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Issues

Volume 126, Issue 1
March 2004
Issue Cover
ISSN 1043-7398
EISSN 1528-9044
In this Issue

Technical Papers

A Hybrid Thermal Energy Storage Device, Part 1: Design Methodology
Ning Zheng, R. A. Wirtz
J. Electron. Packag. March 2004, 126(1): 1–7. doi: https://doi.org/10.1115/1.1646419
View articletitled, A Hybrid Thermal Energy Storage Device, Part 1: Design Methodology
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Topics: Design , Engineering prototypes , Heat , Heat sinks , Latent heat , Storage , Temperature , Thermal conductivity , Thermal energy storage , Interfacial thermal resistance
A Hybrid Thermal Energy Storage Device, Part 2: Thermal Performance Figures of Merit
Ning Zheng, R. A. Wirtz
J. Electron. Packag. March 2004, 126(1): 8–13. doi: https://doi.org/10.1115/1.1646420
View articletitled, A Hybrid Thermal Energy Storage Device, Part 2: Thermal Performance Figures of Merit
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Topics: Design , Heat , Metals , Storage , Thermal energy storage , Temperature
Natural Convection and Passive Heat Rejection from Two Heat Sources Maintained at Different Temperatures on a Printed Circuit Board
Randy D. Weinstein, Amy S. Fleischer, Kimberly A. Krug
J. Electron. Packag. March 2004, 126(1): 14–21. doi: https://doi.org/10.1115/1.1635393
View articletitled, Natural Convection and Passive Heat Rejection from Two Heat Sources Maintained at Different Temperatures on a Printed Circuit Board
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Topics: Energy dissipation , Heat , Heat conduction , Natural convection , Printed circuit boards , Temperature , Copper
Simulative Analysis on Factors Influencing Solder Joint Bridging of Fine Pitch Devices
Li Ming Yu, Bang Han Sur, Kim Young Pyo, Wang Chun Qing, Zhang Lei
J. Electron. Packag. March 2004, 126(1): 22–25. doi: https://doi.org/10.1115/1.1646421
View articletitled, Simulative Analysis on Factors Influencing Solder Joint Bridging of Fine Pitch Devices
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Topics: Solder joints , Solders , Surface tension , Wetting
Engineering of Superconductive Ceramics
Anatoly E. Rokhvarger, Lubov A. Chigirinsky
J. Electron. Packag. March 2004, 126(1): 26–33. doi: https://doi.org/10.1115/1.1646423
View articletitled, Engineering of Superconductive Ceramics
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Topics: Ceramics , Nanotechnology , Silver , Wire , Adhesion , Durability , Crystals , Copper , Temperature
The Moulded Electronic Package (MEP)
David J. J. Lowrie
J. Electron. Packag. March 2004, 126(1): 34–36. doi: https://doi.org/10.1115/1.1646424
View articletitled, The Moulded Electronic Package (MEP)
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Topics: Electronic packages , Circuits
Why Gold Flash Can Be Detrimental to Long-Term Reliability
Jingsong Xie, Ming Sun, Michael Pecht, David F. Barbe
J. Electron. Packag. March 2004, 126(1): 37–40. doi: https://doi.org/10.1115/1.1646425
View articletitled, Why Gold Flash Can Be Detrimental to Long-Term Reliability
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Topics: Corrosion , Reliability , Porosity , Diffusion (Physics) , Corrosion resistance
Temperature Dependent Deformation Analysis of Ceramic Ball Grid Array Package Assembly Under Accelerated Thermal Cycling Condition
Seungmin Cho, Bongtae Han, Mem. ASME, Jinwon Joo
J. Electron. Packag. March 2004, 126(1): 41–47. doi: https://doi.org/10.1115/1.1646426
View articletitled, Temperature Dependent Deformation Analysis of Ceramic Ball Grid Array Package Assembly Under Accelerated Thermal Cycling Condition
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Topics: Ceramics , Deformation , Manufacturing , Solders , Temperature , Interferometry , Ball-Grid-Array packages , Stress , Displacement
Investigation of Flip-Chip Bonding for MEMS Applications
W. Salalha, E. Zussman, P. Z. Bar-Yoseph
J. Electron. Packag. March 2004, 126(1): 48–51. doi: https://doi.org/10.1115/1.1646427
View articletitled, Investigation of Flip-Chip Bonding for MEMS Applications
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Topics: Bonding , Finite element analysis , Flip-chip , Microelectromechanical systems , Solder joints , Solders , Shapes
Optimum Gullwing Fillet Solder Joint Under Thermomechanical Forces
L. L. Meekisho, Mem. ASME,, K. Nelson-Owusu, Mem. ASME,
J. Electron. Packag. March 2004, 126(1): 52–56. doi: https://doi.org/10.1115/1.1646429
View articletitled, Optimum Gullwing Fillet Solder Joint Under Thermomechanical Forces
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Topics: Solder joints , Solders , Stress , Surface tension , Thermomechanics , Wetting , Geometry , Shapes , Reliability , Finite element analysis
Interfacial Bond Stress Relationship for Gullwing Solder Joints
L. L. Meekisho, Mem. ASME,, K. Nelson-Owusu, Mem. ASME,
J. Electron. Packag. March 2004, 126(1): 57–59. doi: https://doi.org/10.1115/1.1646428
View articletitled, Interfacial Bond Stress Relationship for Gullwing Solder Joints
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Topics: Solder joints , Stress , Thermomechanics , Solders , Shear (Mechanics)
Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronic Components
Xiaojin Wei, Yogendra Joshi
J. Electron. Packag. March 2004, 126(1): 60–66. doi: https://doi.org/10.1115/1.1647124
View articletitled, Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronic Components
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Topics: Flow (Dynamics) , Heat sinks , Microchannels , Thermal resistance , Computer simulation , Cooling
Design of Cast Pin Fin Coldwalls for Air-Cooled Electronics Systems
B. Elliott Short,, Jr., Mem. ASME, Donald C. Price, Fellow ASME, Peter E. Raad, Mem. ASME
J. Electron. Packag. March 2004, 126(1): 67–73. doi: https://doi.org/10.1115/1.1648063
View articletitled, Design of Cast Pin Fin Coldwalls for Air-Cooled Electronics Systems
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Topics: Design , Flow (Dynamics) , Heat transfer , Pressure drop , Electronics
An Improved Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects
S. Shakya, S. M. Heinrich, P. S. Lee
J. Electron. Packag. March 2004, 126(1): 74–81. doi: https://doi.org/10.1115/1.1648058
View articletitled, An Improved Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects
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Topics: Die cutting , Displacement , Manufacturing , Shear (Mechanics) , Shear deformation , Shearing (Deformation) , Solders , Stress , Temperature
A Highly Reliable Design for a Nonmetallurgical Contact-Joint Structure Consisting of an Adhesive Film
Naotaka Tanaka, Senior Researcher, Kenya Kawano, Researcher, Hideo Miura, Chief Researcher, Yoshiyuki Kado, Engineer, Ikuo Yoshida, Senior Engineer
J. Electron. Packag. March 2004, 126(1): 82–86. doi: https://doi.org/10.1115/1.1648059
View articletitled, A Highly Reliable Design for a Nonmetallurgical Contact-Joint Structure Consisting of an Adhesive Film
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Topics: Adhesives , Deformation , Relaxation (Physics) , Reliability , Stress , Temperature , Design , Glass transition , Elasticity
Mechanical Characterization of the Heat Affected Zone of Gold Wirebonds Using Nanoindentation
Mithilesh Shah, Kaiyang Zeng, Andrew A. O. Tay
J. Electron. Packag. March 2004, 126(1): 87–93. doi: https://doi.org/10.1115/1.1648062
View articletitled, Mechanical Characterization of the Heat Affected Zone of Gold Wirebonds Using Nanoindentation
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Topics: Heat , Nanoindentation , Recrystallization , Stress , Wire , Secondary ion mass spectrometry , Temperature , Bonding , Elastic moduli , Manganese (Metal)
Research of Underfill Delamination in Flip Chip by the J-Integral Method
Bulu Xu, Xia Cai, Weidong Huang, Zhaonian Cheng
J. Electron. Packag. March 2004, 126(1): 94–99. doi: https://doi.org/10.1115/1.1648061
View articletitled, Research of Underfill Delamination in Flip Chip by the <em>J</em>-Integral Method
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Topics: Delamination , Finite element analysis , Flip-chip , Flip-chip assemblies , Fracture (Materials) , Simulation , Fracture mechanics , Flip-chip devices , Crack propagation , Cycles
Failure Analysis of Miniature Solder Specimen
Y. Wei, C. L. Chow, H. E. Fang, M. K. Neilsen, T. J. Lim, W. Lu
J. Electron. Packag. March 2004, 126(1): 100–105. doi: https://doi.org/10.1115/1.1648060
View articletitled, Failure Analysis of Miniature Solder Specimen
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Topics: Damage , Failure analysis , Finite element analysis , Solders , Creep , Fatigue , Constitutive equations , Nonequilibrium thermodynamics , Stress , Displacement
The Peeling Moment–A Key Rule for Delamination Resistance in I.C. Assemblies
Thomas D. Moore, Mem. ASME, John L. Jarvis
J. Electron. Packag. March 2004, 126(1): 106–109. doi: https://doi.org/10.1115/1.1649240
View articletitled, The Peeling Moment–A Key Rule for Delamination Resistance in I.C. Assemblies
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Topics: Delamination , Stress , Temperature , Design
Effects of Wafer Thinning Condition on the Roughness, Morphology and Fracture Strength of Silicon Die
Neil McLellan, Nelson Fan, Shilai Liu, Kim Lau, Jingshen Wu
J. Electron. Packag. March 2004, 126(1): 110–114. doi: https://doi.org/10.1115/1.1647123
View articletitled, Effects of Wafer Thinning Condition on the Roughness, Morphology and Fracture Strength of Silicon Die
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Topics: Fracture toughness , Grinding , Semiconductor wafers , Surface roughness , Polishing , Plasma etching
A Note on Suhir’s Solution of Thermal Stresses for a Die-Substrate Assembly
M. Y. Tsai, C. H. Hsu, C. N. Han
J. Electron. Packag. March 2004, 126(1): 115–119. doi: https://doi.org/10.1115/1.1648056
View articletitled, A Note on Suhir’s Solution of Thermal Stresses for a Die-Substrate Assembly
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Topics: Manufacturing , Stress , Thermal stresses , Warping , Finite element analysis , Shear (Mechanics) , Deformation
Effects of Wafer Cleaning and Annealing on Glass/Silicon Wafer Direct Bonding
Hong-Seok Min, Young-Chang Joo, Oh-Sung Song
J. Electron. Packag. March 2004, 126(1): 120–123. doi: https://doi.org/10.1115/1.1649238
View articletitled, Effects of Wafer Cleaning and Annealing on Glass/Silicon Wafer Direct Bonding
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Topics: Annealing , Bonding , Glass , Semiconductor wafers , Temperature , Surface roughness , Scanning probe microscopy
Air Flow and Heat Transfer in Fan Cooled Electronic Systems
Ronan Grimes, Mark Davies
J. Electron. Packag. March 2004, 126(1): 124–134. doi: https://doi.org/10.1115/1.1649241
View articletitled, Air Flow and Heat Transfer in Fan Cooled Electronic Systems
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Topics: Flow (Dynamics) , Heat transfer , Temperature , Air flow , Electronic systems
Analysis of Interfacial Cracking in Flip Chip Packages With Viscoplastic Solder Deformation
M. J. Heffes, H. F. Nied
J. Electron. Packag. March 2004, 126(1): 135–141. doi: https://doi.org/10.1115/1.1649242
View articletitled, Analysis of Interfacial Cracking in Flip Chip Packages With Viscoplastic Solder Deformation
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Topics: Deformation , Flip-chip , Flip-chip devices , Fracture (Materials) , Solders , Stress , Fracture (Process) , Flip-chip packages
Controlled Fracture of Nonmetallic Thin Wafers Using a Laser Thermal Shock Method
T. Elperin, G. Rudin
J. Electron. Packag. March 2004, 126(1): 142–147. doi: https://doi.org/10.1115/1.1649245
View articletitled, Controlled Fracture of Nonmetallic Thin Wafers Using a Laser Thermal Shock Method
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Topics: Fracture (Materials) , Laser beams , Lasers , Microcracks , Semiconductor wafers , Thermal shock , Thermal stresses , Temperature
Time Integration Algorithm for a Cyclic Damage Coupled Thermo-Viscoplasticity Model for 63Sn-37Pb Solder Applications
Xianjie Yang, C. L. Chow, K. J. Lau
J. Electron. Packag. March 2004, 126(1): 148–158. doi: https://doi.org/10.1115/1.1649246
View articletitled, Time Integration Algorithm for a Cyclic Damage Coupled Thermo-Viscoplasticity Model for 63Sn-37Pb Solder Applications
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Topics: Algorithms , Computer simulation , Constitutive equations , Damage , Hardening , Shear (Mechanics) , Solders , Stress , Viscoplasticity , Finite element analysis
Transient Convective Heat Transfer of Air Jet Impinging Onto a Confined Ceramic-Based MCM Disk
Li-Kang Liu, Graduate Student, Wen-Shien Su, Graduate Student, Ying-Huei Hung, Professor, Fellow ASME
J. Electron. Packag. March 2004, 126(1): 159–172. doi: https://doi.org/10.1115/1.1649239
View articletitled, Transient Convective Heat Transfer of Air Jet Impinging Onto a Confined Ceramic-Based MCM Disk
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Topics: Disks , Heat transfer , Transients (Dynamics) , Steady state , Convection , Ceramics , Reynolds number

Technical Brief

CAPP for Electronics Manufacturing Case Study: Fine Pitch SMT Laser Soldering
Ismail Fidan
J. Electron. Packag. March 2004, 126(1): 173–176. doi: https://doi.org/10.1115/1.1646422
View articletitled, CAPP for Electronics Manufacturing Case Study: Fine Pitch SMT Laser Soldering
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Topics: Electronics , Lasers , Manufacturing , Printed circuit board assemblies , Reliability , Soldering , Solders , Computer-aided engineering , Production planning , Solder joints
All Issues
High Gain Compact Antenna-in-Package Solution Using Like Mushroom Electromagnetic Band Gap for Industrial, Scientific, and Medical Band
J. Electron. Packag (March 2025)
Correlation Study on Voiding in Underfill of Large Quantity Ball Grid Array Chip Using Machine Learning
J. Electron. Packag (March 2025)
A Kriging Surrogate Model for Ball Grid Array Electronic Packaging with Stochastic Material and Geometrical Parameters
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Effect of Dispensing Type On Void Formation Using Convolutional Neural Network
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Constant Strain-Rate Garofalo Creep Behavior of Intermediate 83Pb/10Sb/5Sn/2Ag and 91.5Sn/8.5Sb Solder Materials
J. Electron. Packag (September 2024)
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