for Electronic Packaging

Chu-Hsuan Sha, Chin C. Lee

J. Electron. Packag. June 2011, 133(2): 021005. doi: https://doi.org/10.1115/1.4003990

Abstract

View articletitled, Microstructure and Surface Treatment of 304 Stainless Steel for Electronic Packaging

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Topics: Electronic packaging , Stainless steel , Surface finishing , Grain boundaries , Grain size , X-ray diffraction , X-ray analysis

Simplified Thermal Model of a Stacked Ball Grid Array Package

Luigi P. M. Colombo, Alexey Petrushin, Davide Paleari

J. Electron. Packag. June 2011, 133(2): 021006. doi: https://doi.org/10.1115/1.4003991

Abstract

View articletitled, Simplified Thermal Model of a Stacked Ball Grid Array Package

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Topics: Ball-Grid-Array packages , Solders , Temperature , Thermal resistance , Ball-Grid-Array packaging , Heat , Errors , Boundary-value problems , Junctions

Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori

J. Electron. Packag. June 2011, 133(2): 021007. doi: https://doi.org/10.1115/1.4003992

Abstract

View articletitled, Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects

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Topics: Cycles , Fatigue , Fatigue cracks , Flip-chip , Flip-chip devices , Nondestructive evaluation , Solders , Synchrotron radiation , X-rays , Imaging

Conjugate Thermal Transport in Gas Flow in Long Rectangular Microchannel

Zhanyu Sun, Yogesh Jaluria

J. Electron. Packag. June 2011, 133(2): 021008. doi: https://doi.org/10.1115/1.4004218

Abstract

View articletitled, Conjugate Thermal Transport in Gas Flow in Long Rectangular Microchannel

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Topics: Bronze , Gas flow , Heat flux , Heat transfer , Microchannels , Nitrogen , Slip flow , Temperature , Thermal conductivity , Silicon nitride ceramics

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Guest Editorial

Introduction for JEP Special Issue on Carbon Nanotubes

Carbon Nanotubes

The Effects of Thermal Loading on the Mechanical Properties of Interfaces of Dissimilar Materials by Nanoindentation Simulations

Application of Carbon Nanotubes to Thermal Interface Materials

The Unravelling of Open-Ended Single Walled Carbon Nanotubes Using Molecular Dynamics Simulations

Synthesis of Double Wall Carbon Nanotubes Using Sulfur as Catalyst

Oxidized Graphite Nanoplatelets as an Improved Filler for Thermally Conducting Epoxy-Matrix Composites

A Review of Carbon Nanotube Ensembles as Flexible Electronics and Advanced Packaging Materials

Palladium Thiolate Bonding of Carbon Nanotube Thermal Interfaces

Electrical Contact Resistance at the Carbon Nanotube/Pd and Carbon Nanotube/Al Interfaces in End-Contact by First-Principles Calculations

Research Papers

Effects of Cycling Parameters on the Thermal Fatigue Life of Mixed SnAgCu/SnPb Solder Joints

Thermal Transport in Self-Assembled Conductive Networks for Thermal Interface Materials

Low Temperature Solid State Gold Bonding of Si Chips to Alumina Substrates

Influence of Intermetallic Characteristics on the Solder Joint Strength of Halogen-Free Printed Circuit Board Assembly

Microstructure and Surface Treatment of 304 Stainless Steel for Electronic Packaging

Simplified Thermal Model of a Stacked Ball Grid Array Package

Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects

Conjugate Thermal Transport in Gas Flow in Long Rectangular Microchannel

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