Enhanced boiling is one of the popular cooling schemes in thermal management due to its superior heat transfer characteristics. This study demonstrates the ability of copper inverse opal (CIO) porous structures to enhance pool boiling performance using a thin CIO film with a thickness of ∼10 μm and pore diameter of 5 μm. The microfabricated CIO film increases microscale surface roughness that in turn leads to more active nucleation sites thus improved boiling performance parameters such as heat transfer coefficient (HTC) and critical heat flux (CHF) compared to those of smooth Si surfaces. The experimental results for CIO film show a maximum CHF of 225 W/cm2 (at 16.2 °C superheat) or about three times higher than that of smooth Si surface (80 W/cm2 at 21.6 °C superheat). Optical images showing bubble formation on the microporous copper surface are captured to provide detailed information of bubble departure diameter and frequency.
Enhanced Heat Transfer Using Microporous Copper Inverse Opals
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received January 9, 2018; final manuscript received April 12, 2018; published online May 9, 2018. Assoc. Editor: Kaushik Mysore.
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Lee, H., Maitra, T., Palko, J., Kong, D., Zhang, C., Barako, M. T., Won, Y., Asheghi, M., and Goodson, K. E. (May 9, 2018). "Enhanced Heat Transfer Using Microporous Copper Inverse Opals." ASME. J. Electron. Packag. June 2018; 140(2): 020906. https://doi.org/10.1115/1.4040088
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