This study concerns the prediction of crack growth rate for solder joints in electronic packages under thermal cycling. The crack growth rate, which is dependent on the intrinsic solder property and the current stress state, is calculated based on the strain energy density criterion. The critical value of the strain energy density represents the intrinsic property of the solder. The comparison of the crack growth predictions with the experimental measurements demonstrates the applicability of the strain energy density criterion for the reliability life prediction of solder joints.

Issue Section:
Research Paper
Keywords:
reliability, chip scale packaging, life testing, solders, electronics packaging, cracks, stress effects, finite element analysis
Topics:
Cycles, Density, Fracture (Materials), Reliability, Solder joints, Stress, Finite element analysis, Solders, Electronic packaging
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