Abstract
Widespread millimeter wave applications have promoted rapid development of system in package (SiP) and antenna in package (AiP). Most AiP structures take the form of flip chip onto antenna substrate, where signal interconnect losses are introduced by solder bumps. The integration may be unavailable for chips with fine pad pitches. Fan-out wafer level package (FOWLP) with antenna patterning on redistributed layers (RDL) is another method for millimeter wave AiP. In this project, a hybrid integration AiP structure is developed. The microwave monolithic integrated circuit (MMIC) chip and antenna unit are integrated with chip-first FOWLP process. Multilayer organic substrate with fine pitch RDL interconnections meets the requirements of wideband antenna design. Modified coplanar waveguide is adopted to feed 2 × 2 aperture array formed on RDL layer. Package warpage is measured using Shadow Moire techniques. The antenna forms an aperture-coupled stacked patch array with bandwidth 25% and gain 8.5dBi for 60 GHz digital communication system. The proposed approach is a convenient hybrid integration solution adopting FOWLP process for millimeter wave AiP systems.
Issue Section:
Research Papers
References
1.
Gu
,
X. X.
,
Liu
,
D. X.
,
Baks
,
C.
,
Tageman
,
O.
,
Sadhu
,
B.
,
Hallin
,
J.
,
Rexberg
,
L.
,
Parida
,
P.
,
Kwark
,
Y.
, and
Valdes-Garcia
,
A.
, 2019
, “
Development, Implementation, and Characterization of a 64-Element Dual-Polarized Phased-Array Antenna Module for 28-GHz High-Speed Data Communications
,” IEEE Trans. Microwave Theory Tech.
,
67
(7
), pp. 2975
–2984
.10.1109/TMTT.2019.29128192.
Rashidian
,
A.
,
Jafarlou
,
S.
,
Tomkins
,
A.
,
Law
,
K.
,
Tazlauanu
,
M.
, and
Hayashi
,
K.
, 2019
, “
Compact 60 GHz Phased-Array Antennas With Enhanced Radiation Properties in Flip-Chip BGA Packages
,” IEEE Trans. Antennas Propag.
,
67
(3
), pp. 1605
–1619
.10.1109/TAP.2018.28888103.
Shen
,
T. M.
,
Kao
,
T. Y. J.
,
Huang
,
T. Y.
,
Tu
,
J. X.
,
Lin
,
J. S.
, and
Wu
,
R. B.
, 2012
, “
Antenna Design of 60-GHz Micro-Radar System-in-Package for Noncontact Vital Sign Detection
,” IEEE Antenn. Wirel. Pr.
,
11
, pp. 1702
–1705
.10.1109/LAWP.2013.22399574.
Beer
,
S.
,
Gulan
,
H.
,
Rusch
,
C.
, and
Zwick
,
T.
, 2013
, “
Integrated 122-GHz Antenna on a Flexible Polyimide Substrate With Flip Chip Interconnect
,” IEEE Trans. Antennas Propag.
,
61
(4
), pp. 1564
–1572
.10.1109/TAP.2012.22322605.
Watanabe
,
A. O.
,
Lin
,
T. H.
,
Ali
,
M.
,
Wang
,
Y. T.
,
Smet
,
V.
,
Raj
,
P. M.
,
Tentzeris
,
M. M.
,
Tummala
,
R. R.
, and
Swaminathan
,
M.
, 2020
, “
Ultrathin Antenna-Integrated Glass-Based Millimeter-Wave Package With Through-Glass Vias
,” IEEE Trans. Microwave Theory Tech.
,
68
(12
), pp. 5082
–5092
.10.1109/TMTT.2020.30223576.
Moallem
,
M.
,
Crawford
,
Z.
,
Kulak
,
R.
,
Dewilde
,
M.
,
Chi
,
C.
,
Lin
,
A.
, and
Ginsburg
,
B.
, 2020
, “
High Performance mm-Wave MIMO Radar With Integrated Antenna-on-Package
,” Proceeding of 70th IEEE Electronic Components Technology Conference
, Orlando, FL, June 3–30, pp. 108
–113
.10.1109/ECTC32862.2020.000307.
Wang
,
C. T.
,
Tang
,
T. C.
,
Lin
,
C. W.
,
Hsu
,
C. W.
,
Hsieh
,
J. S.
,
Tsai
,
C. H.
,
Wu
,
K. C.
,
Pu
,
H. P.
, and
Yu
,
D. C. H.
, 2018
, “
InFO_AiP Technology for High Performance and Compact 5G Millimeter Wave System Integration
,” Proceedings 68th IEEE Electronic Components and Technology Conference
, San Diego, CA, May 29–June 1, pp. 202
–207
.10.1109/ECTC.2018.000398.
Tong
,
Z. Q.
,
Fischer
,
A.
,
Stelzer
,
A.
, and
Maurer
,
L.
, 2013
, “
Radiation Performance Enhancement of E-Band Antenna in Package
,” IEEE Trans. Compon. Packag. Manuf. Technol.
,
3
(11
), pp. 1953
–1959
.10.1109/TCPMT.2013.22720399.
Hsieh
,
S. C.
,
Chu
,
F. C.
,
Ho
,
C. Y.
, and
Wang
,
C. C.
, 2019
, “
Advanced Thin-Profile Fan-Out With Beamforming Verification for 5G Wideband Antenna
,” Proceedings of 69th IEEE Electronic Components Technology Conference
, Las Vegas, NV, May 28–31, pp. 977
–982
.10.1109/ECTC.2019.0015310.
Topak
,
E.
,
Choi
,
J. Y.
,
Merkle
,
T.
,
Koch
,
S.
,
Saito
,
S.
,
Landesberger
,
C.
,
Faul
,
R.
, and
Bock
,
K.
, 2013
, “
Broadband Interconnect Design for Silicon-Based System-in-Package Applications Up to 170 GHz
,” EuMC: European Microwave Conference
, Nuremberg, Germany, Oct. 7–10, pp. 116
–119
.10.23919/EuMC.2013.668660411.
Watanabe
,
A. O.
,
Ali
,
M.
,
Zhang
,
R.
,
Ravichandran
,
S.
,
Kakutani
,
T.
,
Raj
,
P. M.
,
Tummala
,
R. R.
, and
Swaminathan
,
M.
, 2020
, “
Glass-Based IC-Embedded Antenna-Integrated Packages for 28-GHz High-Speed Data Communications
,” Proceedings of 70th IEEE Electronic Components Technology Conference
, Orlando, FL, June 3–30, pp. 89
–94
.10.1109/ECTC32862.2020.0002712.
Dasgupta
,
A.
,
Alam
,
A.
,
Ouyang
,
G. Q.
,
Jangam
,
S. C.
, and
Iyer
,
S. S.
, 2020
, “
Antenna on Silicon Interconnect Fabric
,” Proceedings of 70th IEEE Electronic Components Technology Conference
, Orlando, FL, June 3–30, pp. 1788
–1794
.10.1109/ECTC32862.2020.0027913.
Beck
,
C.
,
Ng
,
H. J.
,
Agethen
,
R.
,
PourMousavi
,
M.
,
Forstner
,
H. P.
,
Wojnowski
,
M.
,
Pressel
,
K.
,
Weigel
,
R.
,
Hagelauer
,
A.
, and
Kissinger
,
D.
, 2016
, “
Industrial mmWave Radar Sensor in Embedded Wafer-Level BGA Packaging Technology
,” IEEE Sens. J.
,
16
(17
), pp. 6566
–6578
.10.1109/JSEN.2016.258773114.
Nasr
,
I.
,
Jungmaier
,
R.
,
Baheti
,
A.
,
Noppeney
,
D.
,
Bal
,
J. S.
,
Wojnowski
,
M.
,
Karagozler
,
E.
,
Raja
,
H.
,
Lien
,
J.
,
Poupyrev
,
I.
, and
Trotta
,
S.
, 2016
, “
A Highly Integrated 60 GHz 6-Channel Transceiver With Antenna in Package for Smart Sensing and Short-Range Communications
,” IEEE J. Solid-State Circuits
,
51
(9
), pp. 2066
–2076
.10.1109/JSSC.2016.258562115.
Duan
,
Z. M.
,
Wu
,
B.
,
Zhu
,
C. M.
,
Wang
,
Y.
,
Jin
,
W. W.
,
Liu
,
Y.
,
Wu
,
Y. H.
,
Zhang
,
T.
,
Liu
,
M.
,
Dou
,
B. F.
,
Liao
,
B. B.
,
Lv
,
W.
,
Pan
,
D. F.
,
Li
,
Y. J.
,
Wang
,
C. W.
,
Dai
,
Y. F.
,
Li
,
P.
, and
Gao
,
H.
, 2021
, “
A 76-to-81 GHz 2 × 8 FMCW MIMO Radar Transceiver With Fast Chirp Generation and Multi-Feed Antenna-in-Package Array
,” Digest of Technical Papers IEEE International Solid State Circuits Conference
, San Francisco, CA, Feb. 13–22, pp. 228
–230
.https://research.tue.nl/en/publications/a-76-to-81ghz-28-fmcw-mimo-radar-transceiver-with-fastchirp-gene16.
Yu
,
D. C. H.
, 2017
, “
Advanced Packaging With Greater Simplicity
,” Technical Digest International Electron Devices Meeting (IEDM
), San Francisco, CA, Dec. 2–6, pp. 3.6.1
–3.6.4
.10.1109/IEDM.2017.826832117.
Chun
,
S. R.
,
Kuo
,
T. H.
,
Tsai
,
H. Y.
,
Liu
,
C. S.
,
Wang
,
C. T.
,
Hsieh
,
J. S.
,
Lin
,
T. S.
,
Ku
,
T.
, and
Yu
,
D.
, 2020
, “
InFO_SoW (System-on-Wafer) for High Performance Computing
,” Proceedings 70th IEEE Electronic Components Technology Conference
, Orlando, FL, June 3–30, pp. 1
–6
.10.1109/ECTC32862.2020.0001318.
Croq
,
F.
, and
Pozar
,
D. M.
, 1991
, “
Millimeter-Wave Design of Wide-Band Aperture-Coupled Stacked Microstrip Antennas
,” IEEE Trans. Antennas Propag.
,
39
(12
), pp. 1770
–1776
.10.1109/8.12159919.
Pei
,
X. F.
, 2014
, “
Warpage of BGA Product and Test Process Optimization
,” M.S. thesis
,
School of Microelectronics and Solid-state Electronics
,
UESTC, Chen Du, China
.10.1109/ICEPT.2008.460695120.
Lu
,
Y. W.
,
Fang
,
B. S.
,
Mi
,
H. H.
, and
Chen
,
K. T.
, 2018
, “
Mm-Wave Antenna in Package (AiP) Design Applied to 5th Generation (5G) Cellular User Equipment Using Unbalanced Substrate
,” Proceeding of 68th IEEE Electronic Components Technology Conference
, San Diego, CA, May 29–June 1, pp. 208
–213
.10.1109/ECTC.2018.00040Copyright © 2022 by ASME
You do not currently have access to this content.
