Abstract
The reliability of Sn-Ag-Cu (SAC)-based solder alloys has been extensively investigated after the prohibition of lead in the electronics industry owing to their toxicity. Low-temperature solder (LTS) alloys have recently received considerable attention because of their low cost and reduced defects in complex assemblies. The shear and fatigue properties of individual solder joints were tested using an Instron micromechanical testing system in this research. Two novel solder alloys (Sn-58Bi-0.5Sb-0.15Ni and Sn-42Bi) with low melting temperatures were examined and compared with Sn-3.5Ag and Sn-3.0Ag-0.8Cu-3.0Bi. The surface finish was electroless nickel-immersion gold (ENIG) during the test. Shear testing was conducted at three strain rates, and the shear strength of each solder alloy was measured. A constant strain rate was used for the cyclic fatigue experiments. The fatigue life of each alloy was determined for various stress amplitudes. The failure mechanism in shear and fatigue tests was characterized using scanning electron microscopy/energy-dispersive spectroscopy (SEM/EDS). The results revealed that Sn-3.0Ag-0.8Cu-3.0Bi had superior shear and fatigue properties compared to other alloys but was more susceptible to brittle failure. The shear strain rate affected the failure modes of Sn-3.0Ag-0.8Cu-3.0Bi, Sn-58Bi-0.5Sb-0.15Ni, and Sn-42Bi; however, Sn-3.5Ag was found to be insensitive. Several failure modes were detected for Sn-3.5Ag in both shear strength and fatigue tests.
Issue Section:
Research Papers
Topics:
Alloys,
Fatigue,
Shear (Mechanics),
Shear strength,
Solders,
Tin,
Stress,
Solder joints,
Fatigue testing,
Fatigue life
References
1.
Xiong
,
M.
, and
Zhang
,
L.
, 2019
, “
Interface Reaction and Intermetallic Compound Growth Behavior of Sn-Ag-Cu Lead-Free Solder Joints on Different Substrates in Electronic Packaging
,” J. Mater. Sci
,
54
(2
), pp. 1741
–1768
.10.1007/s10853-018-2907-y2.
Akkara
,
F. J.
,
Abueed
,
M.
,
Belhadi
,
M.
,
Wei
,
X.
,
Hamasha
,
S.
,
Ali
,
H.
,
Suhling
,
J.
, and
Lall
,
P.
, 2020
, “
Reliability of New SAC-Bi Solder Alloys in Thermal Cycling With Aging
,” Proceedings IPC APEX
, San Diego, CA, Feb. 4–6, pp. 1
–8
.https://www.circuitinsight.com/uploads/2/reliability_new_sac_bi_solder_alloys_thermal_cycling_aging_smta.pdf3.
Xia
,
Z.
,
Chen
,
Z.
,
Shi
,
Y.
,
Mu
,
N.
, and
Sun
,
N.
, 2002
, “
Effect of Rare Earth Element Additions on the Microstructure and Mechanical Properties of Tin-Silver-Bismuth Solder
,” J. Electron. Mater.
,
31
(6
), pp. 564
–567
.10.1007/s11664-002-0126-34.
Su
,
S.
,
Jian
,
M.
,
Wei
,
X.
,
Akkara
,
F. J.
,
Suhling
,
J.
, and
Lall
,
P.
, 2019
, “
Effect of Surface Finish on the Fatigue Behavior of Bi-Based Solder Joints
,” 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm
), Las Vegas, NV, May 28–31, pp. 1155
–1159
.10.1109/ITHERM.2019.87574195.
Jian
,
M.
,
Vyas
,
P. P.
,
Wei
,
X.
,
Belhadi
,
M. E. A.
,
Suhling
,
J.
, and
Lall
,
P.
, 2021
, “
Fatigue Performance of Aged SAC-Bi Solder Joint Under Varying Stress Cycling
,” 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm
), San Diego, CA, June 1–4, pp. 991
–998
.10.1109/ITherm51669.2021.95032946.
Jian
,
M.
,
Wei
,
X.
,
Suhling
,
J.
, and
Lall
,
P.
, 2020
, “
Effect of Varying Amplitude Cycling on SAC-Bi Solder Joint Fatigue
,” 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm
), Orlando, FL, July 21–23, pp. 1017
–1023
.10.1109/ITherm45881.2020.91904377.
Belhadi
,
M. E. A.
,
Akkara
,
F. J.
,
Athamenh
,
R.
,
Abueed
,
M.
,
Hamasha
,
S.
,
Ali
,
H.
,
Suhling
,
J.
, and
Lall
,
P.
, 2020
, “
The Effect of Bi on the Mechanical Properties of Aged SAC Solder Joint
,” 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm
), Orlando, FL, July 21–23, pp. 1100
–1105
.10.1109/ITherm45881.2020.91904668.
Belhadi
,
M. E. A.
,
Akkara
,
F.
,
Jian
,
M.
, and
Hamasha
,
S.
, “
Effect of New SAC-Bi Solder Pastes on Thermal Cycling Reliability Considering Aging,
” Proceedings of SMTA International Conference 2020
, Virtual, Sept. 28
–29
.https://www.researchgate.net/publication/344111161_Effect_of_New_SACBi_Solder_Pastes_on_Thermal_Cycling_Reliability_Considering_Aging9.
Su
,
S.
,
Akkara
,
F. J.
,
Abueed
,
M.
,
Jian
,
M.
,
Suhling
,
J.
, and
Lall
,
P.
, 2018
, “
Fatigue Properties of Lead-Free Doped Solder Joints
,” 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm
), San Diego, CA, May 29–June 1, pp. 1243
–1248
.10.1109/ITHERM.2018.841956610.
Coyle
,
R. J.
,
Sweatman
,
K.
, and
Arfaei
,
B.
, 2015
, “
Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends
,” JOM
,
67
(10
), pp. 2394
–2415
.10.1007/s11837-015-1595-111.
Yin
,
L.
,
Wentlent
,
L.
,
Yang
,
L.
,
Arfaei
,
B.
,
Oasaimeh
,
A.
, and
Borgesen
,
P.
, 2012
, “
Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical Fatigue
,” J. Electron. Mater.
,
41
(2
), pp. 241
–252
.10.1007/s11664-011-1762-212.
Zhao
,
J.
,
Mutoh
,
Y.
,
Miyashita
,
Y.
, and
Mannan
,
S. L.
, 2002
, “
Fatigue Crack-Growth Behavior of Sn-Ag-Cu and Sn-Ag-Cu-Bi Lead-Free Solders
,” J. Electron. Mater.
,
31
(8
), pp. 879
–886
.10.1007/s11664-002-0199-z13.
Kanchanomai
,
C.
,
Miyashita
,
Y.
,
Mutoh
,
Y.
, and
Mannan
,
S. L.
, 2002
, “
Low Cycle Fatigue and Fatigue Crack Growth Behaviour of Sn–Ag Eutectic Solder
,” Solder. Surf. Mt. Technol.
, 14(3), pp. 30
–36
.10.1108/0954091021044470014.
Kanchanomai
,
C.
,
Miyashita
,
Y.
,
Mutoh
,
Y.
, and
Mannan
,
S. L.
, 2003
, “
Influence of Frequency on Low Cycle Fatigue Behavior of Pb-Free Solder 96.5 Sn–3.5 Ag
,” Mater. Sci. Eng. A
,
345
(1–2
), pp. 90
–98
.10.1016/S0921-5093(02)00461-615.
Mutoh
,
Y.
,
Zhao
,
J.
,
Miyashita
,
Y.
, and
Kanchanomai
,
C.
, 2002
, “
Fatigue Crack Growth Behaviour of Lead‐Containing and Lead‐Free Solders
,” Solder. Surf. Mt. Technol.
, 14(3), pp. 37
–45
.10.1108/0954091021044471916.
Kanchanomai
,
C.
,
Miyashita
,
Y.
, and
Mutoh
,
Y.
, 2002
, “
Low-Cycle Fatigue Behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi Lead-Free Solders
,” J. Electron. Mater.
,
31
(5
), pp. 456
–465
.10.1007/s11664-002-0100-017.
Hamasha
,
S.
, and
Borgesen
,
P.
, 2016
, “
Effects of Strain Rate and Amplitude Variations on Solder Joint Fatigue Life in Isothermal Cycling
,” ASME J. Electron. Packag.
,
138
(2
), p. 21002
.10.1115/1.403288118.
Su
,
S.
,
Jian
,
M.
,
Akkara
,
F. J.
,
Hamasha
,
S.
,
Suhling
,
J.
, and
Lall
,
P.
, 2018
, “
Fatigue and Shear Properties of High Reliable Solder Joints for Harsh Applications,
” SMTA International
, Rosemont, IL, Oct. 14
–18
.https://www.circuitinsight.com/programs/55431.html19.
Hamasha
,
S.
,
Akkara
,
F.
,
Su
,
S.
,
Ali
,
H.
, and
Borgesen
,
P.
, 2018
, “
Effect of Cycling Amplitude Variations on SnAgCu Solder Joint Fatigue Life
,” IEEE Trans. Compon. Packag. Manuf. Technol
,
8
(11
), pp. 1896
–1904
.10.1109/TCPMT.2018.279534720.
Borgesen
,
P.
,
Hamasha
,
S.
,
Obaidat
,
M.
,
Raghavan
,
V.
,
Dai
,
X.
,
Meilunas
,
M.
, and
Anselm
,
M.
, 2013
, “
Solder Joint Reliability Under Realistic Service Conditions
,” Microelectron. Reliab.
,
53
(9–11
), pp. 1587
–1591
.10.1016/j.microrel.2013.07.09121.
Su
,
S.
,
Jian
,
M.
, and
Hamasha
,
S.
, 2020
, “
Effects of Surface Finish on the Shear Fatigue of SAC-Based Solder Alloys
,” IEEE Trans. Compon. Packag. Manuf. Technol.
,
10
(3
), pp. 457
–466
.10.1109/TCPMT.2019.294280622.
Su
,
S.
,
Fu
,
N.
,
John Akkara
,
F.
, and
Hamasha
,
S.
, 2018
, “
Effect of Long-Term Room Temperature Aging on the Fatigue Properties of SnAgCu Solder Joint
,” ASME J. Electron. Packag.
,
140
(3
), p. 031005
.10.1115/1.404010523.
Akkara
,
F. J.
,
Su
,
S.
,
Thirugnanasambandam
,
S.
,
Dawahdeh
,
A.
,
Qasaimeh
,
A.
,
Evans
,
J.
, and
Hamasha
,
S.
, 2017
, “
Effects of Long-Term Aging on SnAgCu Solder Joints Reliability in Mechanical Cycling Fatigue
,” SMTA International Conference 2018
, Chicago, IL, Oct. 14–18, pp. 17
–21
.https://www.researchgate.net/publication/337439125_EFFECTS_OF_LONGTERM_AGING_ON_SnAgCu_SOLDER_JOINTS_RELIABILITY_IN_MECHANICAL_CYCLING_FATIGUE24.
Xia
,
Z.
,
Shi
,
Y.
, and
Chen
,
Z.
, 2002
, “
Evaluation on the Characteristics of Tin-Silver-Bismuth Solder
,” J. Mater. Eng. Perform.
,
11
(1
), pp. 107
–111
.10.1007/s11665-002-0016-025.
Chen
,
H.
,
Han
,
J.
,
Li
,
J.
, and
Li
,
M.
, 2012
, “
Inhomogeneous Deformation and Microstructure Evolution of Sn–Ag-Based Solder Interconnects During Thermal Cycling and Shear Testing
,” Microelectron. Reliab.
,
52
(6
), pp. 1112
–1120
.10.1016/j.microrel.2012.01.00926.
Dutta
,
I.
,
Kumar
,
P.
, and
Subbarayan
,
G.
, 2009
, “
Microstructural Coarsening in Sn-Ag-Based Solders and Its Effects on Mechanical Properties
,” JOM
,
61
(6
), pp. 29
–38
.10.1007/s11837-009-0085-827.
Qi
,
L.
,
Huang
,
J.
,
Zhao
,
X.
, and
Zhang
,
H.
, 2009
, “
Effect of Thermal-Shearing Cycling on Ag3Sn Microstructural Coarsening in SnAgCu Solder
,” J. Alloys Compd.
,
469
(1–2
), pp. 102
–107
.10.1016/j.jallcom.2008.01.10828.
Fahim
,
A.
,
Hasan
,
S. M. K.
,
Suhling
,
J. C.
, and
Lall
,
P.
, 2020
, “
Investigation on the Mechanical Behavior Evolution Occurring in Lead Free Solder Joints Exposed to Thermal Cycling
,” 2020 IEEE 70th Electronic Components and Technology Conference (ECTC
), Orlando, FL, June 3–30, pp. 1486
–1495
.10.1109/ECTC32862.2020.0023529.
Wei
,
X.
,
Su
,
S.
,
Ali
,
H.
,
Suhling
,
J.
, and
Lall
,
P.
, 2020
, “
Fatigue Performance of Doped SAC Solder Joints in BGA Assembly
,” 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm
), Orlando, FL, July 21–23, pp. 1035
–1042
.10.1109/ITherm45881.2020.919047930.
Wei
,
X.
,
Jian
,
M.
,
Belhadi
,
M. E. A.
,
Suhling
,
J.
, and
Lall
,
P.
, 2021
, “
Fatigue Performance of Ball Grid Array Components at Elevated Temperature
,” 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm
), San Diego, CA, June 1–4, pp. 876
–884
.10.1109/ITherm51669.2021.950325731.
Kim
,
Y.-S.
,
Kim
,
K.-S.
,
Hwang
,
C.-W.
, and
Suganuma
,
K.
, 2003
, “
Effect of Composition and Cooling Rate on Microstructure and Tensile Properties of Sn–Zn–Bi Alloys
,” J. Alloys Compd.
,
352
(1–2
), pp. 237
–245
.10.1016/S0925-8388(02)01168-432.
Yang
,
L.
,
Fenglian
,
S.
, and
Miaosen
,
Y.
, 2013
, “
Shear Strength and Brittle Failure of low-Ag SAC-Bi-Ni Solder Joints During Ball Shear Test
,” 2013 14th International Conference on Electronic Packaging Technology
, Dalian, Liaoning, China, Aug. 11–14, pp. 750
–753
.10.1109/ICEPT.2013.675657433.
Wan
,
Y.
,
Li
,
S.
,
Hu
,
X.
,
Qiu
,
Y.
,
Xu
,
T.
,
Li
,
Y.
, and
Jiang
,
X.
, 2018
, “
Shear Strength and Fracture Surface Analysis of Sn58Bi/Cu Solder Joints Under a Wide Range of Strain Rates
,” Microelectron. Reliab.
,
86
, pp. 27
–37
.10.1016/j.microrel.2018.05.00734.
Zhang
,
P.
,
Xue
,
S.
, and
Wang
,
J.
, 2020
, “
New Challenges of Miniaturization of Electronic Devices: Electromigration and Thermomigration in Lead-Free Solder Joints
,” Mater. Des.
,
192
, p. 108726
.10.1016/j.matdes.2020.10872635.
Jiang
,
N.
,
Zhang
,
L.
,
Gao
,
L.-L.
,
Song
,
X.-G.
, and
He
,
P.
, 2021
, “
Recent Advances on SnBi Low-Temperature Solder for Electronic Interconnections
,” J. Mater. Sci. Mater. Electron
,
32
(18
), pp. 22731
–22759
.10.1007/s10854-021-06820-736.
Rajendran
,
S. H.
,
Kang
,
H.
, and
Jung
,
J. P.
, 2021
, “
Ultrasonic-Assisted Dispersion of ZnO Nanoparticles to Sn-Bi Solder: A Study on Microstructure, Spreading, and Mechanical Properties
,” J. Mater. Eng. Perform.
,
30
(5
), pp. 3167
–3172
.10.1007/s11665-021-05518-537.
Zou
,
H. F.
,
Zhang
,
Q. K.
, and
Zhang
,
Z. F.
, 2012
, “
Interfacial Microstructure and Mechanical Properties of SnBi/Cu Joints by Alloying Cu Substrate
,” Mater. Sci. Eng. A
,
532
, pp. 167
–177
.10.1016/j.msea.2011.10.07838.
Wang
,
F.
,
Huang
,
Y.
, and
Li
,
D.
, 2017
, “
The Shear Strength and Fracture Mode of Sn-xBi (x= 0, 2.5, 5, 15)/Cu Solder Joints
,” 2017 18th International Conference on Electronic Packaging Technology (ICEPT
), Harbin, China, Aug. 16–19, pp. 253
–257
.10.1109/ICEPT.2017.804644939.
Jeong
,
G.
,
Yu
,
D.-Y.
,
Baek
,
S.
,
Bang
,
J.
,
Lee
,
T.-I.
,
Jung
,
S.-B.
,
Kim
,
J. S.
, and
Ko
,
Y.-H.
, 2021
, “
Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints With Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding
,” Materials (Basel)
,
14
(2
), p. 335
.10.3390/ma1402033540.
Su
,
S.
,
Hamasha
,
S.
, and
Hamasha
,
K.
, 2019
, “
Effect of Surface Finish on the Shear Properties of SnAgCu-Based Solder Alloys
,” IEEE Trans. Compon. Packag. Manuf. Technol.
,
9
(8
), pp. 1473
–1485
.10.1109/TCPMT.2019.292826741.
Jian
,
M.
,
Su
,
S.
,
Hamasha
,
S.
,
Hamasha
,
M. M.
, and
Alkhazali
,
A.
, 2021
, “
Fatigue Properties and Microstructure of SnAgCu Bi-Based Solder Joint
,” ASME J. Electron. Packag.
,
143
(1
), p. 011008
.10.1115/1.404734142.
Liu
,
Y.
,
Ren
,
B.
,
Xue
,
Y.
,
Zhou
,
M.
,
Cao
,
R.
,
Chen
,
P.
, and
Zeng
,
X.
, 2021
, “
Microstructure and Mechanical Behavior of SnBi-xAg and SnBi-xAg@ P-Cu Solder Joints During Isothermal Aging
,” Microelectron. Reliab.
,
127
, p. 114388
.10.1016/j.microrel.2021.11438843.
Erich
,
R.
,
Coyle
,
R. J.
,
Wenger
,
G. M.
, and
Primavera
,
A.
, 1999
, “
Shear Testing and Failure Mode Analysis for Evaluation of BGA Ball Attachment
,” Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium
(Cat. No. 99CH36330
), Austin, TX, Oct. 18–19, pp. 16
–22
.10.1109/IEMT.1999.80479144.
Lee
,
K. Y.
, and
Li
,
M.
, 2003
, “
Interfacial Microstructure Evolution in Pb-Free Solder Systems
,” J. Electron. Mater.
,
32
(8
), pp. 906
–912
.10.1007/s11664-003-0208-x45.
Hamasha
,
S.
,
Akkara
,
F.
,
Abueed
,
M.
,
Rababah
,
M.
,
Zhao
,
C.
,
Su
,
S.
,
Suhling
,
J.
, and
Evans
,
J.
, 2018
, “
Effect of Surface Finish and High Bi Solder Alloy on Component Reliability in Thermal Cycling
,” 2018 IEEE 68th Electronic Components and Technology Conference (ECTC
), San Diego, CA, May 29–June 1, pp. 2032
–2040
.10.1109/ECTC.2018.0030546.
Chia
,
J. Y. H.
,
Cotterell
,
B.
, and
Chai
,
T. C.
, 2006
, “
The Mechanics of the Solder Ball Shear Test and the Effect of Shear Rate
,” Mater. Sci. Eng. A
,
417
(1–2
), pp. 259
–274
.10.1016/j.msea.2005.10.064Copyright © 2023 by ASME
You do not currently have access to this content.
