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Issues
December 1992
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Research Papers
Nonlinear Dynamic Response of a Printed Circuit Board to Shock Loads Applied to Its Support Contour
J. Electron. Packag. December 1992, 114(4): 368–377.
doi: https://doi.org/10.1115/1.2905467
Topics:
Dynamic response
,
Printed circuit boards
,
Shock (Mechanics)
,
Stress
,
Deflection
,
Dimensions
,
Electronic components
,
Membranes
Comparison of Modeling Techniques for the Vibration Analysis of Printed Circuit Cards
J. Electron. Packag. December 1992, 114(4): 378–383.
doi: https://doi.org/10.1115/1.2905468
Topics:
Circuits
,
Modeling
,
Vibration analysis
,
Reliability
,
Mode shapes
,
Copper
,
Dynamic response
,
Electronic packages
,
Electronics
,
Epoxy adhesives
Microelectronics and the Built-Up-Bar Theory
J. Electron. Packag. December 1992, 114(4): 384–388.
doi: https://doi.org/10.1115/1.2905469
Topics:
Microelectronic devices
,
Stress
Interlaminar Stresses in Layered Beams
J. Electron. Packag. December 1992, 114(4): 389–396.
doi: https://doi.org/10.1115/1.2905470
Topics:
Stress
,
Shear (Mechanics)
Modeling Thermal Stresses in Periodic Structures: Some Observations Regarding the Boundary Conditions
J. Electron. Packag. December 1992, 114(4): 397–402.
doi: https://doi.org/10.1115/1.2905471
Topics:
Boundary-value problems
,
Modeling
,
Periodic structures
,
Thermal stresses
,
Electronics
The Distribution of the Stress Intensity Factor Along the Front of the Growing Crack in an Optical Glass Fiber
J. Electron. Packag. December 1992, 114(4): 403–406.
doi: https://doi.org/10.1115/1.2905472
Topics:
Fibers
,
Fracture (Materials)
,
Optical glass
,
Stress
,
Boundary element methods
,
Geometry
,
Optical fiber
A New Method for Measuring Adhesion Strength of IC Molding Compounds
J. Electron. Packag. December 1992, 114(4): 407–412.
doi: https://doi.org/10.1115/1.2905473
Topics:
Adhesion
,
Molding
,
Stress
,
Alloys
,
Design
,
Dimensions
,
Evaluation methods
,
Fracture (Materials)
,
Stress analysis (Engineering)
,
Structural design
PCB Trace Thermal Analysis and Effective Conductivity
J. Electron. Packag. December 1992, 114(4): 413–419.
doi: https://doi.org/10.1115/1.2905474
Effects of Channel Height and Planar Spacing on Air Cooling of Electronic Components
J. Electron. Packag. December 1992, 114(4): 420–424.
doi: https://doi.org/10.1115/1.2905475
Topics:
Cooling
,
Electronic components
,
Temperature
,
Aluminum
,
Ceramics
,
Forced convection
,
Heat transfer coefficients
,
Heating
,
Reynolds number
,
Shapes
Two-Level Nonlinear Mixed Discrete-Continuous Optimization-Based Design: An Application to Printed Circuit Board Assemblies
J. Electron. Packag. December 1992, 114(4): 425–435.
doi: https://doi.org/10.1115/1.2905476
Topics:
Design
,
Optimization
,
Printed circuit board assemblies
,
Algorithms
,
Flow (Dynamics)
,
Lumber
,
Manufacturing
,
Printed circuit boards
,
Reliability
On the Use of Micro Heat Pipes as an Integral Part of Semiconductor Devices
J. Electron. Packag. December 1992, 114(4): 436–442.
doi: https://doi.org/10.1115/1.2905477
Topics:
Heat pipes
,
Semiconductor devices
,
Computer simulation
,
Heat
,
Temperature
,
Temperature gradient
,
Density
,
Flat heat pipes
,
Flux (Metallurgy)
,
Heat flux
Low Temperature Transient Liquid Phase (LTTLP) Bonding for Au/Cu and Cu/Cu Interconnections
J. Electron. Packag. December 1992, 114(4): 443–447.
doi: https://doi.org/10.1115/1.2905478
Topics:
Bonding
,
Low temperature
,
Transients (Dynamics)
,
Temperature
,
Tin
,
Copper
,
Fatigue
,
Solders
,
Aluminum
,
Diffusion bonding (Metals)
Time-Dependent Ductility of Electro-Deposited Copper
J. Electron. Packag. December 1992, 114(4): 448–454.
doi: https://doi.org/10.1115/1.2905479
Topics:
Copper
,
Ductility
,
Temperature
,
Annealing
,
Current density
,
Dislocation density
,
Electrodes
,
Electrons
,
Film thickness
,
Grain size
Application of Linear Assignment Model for Planning of Robotic Printed Circuit Board Assembly
J. Electron. Packag. December 1992, 114(4): 455–460.
doi: https://doi.org/10.1115/1.2905480
A Shape Optimal Design Methodology for Packaging Design
J. Electron. Packag. December 1992, 114(4): 461–466.
doi: https://doi.org/10.1115/1.2905481
Technical Briefs
Predicted Residual Bow of Thin Plastic Packages of Integrated Circuit Devices
J. Electron. Packag. December 1992, 114(4): 467–470.
doi: https://doi.org/10.1115/1.2905482
A Note on the Implementation of Temperature Dependent Coefficient of Thermal Expansion (CTE) in ABAQUS
J. Electron. Packag. December 1992, 114(4): 470–472.
doi: https://doi.org/10.1115/1.2905483
Predicting Thermal Fatigue Lifetimes for SMT Solder Joints
J. Electron. Packag. December 1992, 114(4): 472–476.
doi: https://doi.org/10.1115/1.2905484
Topics:
Fatigue
,
Solder joints
,
Creep
,
Finite element model
,
Stress
,
Temperature
Quantitative Solder Wetting Measurement for DCA Assembly
J. Electron. Packag. December 1992, 114(4): 476–479.
doi: https://doi.org/10.1115/1.2905485
Topics:
Manufacturing
,
Solders
,
Wetting
,
Alloys
,
Experimental design
,
Nitrogen
Book Reviews
Handbook of Tape Automated Bonding
J. Electron. Packag. December 1992, 114(4): 480.
doi: https://doi.org/10.1115/1.2905486
Topics:
Bonding
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