Leading indicators of failure have been developed based on high-frequency characteristics, and system-transfer function derived from resistance spectroscopy measurements during shock and vibration. The technique is intended for condition-monitoring in high-reliability applications where the knowledge of impending failure is critical and the risks in terms of loss-of-functionality are too high to bear. Previously, resistance spectroscopy measurements have been used during thermal cycling tests to monitor damage progression due to thermomechanical stresses. The development of resistance spectroscopy based damage precursors for prognostication under shock and vibration is new. In this paper, the high-frequency characteristics and system-transfer function based on resistance spectroscopy measurements have been correlated to the damage progression in electronics during shock and vibration. Packages being examined include ceramic area-array packages. Second level interconnect technologies examined include copper-reinforced solder column, SAC305 solder ball, and 90Pb10Sn high-lead solder ball. Assemblies have been subjected to 1500 g, 0.5 ms pulse (JESD-B2111). Continuity has been monitored in situ during the shock test for identification of part-failure. Resistance spectroscopy based damage precursors have been correlated to the optically measured transient strain based feature vectors. High speed cameras have been used to capture the transient strain histories during shock-impact. Statistical pattern recognition techniques have been used to identify damage initiation and progression and determine the statistical significance in variance between healthy and damaged assemblies. Models for healthy and damaged packages have been developed based on package characteristics. Data presented show that high-frequency characteristics and system-transfer characteristics based on resistance spectroscopy measurements can be used for condition-monitoring, damage initiation, and progression in electronic systems. A positive prognostic distance has been demonstrated for each of the interconnect technologies tested.
Issue Section:
Research Papers
Topics:
Damage,
Electronics,
Failure,
Shock (Mechanics),
Solders,
Spectroscopy,
Vibration,
Signals,
Phase shift,
Stress,
Copper
References
1.
Steininger
, A.
, 2000, “Testing and Built-in-Self-Test—A Survey
,” J. Syst. Archit.
, 46
(9
), pp. 721
–747
.2.
Harris
, I. G.
, and Tessier
, R.
, 2002, “Testing and Diagnosis of Interconnect Faults in Cluster-Based FPGA Architectures
,” IEEE Trans. Comput.-Aided Des.
, 21
(11
), pp. 1337
–1343
.3.
Hashempour
, H.
, Meyer
, F. J.
, and Lombardi
, F.
, 2004, “Analysis and Measurement of Fault Coverage in a Combined ATE and BIST Environment
,” IEEE Trans. Instrum. Meas.
, 53
(2
), pp. 300
–307
.4.
Suthar
, V.
, and Dutt
, S.
, 2006, “Mixed PLB and Interconnect BIST for FPGAs Without Fault-Free Assumptions
,” 24th IEEE VLSI Test Symposium
, pp. 36
–43
.5.
Lall
, P.
, Islam
, N.
, Rahim
, K.
, Suhling
, J.
, and Gale
, S.
, 2004, “Leading Indicators-of-Failure for Prognosis of Electronic and MEMS Packaging
,” 54th Electronics Components and Technology Conference
, Las Vegas, NV, June 1–4.6.
Lall
, P.
, Islam
, N.
, Shete
, T.
, Evans
, J.
, Suhling
, J.
, and Gale
, S.
, 2004, “Damage Mechanics of Electronics on Metal-Backed Substrates in Harsh Environments
,” 54th Electronic Components and Technology Conference
, Las Vegas, NV, June 1–4.7.
Lall
, P.
, Islam
, N.
, Suhling
, J. C.
, and Darveaux
, R.
, 2004, “Model for BGA and CSP Reliability in Automotive Underhood Applications
,” IEEE Trans. Compon. Packag. Technol.
, 27
(3
), pp. 585
–593
.8.
Lall
, P.
, Panchagade
, D.
, Liu
, Y.
, Johnson
, R. W.
, and Suhling
, J. C.
, 2004, “Models for Reliability Prediction of Fine-Pitch BGAs and CSPs in Shock and Drop-Impact
,” Proceedings of the 54th Electronic Components and Technology Conference
, Las Vegas, NV, June 1–4, pp. 1296
–1303
.9.
Lall
, P.
, Islam
, N.
, Choudhary
, P.
, and Suhling
, J.
, 2005, “Prognostication and Health Monitoring of Leaded and Lead Free Electronic and MEMS Packages in Harsh Environments
,” Proceedings of the 55th IEEE Electronic Components and Technology Conference
, Orlando, FL, June 1–3, pp. 1
–9
.10.
Lall
, P.
, Panchagade
, D.
, Choudhary
, P.
, Suhling
, J.
, and Gupte
, S.
, 2005, “Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging
,” Proceedings of the 55th IEEE Electronic Components and Technology Conference
, Orlando, FL, June 1–3, pp. 480
–490
.11.
Lall
, P.
, Singh
, N.
, Suhling
, J. C.
, Strickland
, M.
, and Blanche
, J.
, 2005, “Thermal Reliability Considerations for Deployment of Area Array Packages in Harsh Environments
,” IEEE Trans. Compon. Packag. Technol.
, 28
(3
), pp. 457
–466
.12.
Lall
, P.
, Gupte
, S.
, Choudhary
, P.
, and Suhling
, J.
, 2006, “Solder-Joint Reliability in Electronics Under Shock and Vibration Using Explicit Finite Element Sub-Modeling
,” Proceedings of the 56th IEEE Electronic Components and Technology Conference
, San Diego, CA, May 30–June 2, pp. 428
–435
.13.
Lall
, P.
, Choudhary
, P.
, Gupte
, S.
, and Suhling
, J.
, 2006, “Health Monitoring for Damage Initiation & Progression During Mechanical Shock in Electronic Assemblies
,” Proceedings of the 56th IEEE Electronic Components and Technology Conference
, San Diego, CA, May 30–June 2, pp. 85
–94
.14.
Lall
, P.
, Hande
, M.
, Singh
, N.
, Suhling
, J.
, and Lee
, J.
, 2006, “Feature Extraction and Damage Data for Prognostication of Leaded and Leadfree Electronics
,” Proceedings of the 56th IEEE Electronic Components and Technology Conference
, San Diego, CA, May 30–June 2, pp. 718
–727
.15.
Lall
, P.
, Islam
, N.
, Rahim
, K.
, Suhling
, J.
, and Gale
, S.
, 2006, “Prognostics and Health Management of Electronic Packaging
,” IEEE Trans. Compon. Packag. Technol.
, 29
(3
), pp. 666
–677
.16.
Lall
, P.
, Islam
, N.
, Shete
, T.
, Evans
, J.
, Suhling
, J.
, and Gale
, S.
, 2006, “Damage Mechanics of Electronics on Metal-Backed Substrates in Harsh Environments
,” IEEE Trans. Compon. Packag. Technol.
, 29
(1
), pp. 204
–212
.17.
Lall
, P.
, Panchagade
, D.
, Liu
, Y.
, Johnson
, R. W.
, and Suhling
, J. C.
, 2006, “Models for Reliability Prediction of Fine-Pitch BGAs and CSPs in Shock and Drop-Impact
,” IEEE Trans. Compon. Packag. Technol.
, 29
(3
), pp. 464
–474
.18.
Lall
, P.
, Choudhary
, P.
, Gupte
, S.
, Suhling
, J.
, and Hofmeister
, J.
, 2007, “Statistical Pattern Recognition and Built-In Reliability Test for Feature Extraction and Health Monitoring of Electronics Under Shock Loads
,” 57th Electronics Components and Technology Conference
, Reno, NV, May 30–June 1, pp. 1161
–1178
.19.
Lall
, P.
, Gupte
, S.
, Choudhary
, P.
, and Suhling
, J.
, 2007, “Solder-Joint Reliability in Electronics Under Shock and Vibration Using Explicit Finite Element Sub-Modeling
,” IEEE Trans. Electron. Packag. Manuf.
, 30
(1
), pp. 74
–83
.20.
Lall
, P.
, Hande
, M.
, Bhat
, C.
, Suhling
, J.
, and Lee
, J.
, 2007, “Prognostics Health Monitoring (PHM) for Prior-Damage Assessment in Electronics Equipment Under Thermo-Mechanical Loads
,” Electronic Components and Technology Conference
, Reno, NV, May 29–June 1, pp. 1097
–1111
.21.
Lall
, P.
Panchagade
, D.
, Liu
, Y.
, Johnson
, W.
, and Suhling
, J.
, 2007, “Smeared Property Models for Shock-Impact Reliability of Area-Array Packages
,” ASME J. Electron. Packag.
, 129
, pp. 373
–381
.22.
Lall
, P.
, Hande
, M.
, Bhat
, C.
, Islam
, N.
, Suhling
, J.
, and Lee
, J.
, 2007, “Feature Extraction and Damage-Precursors for Prognostication of Lead-Free Electronics
,” Microelectron. Reliab.
, 47
, pp. 1907
–1920
.23.
Lall
, P.
, Choudhary
, P.
, Gupte
, S.
, and Suhling
, J.
, 2008, “Health Monitoring for Damage Initiation and Progression During Mechanical Shock in Electronic Assemblies
,” IEEE Trans. Compon. Packag. Technol.
, 31
(1
), pp. 173
–183
.24.
Lall
, P.
, Panchagade
, D.
, Choudhary
, P.
, Gupte
, S.
, and Suhling
, J.
, 2008, “Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging
,” IEEE Trans. Compon. Packag. Technol.
, 31
(1
), pp. 104
–113
.25.
Lall
, P.
, Hande
, M.
, Bhat
, C.
, More
, V.
, Vaidya
, R.
, and Suhling
, J.
, 2008, “Algorithms for Prognostication of Prior Damage and Residual Life in Lead-Free Electronics Subjected to Thermo-Mechanical Loads
,” Proceedings of the 10th Intersociety Thermal and Thermomechanical Phenomena
(ITHERM
), Orlando, FL, May 28–31, pp. 638
–651
.26.
Lall
, P.
, Bhat
, C.
, Hande
, M.
, More
, V.
, Vaidya
, R.
, Pandher
, R.
, Suhling
, J.
, and Goebel
, K.
, 2008, “Interrogation of System State for Damage Assessment in Lead-Free Electronics Subjected to Thermo-Mechanical Loads
,” Proceedings of the 58th Electronic Components and Technology Conference
(ECTC), Orlando, FL, May 27–30, pp. 918
–929
.27.
Lall
, P.
, Iyengar
, D.
, Shantaram
, S. S.
, Gupta
, P.
, Panchagade
, D.
, and Suhling
, J.
, 2008, “Keynote Presentation: Feature Extraction and Health Monitoring Using Image Correlation for Survivability of Leadfree Packaging Under Shock and Vibration
,” Proceedings of the 9th International Conference on Thermal, Mechanical, and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
(EuroSIME), Freiburg, Germany, April 16–18, pp. 594
–608
.28.
Lall
, P.
, Iyengar
, D.
, Shantaram
, S.
, Pandher
, R.
, Panchagade
, D.
, and Suhling
, J.
, 2008, “Design Envelopes and Optical Feature Extraction Techniques for Survivability of SnAg Leadfree Packaging Architectures Under Shock and Vibration
,” Proceedings of the 58th Electronic Components and Technology Conference
(ECTC), Orlando, FL, May 27–30, pp. 1036
–1047
.29.
Constable
, J.
, and Sahay
, C.
, 1992, “Electrical Resistance as an Indicator of Fatigue
,” IEEE Trans. Compon., Hybrids, Manuf. Technol.
, 15
, pp. 1138
–1145
.30.
Lizzul
, C.
, Constable
, J.
, and Westby
, G.
, 1994, “Fatigue Investigation of Lap Shear Solder Joints Using Resistance Spectroscopy
,” 44th ECTC
, pp. 458
–464
.31.
Prassana
, R.
, Engel
, P.
, and Constable
, J.
, 1995, “An Improved Resistance Method to Determine Lead Force and Lead Fatigue in Twisted Circuit Board
,” ASME InterPack Conference
, Maui, Hawaii, pp. 395
–402
.32.
Constable
, J. H.
, Butler
, W.
, Huang, C.-C., and Pitarresi
, J. M.
, 2001, “CSP Fatigue Life Predictions Based on Electrical Resistance Change
,” Advances in Electronic Packaging, ASME InterPack’01 Proceedings
, Kauai, HI, July, pp. 1
–7
.33.
Kwon
, D.
, Azarian
, M. H.
, and Pecht
, M.
, 2008, “Detection of Solder Joint Degradation Using RF Impedence Analysis
,” 58th ECTC
, Orlando, FL, pp. 606
–610
.34.
McCann
, R. S.
, and Spirkovska
, L.
, 2005, “Human Factors of Integrated Systems Health Management on Next-Generation Spacecraft
,” First International Forum on Integrated System Health Engineering and Management in Aerospace
, Napa, CA, Nov. 7–10, pp. 1
–18
.35.
Marko
, K. A.
, James
, J. V.
, Feldkamp
, T. M.
, Puskorius
, C. V.
, Feldkamp
, J. A.
, and Roller
, D.
, 1996, “Applications of Neural Networks to the Construction of ‘Virtual’ Sensors and Model-Based Diagnostics
,” Proceedings of ISATA 29th International Symposium on Automotive Technology and Automation
, June 3–6, pp. 133
–138
.36.
Schauz
, J. R.
, 1996, “Wavelet Neural Networks for EEG Modeling and Classification
,” Ph.D. thesis, Georgia Institute of Technology, Atlanta, GA.37.
Shiroishi
, J.
, Li
, Y.
, Liang
, S.
, Kurfess
, T.
, and Danyluk
, S.
, 1997, “Bearing Condition Diagnostics via Vibration and Acoustic Emission Measurements
,” Mech. Syst. Signal Process.
, 11
(5
), pp. 693
–705
.38.
Jarrell
, D.
, Sisk
, D.
, and Bond
, L.
, 2002, “Prognostics and Condition Based Maintenance (CBM): A Scientific Crystal Ball
,” International Congress on Advanced Nuclear Power Plants (ICAPP)
, June, Pacific Northwest National Laboratory, Richland, WA, Paper No. 194.39.
Munns
, T. E.
, and Kent
, R. M.
, 2000, “Structural Health Monitoring: Degradation Mechanism and System Requirements
,” Digital Avionics Systems Conferences
, Vol. 2
, pp. 6C2/1
–6C2/8
.40.
Baldwin
, C.
, Kiddy
, J.
, Salter
, T.
, Chen
, P.
, and Niemczuk
, J.
, 2002, “Fiber Optic Structural Health Monitoring System: Rough Sea Trials Testing of the RV Triton
,” MTS/IEEE Oceans 2002
, Oct. 29–31, Vol. 3
, pp. 1807
–1814
.41.
Chang
, P. C.
, Flatau
, A.
, and Liu
, S. C.
, 2003, “Review Paper: Health Monitoring of Civil Infrastructure
,” Struct. Health Monit.
, 2
(3
), pp. 257
–267
.42.
Barke
, D.
, and Chiu
, W. K.
, 2005, “Structural Health Monitoring in the Railway Industry: A Review
,” Struct. Health Monit.
, 4
(1
), pp. 81
–93
.43.
Dally
, J.
, 2005, Experimental Stress Analysis
, 2nd ed., College House Enterprises
, Knoxville, TN
.44.
Stanford Research Systems, 2006, Model SR830: DSP Lock-In Amplifier, Stanford Research Systems, Sunnyvale, CA, pp.
1
–178
.45.
Gonick
, L.
, and Smith
, W.
, 1993, Cartoon Guide to Statistics
, Collins Reference
, St. Louis, MO
.46.
JEDEC Standard, 2003, “
Board Level Drop Test Method of Components for Handheld Electronic Products
,” JESD22-B111, Arlington, VA, July, pp. 1
–22
.47.
Lall
, P.
, Singh
, N.
, Suhling
, J. C.
, Strickland
, M.
, and Blanche
, J.
, 2004, “Thermal Reliability Considerations for Deployment of Area Array Packages in Harsh Environments
,” Proceedings of ITHERM 2004
, Las Vegas, NV, June 1–4, pp. 259
–267
.Copyright © 2012
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