One of the key challenges in the thermal management of electronic packages are interfaces, such as those between the chip and heat spreader and the interface between a heat spreader and heat sink or cold plate. Typically, thermal interfaces are filled with materials such as thermal adhesives and greases. Interface materials reduce the contact resistance between the mating heat generating and heat sinking units by filling voids and grooves created by the nonsmooth surface topography of the mating surfaces, thus improving surface contact and the conduction of heat across the interface. However, micron and submicron voids and delaminations still exist at the interface between the interface material and the surfaces of the heat spreader and semiconductor device. In addition, a thermal interface material (TIM) may form a filler-depleted and resin-rich region at the interfaces. These defects, though at a small length scale, can significantly deteriorate the heat dissipation ability of a system consisting of a TIM between a heat generating surface and a heat dissipating surface. The characterization of a freestanding sample of TIM does not provide a complete understanding of its heat transfer, mechanical, and interfacial behavior. However, system-level characterization of a TIM system, which includes its freestanding behavior and its interfacial behavior, provides a more accurate understanding. While, measurement of system-level thermal resistance provides an accurate representation of the system performance of a TIM, it does not provide information regarding the physical behavior of the TIM at the interfaces. This knowledge is valuable in engineering interface materials and in developing assembly process parameters for enhanced system-level thermal performance. Characterization of an interface material between a silicon device and a metal heat spreader can be accomplished via several techniques. In this research, high-magnification radiography with computed tomography, acoustic microscopy, and scanning electron microscopy were used to characterize various TIM systems. The results of these characterization studies are presented in this paper. System-level thermal performance results are compared to physical characterization results.
Skip Nav Destination
Article navigation
June 2006
Research Papers
Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material Systems
David Esler,
David Esler
GE Global Research
, One Research Circle, Niskayuna, NY 12309
Search for other works by this author on:
Sandeep Tonapi,
Sandeep Tonapi
GE Global Research
, One Research Circle, Niskayuna, NY 12309
Search for other works by this author on:
Annita Zhong,
Annita Zhong
GE Global Research
, One Research Circle, Niskayuna, NY 12309
Search for other works by this author on:
K. Srihari,
K. Srihari
Electronics Manufacturing and Research Services
, Department of Systems Science and Industrial Engineering, State University of New York at Binghamton, P.O. 6000, Binghamton, NY 13902
Search for other works by this author on:
Florian Schattenmann
Florian Schattenmann
GE Global Research
, One Research Circle, Niskayuna, NY 12309
Search for other works by this author on:
Arun Gowda
David Esler
GE Global Research
, One Research Circle, Niskayuna, NY 12309
Sandeep Tonapi
GE Global Research
, One Research Circle, Niskayuna, NY 12309
Annita Zhong
GE Global Research
, One Research Circle, Niskayuna, NY 12309
K. Srihari
Electronics Manufacturing and Research Services
, Department of Systems Science and Industrial Engineering, State University of New York at Binghamton, P.O. 6000, Binghamton, NY 13902
Florian Schattenmann
GE Global Research
, One Research Circle, Niskayuna, NY 12309J. Electron. Packag. Jun 2006, 128(2): 130-136 (7 pages)
Published Online: February 14, 2006
Article history
Received:
January 21, 2005
Revised:
February 14, 2006
Citation
Gowda, A., Esler, D., Tonapi, S., Zhong, A., Srihari, K., and Schattenmann, F. (February 14, 2006). "Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material Systems." ASME. J. Electron. Packag. June 2006; 128(2): 130–136. https://doi.org/10.1115/1.2188952
Download citation file:
Get Email Alerts
Related Articles
Thermal Interfacing Techniques for Electronic Equipment—A Perspective
J. Electron. Packag (June,2003)
Models of Steady Heat Conduction in Multiple Cylindrical Domains
J. Electron. Packag (March,2006)
A Numerical Study of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package
J. Electron. Packag (June,2000)
Related Proceedings Papers
Related Chapters
Surface Analysis and Tools
Tribology of Mechanical Systems: A Guide to Present and Future Technologies
When Is a Heat Sink Not a Heat Sink?
Hot Air Rises and Heat Sinks: Everything You Know about Cooling Electronics Is Wrong
Utilizing Waste Materials as a Source of Alternative Energy: Benefits and Challenges
Energy and Power Generation Handbook: Established and Emerging Technologies