Abstract
Power converters and semiconductor devices are spreading their application fields, due to new renewable energy and automotive frameworks. In the electrified vehicles context, the even more stringent requirements, both in terms of performances and reliability, pose new challenges in the design phase of power switches. This paper analyzes, by means of finite-element simulations, a low-voltage power semiconductor system-in-package devoted to automotive applications, which integrates a MOSFET-based half bridge and a controller. Three simulation physical domains integrated in a unique flow are considered: thermo-mechanical, electromagnetic, and thermal numerical models. The aim is to develop a new comprehensive methodology which starts with a thermo-structural simulation of the package, then computes the on-state resistance and parasitic components to assess the electrical behavior of the package. Finally, a simulation check is made to verify if the power device performances are thermally consistent with applicative conditions.
Issue Section:
Research Papers
References
1.
Morya
,
A. K.
,
Gardner
,
M. C.
,
Anvari
,
B.
,
Liu
,
L.
,
Yepes
,
A. G.
,
Doval-Gandoy
,
J.
, and
Toliyat
,
H. A.
, 2019
, “
Wide Bandgap Devices in AC Electric Drives: Opportunities and Challenges
,” IEEE Trans. Transp. Electrific.
,
5
(1
), pp. 3
–20
.10.1109/TTE.2019.28928072.
Rzepka
,
S.
,
Otto
,
A.
,
Vogel
,
D.
, and
Dudek
,
R.
, 2018
, “
Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches
,” ASME J. Electron. Packag.
,
140
(1
), p. 010903
.10.1115/1.40393333.
Consoli
,
A.
,
Gennaro
,
F.
,
Testa
,
A.
,
Consentino
,
G.
,
Frisina
,
F.
,
Letor
,
R.
, and
Magri
,
A.
, 2000
, “
Thermal Instability of Low Voltage Power-MOSFETs
,” IEEE Trans. Power Electron.
,
15
(3
), pp. 575
–581
.10.1109/63.8445184.
Castellazzi
,
A.
, and
Ciappa
,
M.
, 2007
, “
Electrothermal Characterization for Reliability of Modern Low-Voltage PowerMOSFETs
,” IEEE Trans. Device Mater. Relib.
,
7
(4
), pp. 571
–580
.10.1109/TDMR.2007.9104395.
Buttay
,
C.
,
Morel
,
H.
,
Allard
,
B.
,
Lefranc
,
P.
, and
Brevet
,
O.
, 2006
, “
Model Requirements for Simulation of Low-Voltage MOSFET in Automotive Applications
,” IEEE Trans. Power Electron.
,
21
(3
), pp. 613
–624
.10.1109/TPEL.2006.8723836.
Millan
,
J.
,
Godignon
,
P.
,
Perpina
,
X.
,
Perez-Tomas
,
A.
, and
Rebollo
,
J.
, 2014
, “
A Survey of Wide Bandgap Power Semiconductor Devices
,” IEEE Trans. Power Electron.
,
29
(5
), pp. 2155
–2163
.10.1109/TPEL.2013.22689007.
Roig
,
J.
, and
Bauwens
,
F.
, 2018
, “
Overcoming Switching Limits in Silicon Power MOSFETs With Silicon‐Based Solutions
,” IET Power Electron.
,
11
(4
), pp. 629
–637
.10.1049/iet-pel.2017.03928.
Yang
,
B.
,
Wang
,
J.
,
Xu
,
S.
,
Korec
,
J.
, and
Shen
,
Z. J.
, 2013
, “
Advanced Low-Voltage Power MOSFET Technology for Power Supply in Package Applications
,” IEEE Trans. Power Electron.
,
28
(9
), pp. 4202
–4215
.10.1109/TPEL.2012.22304079.
Armando
,
E.
,
Fusillo
,
F.
,
Musumeci
,
S.
, and
Scrimizzi
,
F.
, 2019
, “
Low Voltage Trench-Gate MOSFETs for High Efficiency Auxiliary Power Supply Applications
,” 2019 International Conference on Clean Electrical Power (ICCEP
),
Otranto, Italy
, July 2–4, pp. 165–170.10.1109/ICCEP.2019.889021710.
Armando
,
E.
,
Musumeci
,
S.
,
Fusillo
,
F.
, and
Scrimizzi
,
F.
, 2019
, “
Low Voltage Trench-Gate MOSFET Power Losses Optimization in Synchronous Buck Converter Applications
,” 2019 21st European Conference on Power Electronics and Applications (EPE'19 ECCE Europe
),
Genova, Italy
, Sept. 3–5, pp. P.1
–P.10
.10.23919/EPE.2019.891480711.
Williams
,
R. K.
,
Darwish
,
M. N.
,
Blanchard
,
R. A.
,
Siemieniec
,
R.
,
Rutter
,
P.
, and
Kawaguchi
,
Y.
, 2017
, “
The Trench Power MOSFET: Part I—History, Technology, and Prospects
,” IEEE Trans. Electron Devices
,
64
(3
), pp. 674
–691
.10.1109/TED.2017.265323912.
Williams
,
R. K.
,
Darwish
,
M. N.
,
Blanchard
,
R. A.
,
Siemieniec
,
R.
,
Rutter
,
P.
, and
Kawaguchi
,
Y.
, 2017
, “
The Trench Power MOSFET—Part II: Application Specific VDMOS, LDMOS, Packaging, and Reliability
,” IEEE Trans. Electron Devices
,
64
(3
), pp. 692
–712
.10.1109/TED.2017.265514913.
Jorgensen
,
A. B.
,
Munk-Nielsen
,
S.
, and
Uhrenfeldt
,
C.
, 2020
, “
Overview of Digital Design and Finite-Element Analysis in Modern Power Electronic Packaging
,” IEEE Trans. Power Electron.
,
35
(10
), pp. 10892
–10905
.10.1109/TPEL.2020.297858414.
Ceccarelli
,
L.
,
Kotecha
,
R. M.
,
Bahman
,
A. S.
,
Iannuzzo
,
F.
, and
Mantooth
,
H. A.
, 2019
, “
Mission-Profile-Based Lifetime Prediction for a SiC Mosfet Power Module Using a Multi-Step Condition-Mapping Simulation Strategy
,” IEEE Trans. Power Electron.
,
34
(10
), pp. 9698
–9708
.10.1109/TPEL.2019.289363615.
Russo
,
S.
,
Testa
,
A.
,
De Caro
,
S.
,
Scimone
,
T.
,
Panarello
,
S.
,
Patane
,
S.
,
Scelba
,
G.
, and
Scarcella
,
G.
, 2016
, “
Reliability Assessment of Power MOSFETs Working in Avalanche Mode Based on a Thermal Strain Direct Measurement Approach
,” IEEE Trans. Ind. Appl.
,
52
(2
), pp. 1688
–1697
.10.1109/TIA.2015.250089016.
Testa
,
A.
,
De Caro
,
S.
, and
Russo
,
S.
, 2012
, “
A Reliability Model for Power MOSFETs Working in Avalanche Mode Based on an Experimental Temperature Distribution Analysis
,” IEEE Trans. Power Electron.
,
27
(6
), pp. 3093
–3100
.10.1109/TPEL.2011.217727917.
Durand
,
C.
,
Klingler
,
M.
,
Coutellier
,
D.
, and
Naceur
,
H.
, 2016
, “
Power Cycling Reliability of Power Module: A Survey
,” IEEE Trans. Device Mater. Relib.
,
16
(1
), pp. 80
–97
.10.1109/TDMR.2016.251604418.
Magnone
,
P.
,
Barletta
,
G.
, and
Magrì
,
A.
, 2018
, “
Investigation of Degradation Mechanisms in Low-Voltage p-Channel Power MOSFETs Under High Temperature Gate Bias Stress
,” Microelectron. Reliab.
,
88–90
, pp. 438
–442
.10.1016/j.microrel.2018.06.02919.
Iannuzzo
,
F.
,
Abbate
,
C.
, and
Busatto
,
G.
, 2014
, “
Instabilities in Silicon Power Devices: A Review of Failure Mechanisms in Modern Power Devices
,” EEE Ind. Electron. Mag.
,
8
(3
), pp. 28
–39
.10.1109/MIE.2014.230575820.
Ciappa
,
M.
, 2002
, “
Selected Failure Mechanisms of Modern Power Modules
,” Microelectron. Reliab.
,
42
(4–5
), pp. 653
–667
.10.1016/S0026-2714(02)00042-221.
Susinni
,
G.
,
Rizzo
,
S. A.
, and
Iannuzzo
,
F.
, 2021
, “
Two Decades of Condition Monitoring Methods for Power Devices
,” Electronics
,
10
(6
), p. 683
.10.3390/electronics1006068322.
Rizzo
,
S. A.
,
Susinni
,
G.
, and
Iannuzzo
,
F.
, 2022
, “
Intrusiveness of Power Device Condition Monitoring Methods: Introducing Figures of Merit for Condition Monitoring
,” EEE Ind. Electron. Mag.
,
16
(1
), pp. 60
–69
.10.1109/MIE.2021.306695923.
Huang
,
Y.
,
Deng
,
H.
,
Luo
,
Y.
,
Xiao
,
F.
,
Liu
,
B.
, and
Tang
,
X.
, 2021
, “
Fatigue Mechanism of Die-Attach Joints in IGBTs Under Low-Amplitude Temperature Swings Based on 3D Electro-Thermal-Mechanical FE Simulations
,” IEEE Trans. Ind. Electron.
,
68
(4
), pp. 3033
–3043
.10.1109/TIE.2020.297756324.
Yang
,
Y.
,
Dorn-Gomba
,
L.
,
Rodriguez
,
R.
,
Mak
,
C.
, and
Emadi
,
A.
, 2020
, “
Automotive Power Module Packaging: Current Status and Future Trends
,” IEEE Access
,
8
, pp. 160126
–160144
.10.1109/ACCESS.2020.301977525.
Samavatian
,
V.
,
Iman-Eini
,
H.
,
Avenas
,
Y.
, and
Samavatian
,
M.
, 2020
, “
Effects of Creep Failure Mechanisms on Thermomechanical Reliability of Solder Joints in Power Semiconductors
,” IEEE Trans. Power Electron.
,
35
(9
), pp. 8956
–8964
.10.1109/TPEL.2020.297331226.
Darveaux
,
R.
, 2002
, “
Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction
,” ASME J. Electron. Packaging
,
124
(3
), pp. 147
–154
.10.1115/1.141376427.
Calabretta
,
M.
,
Sitta
,
A.
,
Oliveri
,
S. M.
, and
Sequenzia
,
G.
, 2021
, “
Power Semiconductor Devices and Packages: Solder Mechanical Characterization and Lifetime Prediction
,” IEEE Access
,
9
, pp. 22859
–22867
.10.1109/ACCESS.2021.305628128.
Shen
,
Y.
,
Wang
,
H.
,
Blaabjerg
,
F.
,
Zhao
,
H.
, and
Long
,
T.
, 2020
, “
Thermal Modeling and Design Optimization of PCB Vias and Pads
,” IEEE Trans. Power Electron.
,
35
(1
), pp. 882
–900
.10.1109/TPEL.2019.291502929.
Lwin
,
K. K.
,
Tubillo
,
C. E.
,
Dimaano Panumard
,
T. J.
,
Suthiwongsunthorn
,
N.
, and
Sirinorakul
,
S.
, 2016
, “
Copper Clip Package for High Performance MOSFETs and Its Optimization
,” 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC
),
Singapore,
Nov. 30–Dec. 3, pp. 123
–128
.10.1109/EPTC.2016.786145730.
Wang
,
K.
, 2017
, “
Review of State-of-the-Art Integration Technologies in Power Electronic Systems
,” CPSS TPEA
,
2
(4
), pp. 292
–305
.10.24295/CPSSTPEA.2017.0002731.
Hou
,
F.
,
Wang
,
W.
,
Cao
,
L.
,
Li
,
J.
,
Su
,
M.
,
Lin
,
T.
,
Zhang
,
G.
, and
Ferreira
,
B.
, 2020
, “
Review of Packaging Schemes for Power Module
,” IEEE J. Emerg. Sel. Top. Power Electron.
,
8
(1
), pp. 223
–238
.10.1109/JESTPE.2019.294764532.
White
,
R. V.
, 2020
, “
Packaging and Integration and the Future of Power Electronics [White Hot]
,” IEEE Power Electron. Mag.
,
7
(3
), pp. 87
–92
.10.1109/MPEL.2020.301130633.
Zhang
,
B.
, and
Wang
,
S.
, 2020
, “
A Survey of EMI Research in Power Electronics Systems With Wide-Bandgap Semiconductor Devices
,” IEEE J. Emerg. Sel. Top. Power Electron.
,
8
(1
), pp. 626
–643
.10.1109/JESTPE.2019.295373034.
Miyazaki
,
N.
,
Shishido
,
N.
, and
Hayama
,
Y.
, 2021
, “
Review of Methodologies for Structural Integrity Evaluation of Power Modules
,” ASME. J. Electron. Packag.
,
143
(2
), p. 020801
.10.1115/1.404803835.
Qin
,
F.
,
Bie
,
X.
,
An
,
T.
,
Dai
,
J.
,
Dai
,
Y.
, and
Chen
,
P.
, 2021
, “
A Lifetime Prediction Method for IGBT Modules Considering the Self-Accelerating Effect of Bond Wire Damage
,” IEEE J. Emerg. Sel. Top. Power Electron.
,
9
(2
), pp. 2271
–2284
.10.1109/JESTPE.2020.299231136.
Hanif
,
A.
,
Yu
,
Y.
,
DeVoto
,
D.
, and
Khan
,
F.
, 2019
, “
A Comprehensive Review Toward the State-of-the-Art in Failure and Lifetime Predictions of Power Electronic Devices
,” IEEE Trans. Power Electron.
,
34
(5
), pp. 4729
–4746
.10.1109/TPEL.2018.286058737.
Gopi Reddy
,
L.
,
Tolbert
,
L.
, and
Ozpineci
,
B.
, 2015
, “
Power Cycle Testing of Power Switches: A Literature Survey
,” IEEE Trans. Power Electron.
, 30(5), pp. 2465–2473.10.1109/TPEL.2014.235901538.
Motalab
,
M.
, et al., 2013
, “
Correlation of Reliability Models Including Aging Effects With Thermal Cycling Reliability Data
,” 2013 IEEE 63rd Electronic Components and Technology Conference
, Las Vegas, NV, May 28–31, pp. 986
–1004
.10.1109/ECTC.2013.657569439.
Wilde
,
J.
,
Becker
,
K.
,
Thoben
,
M.
,
Blum
,
W.
,
Jupitz
,
T.
,
Wang
,
G.
, and
Cheng
,
Z. N.
, 2000
, “
Rate Dependent Constitutive Relations Based on Anand Model for 92.5Pb5Sn2.5Ag Solder
,” IEEE Trans. Adv. Packag.
,
23
(3
), pp. 408
–414
.10.1109/6040.86155440.
Sitta
,
A.
,
Mauromicale
,
G.
,
Sequenzia
,
G.
,
Messina
,
A. A.
,
Renna
,
M.
, and
Calabretta
,
M.
, 2021
, “
Thermo-Mechanical Finite Element Simulation and Visco-Plastic Solder Fatigue for Low Voltage Discrete Package
,” 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE
),
St. Julian, Malta, Apr. 19–21, pp. 1
–6
.10.1109/EuroSimE52062.2021.941087041.
Motalab
,
M.
,
Cai
,
Z.
,
Suhling
,
J. C.
, and
Lall
,
P.
, 2012
, “
Determination of Anand Constants for SAC Solders Using Stress-Strain or Creep Data
,” 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
,
San Diego, CA
, May 30–June 1, pp. 910
–922
.10.1109/ITHERM.2012.623152242.
Sitta
,
A.
,
Russo
,
S.
,
Torrisi
,
M.
,
Messina
,
A. A.
,
D'Arrigo
,
G.
,
Sequenzia
,
G.
,
Renna
,
M.
, and
Calabretta
,
M.
, 2020
, “
An Integrated Approach to Optimize Solder Joint Reliability
,” 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE
),
Cracow, Poland, July 5–8, pp. 1
–5
.10.1109/EuroSimE48426.2020.915268843.
COMSOL, 2022, “
AC/DC Module User's Guide
,” COMSOL, accessed Dec. 13, 2022, https://doc.comsol.com/5.6/doc/com.comsol.help.acdc/ACDCModuleUsersGuide.pdf44.
Ansys
, 2021
, Ansys Q3D Extractor Help, Ansys.45.
Mauromicale
,
G.
,
Sitta
,
A.
,
Calabretta
,
M.
,
Oliveri
,
S. M.
, and
Sequenzia
,
G.
, 2021
, “
Integrated Electromagnetic-Thermal Approach to Simulate a GaN-Based Monolithic Half-Bridge for Automotive DC-DC Converter
,” Appl. Sci.
,
11
(18
), p. 8302
.10.3390/app1118830246.
Moreno
,
G.
,
Narumanchi
,
S.
,
Feng
,
X.
,
Anschel
,
P.
,
Myers
,
S.
, and
Keller
,
P.
, 2022
, “
Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions
,” ASME. J. Electron. Packag.
,
144
(1
), p. 011004
.10.1115/1.404981547.
Nafis
,
B. M.
,
Iradukunda
,
A.-C.
, and
Huitink
,
D.
, 2020
, “
System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials
,”ASME J. Electron. Packag.
,
142
(4
), p. 041108
.10.1115/1.404749748.
Raciti
,
A.
,
Cristaldi
,
D.
,
Greco
,
G.
,
Vinci
,
G.
, and
Bazzano
,
G.
, 2015
, “
Electrothermal SPICE Modeling and Simulation of Power Modules
,” IEEE Trans. Ind. Electron.
,
62
(10
), pp. 6260
–6271
.10.1109/TIE.2015.2420672Copyright © 2023 by ASME
You do not currently have access to this content.
