We have demonstrated the self-alignment processes using surface tension of the resin material for the self-assembly systems. It has been known that the surface tension of the resin material is too low to achieve the self-alignment capability. This paper presents a fundamental concept and principles of resin self-alignment processes. The numerical analysis is conducted to enhance understandings of resin self-alignment behavior and the relationship between process-related parameters. It was proved that resin self-alignment is different from the oscillatory motion of solder self-alignment and shows overdamped motion by the experiment. We could achieve the precise alignment of less than 0.4 μm.

Keywords:
resins, self-assembly, joining processes, surface tension, electronics packaging, numerical analysis, wetting
Topics:
Resins, Surface tension, Self-assembly
1.
Romig, Jr
,
A. D.
,
Dugger
,
M. T.
, and
McWhorter
,
P. J.
,
2003
, “
Materials Issues in Microelectromechanical Devices: Science, Engineering, Manufacturability and Reliability
,”
Acta Mater.
,
51
, pp.
5837
–
5866
.
2.
Oh
,
K. W.
,
Ahn
,
C. H.
, and
Roenker
,
K. P.
,
1999
, “
Flip-Chip Packaging Using Micro-machined Conductive Polymer Bumps and Alignment Pedestals for MOEMS
,”
IEEE J. Sel. Top. Quantum Electron.
,
5
(
1
), pp.
119
–
126
.
3.
Prather
,
D. W.
,
Venkataraman
,
S.
,
Lecompte
,
M.
,
Kiamilev
,
F.
,
Mait
,
J. N.
, and
Simonis
,
G. J.
,
2001
, “
Optoelectronic Multichip Module Integration for Chip Level Optical Interconnects
,”
IEEE Photonics Technol. Lett.
,
13
(
10
), pp.
1112
–
1114
.
4.
Holm
,
J.
,
A˚hlfeldt
,
H.
,
Svensson
,
M.
, and
Vieider
,
C.
,
2000
, “
Through-Etched Silicon Carriers for Passive Alignment of Optical Fibers to Surface-Active Optoelectronic Components
,”
Sens. Actuators, A
,
82
(
1-3
), pp.
245
–
248
.
5.
Linderman
,
R. J.
, and
Bright
,
V. M.
,
2001
, “
Nanometer Precision Positioning Robots Utilizing Optimized Scratch Drive Actuators
,”
Sens. Actuators, A
,
91
(
3
), pp.
292
–
300
.
6.
Srinivasan
,
U.
,
Liepmann
,
D.
, and
Howe
,
R. T.
,
2001
, “
Microstructure to Substrate Self-Assembly Using Capillary Forces
,”
J. Microelectromech. Syst.
,
10
(
1
), pp.
17
–
24
.
7.
Martin
,
B. R.
,
Furnange
,
D. C.
,
Jackson
,
T. N.
,
Mallouk
,
T. E.
, and
Mayer
,
T. S.
,
2001
, “
Self-Alignment of Patterned Wafers Using Capillary Forces at a Water-Air Interface
,”
Adv. Funct. Mater.
,
11
(
5
), pp.
381
–
386
.
8.
Sato
,
K.
,
Ito
,
K.
,
Hata
,
S.
, and
Shimokohbe
,
A.
,
2003
, “
Self-Alignment of Microparts Using Liquid Surface Tension-Behavior of Micropart and Alignment Characteristics
,”
Precis. Eng.
,
27
(
1
), pp.
42
–
50
.
9.
Wale
,
M. J.
, and
Edge
,
C.
,
1990
, “
Self-Aligned Flip-Chip Assembly of Photonic Devices with Electrical and Optical Connections
,”
IEEE Trans. Compon., Hybrids, Manuf. Technol.
,
13
(
4
), pp.
780
–
786
.
10.
Haugsjaa
,
P. O.
,
1997
, “
Passive Alignment for Optoelectronic Components
,”
Adv. Electron. Packag. ASME, EEP-Vol.
,
19-1
, pp.
753
–
758
.
11.
Miller
,
L. F.
,
1969
, “
Controlled Collapse Reflow Chip Joining
,”
IBM J. Res. Dev.
,
13
, pp.
239
–
250
.
12.
Park
,
C. B.
,
Hong
,
S. M.
,
Jung
,
J. P.
,
Kang
,
C. S.
, and
Shin
,
Y. E.
,
2001
, “
A Study on the Fluxless Soldering of Si-Wafer/Glass Substrate Using Sn-3.5mass%Ag and Sn-37mass%Pb Solder
,”
Mater. Trans., JIM
,
42
(
5
), pp.
820
–
824
.
13.
Harris
,
P. G.
,
1995
, “
Conductive Adhesives: A Critical Review of Progress to Date
,”
Soldering Surf. Mount Technol.
,
20
, pp.
19
–
21
.
14.
Moon, K.-S., Wu, J., and Wong, C. P., 2001, “Study on Self-Alignment Capability of Electrically Conductive Adhesives (ECAs) for Flip-Chip Application,” International Symposium on Advanced Packaging Materials, pp. 341–346.
15.
Heinrich
,
S. M.
,
Schaefer
,
M.
,
Schroeder
,
S. A.
, and
Lee
,
P. S.
,
1996
, “
Prediction of Solder Joint Geometries in Array-Type Interconnects
,”
ASME J. Electron Packag.
,
118
(
3
), pp.
114
–
121
.
16.
Chiang
,
K.-N.
, and
Chen
,
W.-L.
,
1998
, “
Electronic Packaging Reflow Shape Prediction for the Solder Mask Defined Ball Grid Array
,”
ASME J. Electron. Packag.
,
120
(
2
), pp.
175
–
178
.
17.
Brakke, K. A., 1999, Surface Evolver Manual, Version 2.14. Mathematics Department Susquehanna Univ., Selinsgrove, PA.
18.
Veen
,
N. V.
,
1999
, “
Analytical Derivation of the Self-Alignment Motion of Flip Chip Soldered Components
,”
ASME J. Electron. Packag.
,
121
(
2
), pp.
116
–
121
.
19.
Manko, H. H., 1992, Solders and Soldering, 3rd ed., McGraw-Hill, New York, Chap. 3.
20.
Su
,
B.
,
Gershovich
,
M.
, and
Lee
,
Y. C.
,
1997
, “
Gas Flow Effects on Precision Solder Self-Alignment
,”
IEEE Trans. Compon. Packag. Manuf. Technol., Part C
,
20
(
4
), pp.
305
–
311
.
21.
Kim
,
J. M.
,
Shin
,
Y. E.
, and
Fujimoto
,
K.
,
2003
, “
Effect of Viscosity of Liquid Resin on Resin Self-Alignment Capability
,”
Mater. Sci. Forum
,
439
, pp.
12
–
17
.
22.
Landry
,
M.
,
Patra
,
S. K.
, and
Lee
,
Y. C.
,
1991
, “
Experiment and Modeling of the Self-Alignment Mechanism in Flip-Chip Soldering
,”
Manufac. Processes and Materials Challenges in Microelec. Packag. ASME, AMD-Vol., 131/EEP-Vol.
,
1
, pp.
49
–
56
.
23.
Rao, S. S., 1995, Mechanical Vibrations, 3rd ed., Addison-Wesley, New York, Chap. 2.
Copyright © 2005
 by ASME
You do not currently have access to this content.