We examine some attributes of modeling of the mechanical behavior of materials and structures in microelectronics and photonics (mainly fiber optics) engineering. The merits and shortcomings of experimental and theoretical modeling are addressed, as well as the interaction between different modeling approaches. The concepts discussed are illustrated by a brief review of the published work in the field. The review is based primarily on the author’s research conducted during his work at Bell Laboratories and reflects, to a great extent, the state-of-the-art in modeling of the mechanical behavior of “high-tech” materials and structures. “The only real voyage to discovery consists not in seeking new landscapes, but in having new eyes.” [Marcel Proust, French Writer] “The Practical value of mathematics is, in effect, a possibility to obtain, with its help, results simpler and faster.” [Andrey Kolmogorov, Russian Mathematician]

Issue Section:
Editorial Paper
Topics:
Mechanical behavior, Modeling, Mathematics, Microelectronic devices, Optical fiber, Photonics
1.
Aleck, B. J., 1949, “Thermal Stresses in a Rectangular Plate Clamped Along and Edge,” ASME Journal Of Applied Mechanics, Vol. 16.
2.
Bailey, C., Gebreamlak, S., Norman, P., 1997, “Computational Modeling of Defects in Fibre Optic Cables,” Advances in Electronic Packaging, E. Suhir et al., eds., ASME, New York.
3.
Buratynski, E. K., 1997, “Analysis of Bending and Shearing of Tri-Layer Laminations for Solder Joint Reliability,” Advances in Electronic Packaging, E. Suhir et al., eds., ASME, New York.
4.
Burchett, S. N., Neilsen, M. K., Frear, D. R., 1977, “Computational Continuum Modeling of Solder Interconnects: Applications,” Advances in Electronic Packaging, E. Suhir et al., eds., ASME, New York.
5.
Chen W. T., and Nelson, C. W., 1979, “Thermal Stresses in Bonded Joints,” IBM Journal, Research and Development, Vol. 23, No. 2.
6.
Cifuentes, A. O., 1991, “Elastoplastic Analysis of Bimaterial Beams Subjected to Thermal Loads,” ASME JOURNAL OF ELECTRONIC PACKAGING, Vol. 113, No. 4.
7.
Desai, C. S., 1997 “Disturbed State Unified Constitutive Modeling for Thermo mechanical Behavior and Computer Analysis of Chip-Substrate Systems,” Advances in Electronic Packaging, E. Suhir et al., eds., ASME New York.
8.
Eischen, J. W., Chung, C., and Kim, J. H., 1990, “Realistic Modeling of the Edge Effect Stresses in Bimaterial Elements,” ASME JOURNAL OF ELECTRONIC PACKAGING, Vol. 112, No. 1.
9.
Engel, P. A., 1990, “Structural Analysis of Circuit Card Systems Subjected to Bending,” ASME JOURNAL OF ELECTRONIC PACKAGING, Vol. 112, No. 1.
10.
Engel, P. A., 1993, Structural Analysis of Printed Circuit Board Systems, Springer Verlag, New York.
11.
Glaser, J. C., 1990, “Thermal Stresses in Compliantly Joined Materials,” ASME JOURNAL OF ELECTRONIC PACKAGING, Vol. 112, No. 1.
12.
Hall, P. M., et al., 1990, “Strains in Aluminum-Adhesive-Ceramic Trilayers,” ASME JOURNAL OF ELECTRONIC PACKAGING, Vol. 112, No. 4.
13.
Hall, P. M., and Sherry, W. M., 1986, “Materials, Structures and Mechanics of Joints for Surface-Mount Microelectronic Technology,” presented at the 3rd Int. Conf. on Electronics Interconnections Technologies, Welding Society, Fellbach, Germany.
14.
Kashiwamura, T., Shiratori, M., Yu, Q., 1997, “Structural Optimization of Electronic Components by Using Statistical Optimization Method,” Advances in Electronic Packaging, E. Suhir et al., eds., ASME, New York.
15.
Krause, J. T., Testardi, L. R., and Thurston, R. N., 1979, “Deviations From Linearity in the Dependence of Elongation upon Force for Fibers of Simple Glass Formers and of Glass Optical Lightguides,” Physics and Chemistry of Glasses, Vol. 20.
16.
Kuo, A. Y., 1990, “Thermal Stress at the Edge of a Bi-Metallic Thermostat,” ASME Journal of Applied Mechanics, Vol. 57.
17.
Lau, J. H., 1989, “A Note on the Calculation of Thermal Stresses in Electronic Packaging by Finite-Element Method,” ASME JOURNAL OF ELECTRONIC PACKAGING, Vol. 111, No. 12.
18.
Lau, J. H., ed., 1991, “Solder Joint Reliability: Theory and Applications,” Van Nostrand Reinhold, New York.
19.
Lau, J. H., 1992, “Thermoelastic Solutions for a Semi-Infinite Substrate with an Electronic Device,” ASME JOURNAL OF ELECTRONIC PACKAGING, Vol. 114, No. 3.
20.
Lau, J. H., ed., 1993, Thermal Stress and Strain in Microelectronics Packaging, Van Nostrand Reinhold, New York.
21.
Lau, J. H., ed., 1994, Handbook on Fine Pitch Surface Mount Technology, Van Nostrand Reinhold, New York.
22.
Lau, J. H., ed., 1995, Ball Grid Array Technology, McGraw-Hill, New York.
23.
Lau, J. H., ed., 1996, Flip Chip Technologies, McGraw-Hill, New York.
24.
Luryi, S., and Suhir, E., 1986, “A New Approach to the High-Quality Epitaxial Growth of Lattice—Mismatched Materials,” Applied Physics Letters, Vol. 49, No. 3.
25.
Matsuoka, S., 1992, Relaxation Phenomena in Polymers, Hanser/Oxford.
26.
Matsuoka, S., 1998, “Modeling of the Mechanical Behavior of Polymers,” Workshop Proceedings, Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices,” E. Suhir et al., eds., workshop proceedings, ASME, New York.
27.
McMullin, J. N., and Freeman, J. S., 1990, “On the Shape of a Bent Fiber,” IEEE/OSA Journal of Lightwave Technology, Vol. 8, No. 7.
28.
Mirman, B., 1992, “Interlaminar Stresses in Layered Beams,” ASME JOURNAL OF ELECTRONIC PACKAGING, Vol. 114, No. 4.
29.
Mishkevich, V., and Suhir, E., 1998, “Simplified Engineering Approach for the Evaluation of Thermally Induced Stresses in Bi-Material Microelectronic Structures,” Int. Journal of Microelectronic Packaging, Vol. 1.
30.
Morgan, H. S., 1991, “Thermal Stresses in Layered Electrical Assemblies Bonded With Solder,” ASME JOURNAL OF ELECTRONIC PACKAGING, Vol. 113, No. 4.
31.
Nagaraj, B., 1997, “Drop Impact Simulation of a Custom Pager Product,” Advances in Electronic Packaging, ASME, New York.
32.
Okamoto, K., Hosaka, T., Edahiro, T., 1981, “Stress Analysis of Optical Fibers by a Finite Element Method,” IEEE Journal of Quantum Electronics, QE17.
33.
Pan, T.-Y., and Pao, Y.-H., 1990, “Deformation of Multilayer Stacked Assemblies,” ASME JOURNAL OF ELECTRONIC PACKAGING, Vol. 112, No. 1.
34.
Pecht, M., et al., 1991, Handbook on Electronic Packaging, Marcel Dekker, New York.
35.
Pecht, M., et al., eds., 1995, Plastic Encapsulated Microelectronics, John Wiley and Sons, New York.
36.
Schen, M., Abe, H., Suhir, E., eds., 1994, Proceedings, Mechanics and Materials for Electronic Packaging: Thermal and Mechanical Behavior and Modeling, ASME, New York.
37.
Shin, D. K., and Lee, J. J., 1997, “A Study on the Mechanical Behavior of Epoxy Molding Compound and Thermal Stress Analysis in Plastic Packaging,” Advances in Electronic Packaging, E. Suhir et al., eds., Vol. 1, ASME, New York.
38.
Steinberg, D. S., 1998, Vibration Analysis of Electronic Equipment, 2nd ed., John Wiley and Sons, New York.
39.
Suhir, E., 1986a, “Calculated Thermally Induced Stresses in Adhesively Bonded and Soldered Assemblies,” Proceedings, Int. Symposium on Microelectronics, ISHM, Atlanta, Georgia.
40.
Suhir, E., 1986b, “Stresses in Bi-Metal Thermostats,” ASME Journal of Applied Mechanics, Vol. 53, No. 3.
41.
Suhir, E., 1987, “Die Attachment Design and Its Influence on the Thermally Induced Stresses in the Die and the Attachment,” Proceedings, 37th Elect. Comp. Conf., IEEE, Boston, MA.
42.
Suhir, E., 1988a, “Thermal Stress Failures in Microelectronic Components-Review and Extension,” Advances in Thermal Modeling of Electronic Components and Systems, M. A. Bar-Cohen and A. D. Kraus, eds., Hemisphere Publishing.
43.
Suhir, E., 1988b, “Effect of Initial Curvature on Low Temperature Microbending in Optical Fibers,” IEEE/OSA Journal of Lightwave Technology, Vol. 6, No. 8.
44.
Suhir, E., 1988c, “An Approximate Analysis of Stresses in Multilayer Elastic Thin Films,” ASME Journal of Applied Mechanics, Vol. 55, No. 3.
45.
Suhir, E., 1988d, “Stresses in Dual-Coated Optical Fibers,” ASME Journal of Applied Mechanics, Vol. 55, No. 10.
46.
Suhir, E., 1988e, “On a Paradoxical Phenomenon Related to Beams on Elastic Foundation: Could Compliant External Leads Reduce the Strength of a Surface Mounted Device?” ASME Journal of Applied Mechanics, Vol. 55, No. 10.
47.
Suhir, E., 1988f, “Spring Constant In the Buckling of Dual-Coated Optical Fibers,” IEEE/OSA Journal of Lightwave Technology, Vol. 6, No. 7.
48.
Suhir, E., and Lee, Y.-C., 1989, “Thermal, Mechanical, and Environmental Durability Design Methodologies,” Electronic Materials Handbook, Vol. 1, Packaging, ASM Int.
49.
Suhir, E., 1989a, “Analytical Modeling in Structural Analysis for Electronic Packaging: Its Merits, Shortcomings and Interaction With Experimental and Numerical Techniques,” ASME JOURNAL OF ELECTRONIC PACKAGING, Vol. 111, No. 2.
50.
Suhir, E., 1989b, “Interfacial Stresses in Bi-Metal Thermostats,” ASME Journal of Applied Mechanics, Vol. 56, No. 3.
51.
Suhir, E., 1989c, “Axisymmetric Elastic Deformations of a Finite Circular Cylinder with Application to Low Temperature Strains and Stresses in Solder Joints,” ASME Journal of Applied Mechanics, Vol. 56, No. 2.
52.
Suhir, E., 1989d, “Applications of an Epoxy Cap in a Flip-Chip Package Design,” ASME JOURNAL OF ELECTRONIC PACKAGING, Vol. 111, No. 1.
53.
Suhir, E., 1989e, “Calculated Interfacial Stresses in Elongated Bi-Material Plates Subjected to Bending,” ASME JOURNAL OF ELECTRONIC PACKAGING, Vol. 111, No. 4.
54.
Suhir, E., 1989f, “Twist-off Testing of Solder Joint Interconnections,” ASME JOURNAL OF ELECTRONIC PACKAGING, Vol. 111, No. 3.
55.
Suhir, E., and Segelken, J. M., 1990, “Mechanical Behavior of Flip-Chip Encapsulants,” JOURNAL OF ELECTRONIC PACKAGING, Vol. 112, No. 4.
56.
Suhir, E., and Sullivan, T. M., 1990, “Analysis of Interfacial Thermal Stresses and Adhesive Strength of Bi-Annular Cylinders,” Int. Journal of Solids and Structures, Vol. 26, No. 6.
57.
Suhir, E., and Poborets, B., 1990, “Solder Glass Attachment in Cerdip/Cerquad Packages: Thermally Induced Stresses and Mechanical Reliability,” ASME JOURNAL OF ELECTRONIC PACKAGING, Vol. 112, No. 2.
58.
Suhir, E., 1990a, “Mechanical Approach to the Evaluation of the Low Temperature Threshold of Added Transmission Losses in Single-Coated Optical Fibers,” IEEE/OSA Journal of Lightwave Technology, Vol. 8, No. 6.
59.
Suhir, E., 1990b, “Stresses in a Coated Fiber Stretched on a Capstan,” Applied Optics, Vol. 29, No. 18.
60.
Suhir, E., 1990c, “Buffering Effect of Fiber Coating and Its Influence on the Proof-Test Load in Optical Fibers,” Applied Optics, Vol. 29, No. 18.
61.
Suhir, E., 1990d, “How Long Should a Beam Specimen Be in Bending Tests?” ASME JOURNAL OF ELECTRONIC PACKAGING, Vol. 112, No. 1.
62.
Suhir, E., Juno, M., Camarata, R., and Chung, D. D. L., eds., “Mechanical Behavior of Microelectronic Materials and Structures,” Proceedings, MRS Symposia, Vol. 226, MRS, Pittsburgh, PA.
63.
Suhir, E., and Manzione, L. T., 1991, “Predicted Stresses in Wire Bonds of Plastic Packages During Transfer Moldings,” ASME Journal Electronic Packaging, Vol. 113, No. 1.
64.
Suhir, E., and Manzione, L. T., 1991b, “Mechanical Deformation of Lead Frame Assemblies in Plastic Packages During Molding,” ASME JOURNAL OF ELECTRONIC PACKAGING, Vol. 113, No. 4.
65.
Suhir, E., 1991a, Structural Analysis in Microelectronic and Fiber Optic Systems, Vol. 1, Basic Principles of Engineering Elasticity and Fundamentals of Structural Analysis, Van Nostrand Reinhold, New York.
66.
Suhir, E., 1991b, “Approximate Evaluation of the Elastic Interfacial Stresses in Thin Films with Application to High-Tc Superconducting Ceramics,” Int. Journal of Solids and Structures, Vol. 27, No. 8.
67.
Suhir, E., 1991c, “Stress Relief in Solder Joints Due to the Application of a Flex Circuit,” ASME JOURNAL OF ELECTRONIC PACKAGING, Vol. 113, No. 3.
68.
Suhir, E., 1991d, “A Plate Contactor in a Mechanical Input/Output Connector Interface: How Small Can It Be?” ASME JOURNAL OF ELECTRONIC PACKAGING, Vol. 113, No. 1.
69.
Suhir, E., and Sullivan, T. M., 1992, “Novel Technique for the Evaluation of the Adhesive Strength of the Epoxy Molding Compounds Used in Plastic Packaging,” Proceedings, 42nd Electr. Comp. and Techn. Conf., IEEE, San Diego, CA.
70.
Suhir, E., 1992a, “Mechanical Behavior and Reliability of Solder Joint Interconnections in Thermally Matched Assemblies,” Proceedings, 42nd Electr. Comp. and Techn. Conf., IEEE, San Diego, CA.
71.
Suhir, E., 1992b, “The Effect of the Nonlinear Behavior of the Material on Two-Point Bending in Optical Glass Fibers,” ASME JOURNAL OF ELECTRONIC PACKAGING, Vol. 114, No. 2.
72.
Suhir, E., 1992c, “Elastic Stability, Free Vibrations, and Bending of Optical Glass Fibers: The Effect of the Nonlinear Stress-Strain Relationship,” Applied Optics, Vol. 31, No. 24.
73.
Suhir, E., 1992d, “Free Vibrations of a Fused Biconical Taper Lightwave Coupler,” Int. Journal of Solids and Structures, Vol. 29, No. 24.
74.
Suhir, E., 1992e, “Vibration Frequency of a Fused Biconical Taper(FBT) Lightwave Coupler,” IEEE/OSA Journal of Lightwave Technology, Vol. 10, No. 7.
75.
Suhir, E., 1992f, “Response of a Flexible Printed Circuit Board to Periodic Shock Loads Applied to Its Support Contour,” ASME Journal of Applied Mechanics, Vol. 59, No. 2.
76.
Suhir, E., 1992g, “Nonlinear Dynamic Response of a Flexible Thin Plate to Constant Acceleration Applied to Its Support Contour, With Application to Printed Circuit Boards Used in Avionics Packaging,” Int. Journal of Solids and Structures, Vol. 29, No. 1.
77.
Suhir, E., 1993a, “Predicted Stresses and Strains in Fused Biconical Taper Couplers Subjected to Tension,” Applied Optics, Vol. 32, No. 18.
78.
Suhir, E., 1993b, “Predicted Bow of Plastic Packages of Integrated Circuit Devices,” in Thermal Stress and Strain in Microelectronic Packaging, J. H. Lau, ed., Van Nostrand Reinhold, New York.
79.
Suhir, E., 1993c, “Can the Curvature of an Optical Glass Fiber be Different From the Curvature of Its Coating?,” Int. Journal of Solids and Structures, Vol. 30, No. 17.
80.
Suhir, E., 1993d, “Analytical Modeling of the Interfacial Shearing Stress in Dual-Coated Optical Fiber Specimens Subjected to Tension,” Applied Optics, Vol. 32, No. 16.
81.
Suhir, E., and Burke, R., 1994, “Analysis and Optimization of the Dynamic Response of a Rectangular Plate to a Shock Load Acting on Its Support Contour, With Application to Portable Electronic Products,” IEEE CHMT Transactions, Advanced Packaging, Part B, Vol. 17, No. 3.
82.
Suhir, E., 1994a, “Thermally Induced Stresses in an Optical Glass Fiber Soldered into a Ferrule,” IEEE/OSA Journal of Lightwave Technology, Vol. 12, No. 10.
83.
Suhir, E., 1994b, “Approximate Evaluation of the Elastic Thermal Stresses in a Thin Film Fabricated on a Very Thick Circular Substrate,” ASME JOURNAL OF ELECTRONIC PACKAGING, Vol. 116, No. 3.
84.
Suhir, E., 1994c, “Pull Testing of a Glass Fiber Soldered into a Ferrule: How Long Should the Test Specimen Be?” Applied Optics, Vol. 33, No. 19.
85.
Suhir, E., 1994d, “Approximate Evaluation of the Interfacial Shearing Stress in Circular Double Lap Shear Joints, with Application to Dual-Coated Optical Fibers,” Int. Journal of Solids and Structures, Vol. 31, No. 23.
86.
Suhir, E., 1995a, “Structural Analysis in Fiber Optics,” in Trends in Lightwave Technology, J. Menon, ed., Council of Scientific Information, India.
87.
Suhir, E., 1995b, “Analysis and Optimization of the Input/Output Fiber Configuration in a Laser Package Design,” ASME JOURNAL OF ELECTRONIC PACKAGING, Vol. 117, No. 4.
88.
Suhir, E., 1995c, “How Compliant Should a Die-Attachment Be to Protect the Chip from Substrate (Card) Bowing?” ASME JOURNAL OF ELECTRONIC PACKAGING, Vol. 117, No. 1.
89.
Suhir, E., 1995d, “Shock Protection with a Nonlinear Spring,” IEEE CPMT Transactions, Advanced Packaging, Part B, Vol. 18, No. 2.
90.
Suhir, E., 1996a, “Predicted Curvature and Stresses in an Optical Fiber Interconnect Subjected to Bending,” IEEE/OSA Journal of Lightwave Technology, Vol. 14, No. 2.
91.
Suhir, E., 1996b, “Dynamic Response of a One-Degree-of-Freedom Linear System to a Shock Load During Drop Tests: Effect of Viscous Damping,” IEEE CPMT Transactions, Part A, Vol. 19, No. 3.
92.
Suhir, E., 1996c, “Shock-Excited Vibrations of a Conservative Duffing Oscillator With Application to Shock Protection in Portable Electronics,” Int. Journal of Solids and Structures, Vol. 33, No. 24.
93.
Suhir, E., Shiratori, M., Lee, Y. C., and Subbarayan, G., eds., Advances in Electronic Packaging, Vol. 1 and 2, ASME, New York.
94.
Suhir, E., 1997a, Applied Probability for Engineers and Scientists, McGraw Hill, New York.
95.
Suhir, E., 1997b, “Predicted Thermal Mismatch Stresses in a Cylindrical Bi-Material Assembly Adhesively Bonded at the Ends,” ASME Journal of Applied Mechanics, Vol. 64, No. 1.
96.
Suhir, E., 1997c, “Failure Criterion for Moisture-Sensitive Plastic Packages of Integrated Circuit(IC) Devices: Application of Von-Karman Equations with Consideration of Thermoelastic Strains,” Int. Journal of Solids and Structures, Vol. 34, No. 12.
97.
Suhir, E., 1997d, “Effect of Plastic Package Geometry on Its Propensity to Moisture Induced Failure,” Proceedings, IMAPS/NATO Workshop, Bled, Slovenia.
98.
Suhir, E., 1997e, “Probabilistic Approach to Evaluate Improvements in the Reliability of Chip-Substrate (Chip-Card) Assembly,” IEEE CPMT Transactions, Part A, Vol. 20, No. 1.
99.
Suhir, E., 1997f, “Is the Maximum Acceleration an Adequate Criterion of the Dynamic Strength of a Structural Element in an Electronic Product?” IEEE CPMT Transactions, Part A, Vol. 20, No. 4.
100.
Suhir, E., 1997g, “Bending of a Partially Coated Optical Fiber Subjected to the Ends Off-Set,” IEEE/OSA Journal of Lightwave Technology, Vol. 12, No. 2.
101.
Suhir, E., Fukuda, M., Kurkjian, C. R., eds., 1998, Reliability of Photonics Materials and Structures, Proceedings, MRS Symposia, Vol. 531.
102.
Suhir, E., Michel, B., Kishimoto, K., Lu, J., eds., 1998, Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices, Workshop Proceedings, ASME, New York.
103.
Suhir
E.
,
1998
a, “
Fiber Optic Structural Mechanics—Brief Review
,” editor’s note,
ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol.
120
, No.
3
, pp.
217
–
220
.
104.
Suhir
E.
,
1998
b, “
The Future of Microelectronics and Photonics, and the Role of Mechanics and Materials
,”
ASME JOURNAL OF ELECTRONICS PACKAGING
, editorial, Vol.
120
, No.
1
, pp.
1
–
11
.
105.
Suhir, E., 1998c, “Adhesively Bonded Assemblies with Identical Nondeformable Adherends and Nonhomogeneous Adhesive Layer: Predicted Thermal Stresses in the Adhesive,” Journal of Reinforced Plastics and Composites, Vol.16, No.14.
106.
Suhir, E., 1998d, “Coated Optical Fiber Interconnect Subjected to the Ends Off-Set and Axial Loading,” Presented at the Int. Workshop on Reliability of Polymeric Materials and Plastic Packages of IC Devices, Paris, Nov. 29 – Dec. 2, 1998, ASME, New York.
107.
Suhir, E., 1998e, “Optical Glass Fiber Bent on a Cylindrical Surface,” Proceedings, MRS Symposia, Vol. 531.
108.
Suhir, E., 1998f, “Critical Strain and Postbuckling Stress in Polymer Coated Optical Fiber Interconnect: What Could Be Gained by Using Thicker Coating?” Presented at the Int. Workshop on Reliability of Polymeric Materials and Plastic Packages of IC Devices, Paris, Nov. 29 – Dec. 2, 1998, ASME, New York.
109.
Suhir, E., 1998g, “Bending Stress in an Optical Fiber Interconnect Experiencing Significant Ends Off-Set,” Proceedings, MRS Symposia, Vol. 531.
110.
Suhir, E., 1998h, “Optical Fiber Interconnect Subjected to a Not Very Small Ends Off-Set: Effect of the Reactive Tension,” Proceedings, MRS Symposia, Vol. 531.
111.
Suhir, E., 1998i, “Adhesively Bonded Assemblies with Identical Nondeformable Adherends and ‘Piecewise Continuous’ Adhesive Layer: Predicated Thermal Stresses and Displacements in the Adhesive,” Int. Journal of Solids and Structures, in Press.
112.
Suhir, E., 1998j, “Adhesively Bonded Assemblies with Identical Nondeformable Adherends: Modeling of the Induced Thermal Stresses in the Adhesive Layer,” Composite Interfaces, in press.
113.
Suhir, E., 1999a, “Optical Fiber Interconnect Subjected to a Not-Very-Small Ends Off-Set: Effect of the Nonlinear Stress-Strain Relationship,” IEEE CPMT Transactions, in press.
114.
Suhir, E., 1999b, “Natural Vibration Frequency of a Heavy Electronic Component Mounted on a Printed Circuit Board,” IEEE CPMT Transactions, in press.
115.
Suhir, E., 1999c, “Forced Vibrations of a Heavy Electronic Component Subjected to Harmonic Excitation,” IEEE CPMT Transactions, in press.
116.
Tay, A. A. O., Seah, B. C., and Ong, S. H., 1997, “Finite Element Simulation of Wire Looping During Wirebonding,” Advances in Electronic Packaging, E. Suhir et al., eds., ASME, New York.
117.
Timoshenko, S., 1925, “Analysis of Bi-Metal Thermostats,” Journal of the Optical Society of America, Vol. 11.
118.
Tummala, R. R., and Rymashewski, E. J., 1989, Microelectronics Packaging Handbook, Van Nostrand Reinhold, New York.
119.
Volkersen, O., 1938, “Die Nietkraftverteilung in Zubeanspruchten Nietverbindungen mit konstanten Laschenquerschnitten,” Luftfahrtforschung, Vol. 15 (in German).
120.
Uschitsky, M., and Suhir, E., 1995, “Epoxy-Bonded Optical Fibers: the Effect of Voids on Stress Concentration in the Epoxy Material,” in Structural Analysis in Microelectronic and Fiber-Optic Systems, E. Suhir, ed., ASME, New York.
121.
Wu, S. X., Yeh, C. P., Wyatt, K., 1997, “A Constitutive Model of Polyimide Films and Its Integration with Finite Element Analysis for Residual Stress prediction in Thin Film Interconnects,” Advances in Electronic Packaging, E. Suhir, et al., eds., ASME, New York.
122.
Yamada, S. E., 1992, “A Bonded Joint Analysis for Surface Mount Components,” ASME JOURNAL OF ELECTRONIC PACKAGING, Vol. 114, No. 1.
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