This investigation is aimed at the modeling of both the fabrication process and the reliability of press-fit interconnections on moulded interconnect devices (MID). These are multifunctional three-dimensional substrates, produced by thermoplastic injection moulding for large-series applications. The assembly process and subsequently the durability of press-fit interconnections has been modeled and proved with a finite element software. Especially, a simulation tool for process optimizations was created and applied. In order to obtain realistic results, a creep model for the investigated base material, a liquid-crystal polymer (LCP), was generated and verified by experiments. Required friction coefficients between metal pin and base material were determined by adapting simulations and experiments. Retention forces of pins pressed into substrate holes during as well after the assembly process, and after temperature loads were predicted by simulations. Additionally, the decreasing extraction forces over time due to creep in the thermoplastic base material have been predicted for different storage temperatures as well with finite element analyses. Following, the numerical results of the process and reliability modeling were verified by experiments. It is concluded that the behavior of the mechanical contact of the pin-substrate system, can be suitably described time- and temperature-dependent.
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September 2012
Research-Article
Modeling of Thermoplastic Materials for the Process-Simulation of Press-Fit Interconnections on Moulded Interconnected Devices
Jürgen Wilde,
Jürgen Wilde
Department of Microsystems Engineering (IMTEK),
Laboratory for Assembly and Packaging,
Laboratory for Assembly and Packaging,
University of Freiburg
,Georges-Koehler-Allee 103
,79110 Freiburg,
Germany
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P. Buckmüller
P. Buckmüller
Hahn-Schickard-Institute for Microassembly Technology HSG-IMAT,
Allmandring 9B
,70569 Stuttgart
, Germany
Search for other works by this author on:
Jürgen Wilde
Department of Microsystems Engineering (IMTEK),
Laboratory for Assembly and Packaging,
Laboratory for Assembly and Packaging,
University of Freiburg
,Georges-Koehler-Allee 103
,79110 Freiburg,
Germany
P. Buckmüller
Hahn-Schickard-Institute for Microassembly Technology HSG-IMAT,
Allmandring 9B
,70569 Stuttgart
, Germany
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received April 21, 2011; final manuscript received March 4, 2012; published online July 18, 2012. Assoc. Editor: Stephen McKeown.
J. Electron. Packag. Sep 2012, 134(3): 031002 (10 pages)
Published Online: July 18, 2012
Article history
Received:
April 21, 2011
Revision Received:
March 4, 2012
Citation
Fellner, T., Zukowski, E., Wilde, J., Kück, H., Richter, H., Schober, M., and Buckmüller, P. (July 18, 2012). "Modeling of Thermoplastic Materials for the Process-Simulation of Press-Fit Interconnections on Moulded Interconnected Devices." ASME. J. Electron. Packag. September 2012; 134(3): 031002. https://doi.org/10.1115/1.4006927
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