The stress ratio effect on the fatigue crack growth behavior of 95Pb-5Sn solder has been investigated. It is found that both and can correlate fatigue crack growth data well, which means that the crack growth behavior of the 95Pb-5Sn solder under the frequency of 10 Hz was dominantly cyclic dependent. The relationship can be expressed as: Low level of crack closure was found only in the near-threshold region. Except in this region, no crack closure was observed in the present test conditions. Both transgranular and intergranular fractures were observed on fracture surfaces: the former was dominant in most test conditions and the latter was dominant at the high stress ratio of 0.7. Striations and striation-like features were also found. Many slip bands and cavities along the grain boundary were observed on the crack wake and ahead of the crack tip in the high crack growth rate region.
Skip Nav Destination
Article navigation
September 2001
Technical Briefs
Effect of Stress Ratio on Fatigue Crack Growth in 95Pb-5Sn Solder
J. Zhao and,
J. Zhao and
Nagaoka University of Technology, Nagaoka, 940-2188, Japan
Search for other works by this author on:
Y. Mutoh,
Y. Mutoh
Nagaoka University of Technology, Nagaoka, 940-2188, Japan
Search for other works by this author on:
T. Ogawa
T. Ogawa
Aoyama Gakuin University, Setagaya, Tokyo, 157-8572, Japan
Search for other works by this author on:
J. Zhao and
Nagaoka University of Technology, Nagaoka, 940-2188, Japan
Y. Mutoh
Nagaoka University of Technology, Nagaoka, 940-2188, Japan
T. Ogawa
Aoyama Gakuin University, Setagaya, Tokyo, 157-8572, Japan
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD March 17, 1999. Associate Editor: Yi-Hsin Pao.
J. Electron. Packag. Sep 2001, 123(3): 311-315 (5 pages)
Published Online: March 17, 1999
Article history
Received:
March 17, 1999
Citation
Zhao and , J., Mutoh , Y., and Ogawa , T. (March 17, 1999). "Effect of Stress Ratio on Fatigue Crack Growth in 95Pb-5Sn Solder ." ASME. J. Electron. Packag. September 2001; 123(3): 311–315. https://doi.org/10.1115/1.1371780
Download citation file:
Get Email Alerts
Cited By
Related Articles
Near-Threshold Fatigue Crack Growth at 63Sn37Pb Solder Joints
J. Electron. Packag (December,2002)
Extending the Fatigue Life of Solder Grid Array (SGA) Electronic Packages
J. Electron. Packag (March,2003)
Validation of a General Fatigue Life Prediction Methodology for Sn–Ag–Cu Lead-Free Solder Alloy Interconnects
J. Electron. Packag (March,2008)
Notch Effect on Low Cycle Fatigue of Sn–3.5Ag Solder
J. Eng. Mater. Technol (January,2008)
Related Proceedings Papers
Related Chapters
Introductory Information
The Stress Analysis of Cracks Handbook, Third Edition
A New Formula on Fatigue Crack Propagation
International Conference on Mechanical and Electrical Technology 2009 (ICMET 2009)
Fatigue Crack Growth, Fatigue, and Stress Corrosion Crack Growth: Section XI Evaluation
Online Companion Guide to the ASME Boiler & Pressure Vessel Codes