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Issues
December 1996
ISSN 1043-7398
EISSN 1528-9044
In this Issue
In Memoriam
Dr. Peter Engel — In Memoriam
J. Electron. Packag. December 1996, 118(4): i–ii.
doi: https://doi.org/10.1115/1.2792165
Technical Papers
Life Prediction of Solder Joints by Damage and Fracture Mechanics
J. Electron. Packag. December 1996, 118(4): 193–200.
doi: https://doi.org/10.1115/1.2792152
Topics:
Damage
,
Fracture mechanics
,
Solder joints
,
Fracture (Materials)
,
Damage mechanics
,
Fatigue life
,
Computers
,
Fatigue
,
Finite element methods
,
Anisotropy
Analysis and Modeling of Lead Coplanarity Distributions
J. Electron. Packag. December 1996, 118(4): 201–205.
doi: https://doi.org/10.1115/1.2792153
Topics:
Circuits
,
Manufacturing
,
Modeling
,
Reliability
,
Soldering
,
Statistical distributions
,
Surface mount packaging
An Interfacial Delamination Analysis for Multichip Module Thin Film Interconnects
J. Electron. Packag. December 1996, 118(4): 206–213.
doi: https://doi.org/10.1115/1.2792154
Topics:
Delamination
,
Multi-chip modules
,
Thin films
,
Stress
,
Finite element analysis
,
Fracture (Materials)
,
Polymers
,
Relaxation (Physics)
,
Reliability
Ball Grid Array Thermomechanical Response During Reflow Assembly
J. Electron. Packag. December 1996, 118(4): 214–222.
doi: https://doi.org/10.1115/1.2792155
Experimental Investigation of the Formation of Surface Mount Solder Joints
J. Electron. Packag. December 1996, 118(4): 223–228.
doi: https://doi.org/10.1115/1.2792156
Topics:
Solder joints
,
Surface mount packaging
,
Solders
,
Computers
,
Manufacturing
,
Microscopy
,
Process design
,
Reflow soldering
,
Temperature
,
Wetting
A Model Study of Thermal Stress-Induced Voiding in Electronic Packages
J. Electron. Packag. December 1996, 118(4): 229–234.
doi: https://doi.org/10.1115/1.2792157
Topics:
Electronic packages
,
Stress
,
Cavitation
,
Solids
,
Adhesives
,
Design
,
Failure mechanisms
,
Hardening
,
Hydrostatics
,
Integrated circuits
Development of an Integrated Design System for Thermal Reliability Prediction of SMT Solder Interconnects
J. Electron. Packag. December 1996, 118(4): 235–243.
doi: https://doi.org/10.1115/1.2792158
Topics:
Design
,
Reliability
,
Solders
Vibration Induced Fatigue Life Estimation of Corner Leads of Peripheral Leaded Components
J. Electron. Packag. December 1996, 118(4): 244–249.
doi: https://doi.org/10.1115/1.2792159
Calculation of Forced-Air Cooling of Electronic Modules With a Two-Fluid Model of Turbulence
J. Electron. Packag. December 1996, 118(4): 250–257.
doi: https://doi.org/10.1115/1.2792160
Topics:
Cooling
,
Fluids
,
Turbulence
,
Flow (Dynamics)
,
Density
,
Diffusion (Physics)
,
Electronic systems
,
Energy dissipation
,
Heat
,
Heat transfer
Transient Modeling of the Thermal Behavior of Outdoor Electronic Cabinets
J. Electron. Packag. December 1996, 118(4): 258–263.
doi: https://doi.org/10.1115/1.2792161
An Ultra-High Power Two-Phase Jet-Impingement Avionic Clamshell Module
J. Electron. Packag. December 1996, 118(4): 264–270.
doi: https://doi.org/10.1115/1.2792162
Topics:
Accounting
,
Boiling
,
Cooling
,
Critical heat flux
,
Databases
,
Errors
,
Flow (Dynamics)
,
Fluids
,
Heat
,
Heat transfer
Efficient Heat Transfer Approximation for the Chip-on-Substrate Problem
J. Electron. Packag. December 1996, 118(4): 271–279.
doi: https://doi.org/10.1115/1.2792163
Topics:
Approximation
,
Heat transfer
,
Cooling
,
Thermal resistance
,
Computation
,
Finite element analysis
,
Heat
Technical Brief
An Experimental Investigation of the Effects of Cycling Frequency and Temperature on the Fatigue Life of 60 Tin/40 Lead Solder
J. Electron. Packag. December 1996, 118(4): 280–284.
doi: https://doi.org/10.1115/1.2792164
Topics:
Fatigue life
,
Solders
,
Temperature
,
Fatigue
,
Cycles
,
Failure
,
Stress
,
Temperature effects
,
Testing
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