Bumping of microcircuits and substrates establishes interconnect points required for subsequent bonding of microelectronic components, allowing for power and data distribution. Simultaneous ultrasonic bonding of individual Au balls promises to accelerate bumping processes and is studied using a finite element model. The model covers the static forces at the end of a successful bonding operation and analyzes the interfacial stresses between bumps and substrate. The modeling shows the vertical forces acting on the bumps when a lateral displacement of the bonding tool is applied. When designing a practical bonding application, the control of such vertical forces is recommended. A sensitivity analysis is conducted to study the effect of the main factors on the model responses. This analysis reveals that variations in bump height and bonding tool elastic modulus are the major factors affecting the forces on the bumps.
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December 2009
Research Papers
Finite Element Modeling of Simultaneous Ultrasonic Bumping With Au Balls
Wan Ho Song,
Wan Ho Song
Centre for Advanced Materials Joining,
University of Waterloo
, Waterloo, ON, N2L 3G1, Canada
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Ali Karimi,
Ali Karimi
Centre for Advanced Materials Joining,
University of Waterloo
, Waterloo, ON, N2L 3G1, Canada
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Yan Huang,
Yan Huang
Centre for Advanced Materials Joining,
University of Waterloo
, Waterloo, ON, N2L 3G1, Canada
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Michael Mayer,
Michael Mayer
Centre for Advanced Materials Joining,
University of Waterloo
, Waterloo, ON, N2L 3G1, Canada
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Norman Zhou,
Norman Zhou
Centre for Advanced Materials Joining,
University of Waterloo
, Waterloo, ON, N2L 3G1, Canada
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Jae Pil Jung
Jae Pil Jung
Department of Materials Science and Engineering,
University of Seoul
, Seoul 130-743, Korea
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Wan Ho Song
Centre for Advanced Materials Joining,
University of Waterloo
, Waterloo, ON, N2L 3G1, Canada
Ali Karimi
Centre for Advanced Materials Joining,
University of Waterloo
, Waterloo, ON, N2L 3G1, Canada
Yan Huang
Centre for Advanced Materials Joining,
University of Waterloo
, Waterloo, ON, N2L 3G1, Canada
Michael Mayer
Centre for Advanced Materials Joining,
University of Waterloo
, Waterloo, ON, N2L 3G1, Canada
Norman Zhou
Centre for Advanced Materials Joining,
University of Waterloo
, Waterloo, ON, N2L 3G1, Canada
Jae Pil Jung
Department of Materials Science and Engineering,
University of Seoul
, Seoul 130-743, KoreaJ. Electron. Packag. Dec 2009, 131(4): 041007 (5 pages)
Published Online: October 29, 2009
Article history
Received:
July 12, 2008
Revised:
September 16, 2009
Published:
October 29, 2009
Citation
Song, W. H., Karimi, A., Huang, Y., Mayer, M., Zhou, N., and Jung, J. P. (October 29, 2009). "Finite Element Modeling of Simultaneous Ultrasonic Bumping With Au Balls." ASME. J. Electron. Packag. December 2009; 131(4): 041007. https://doi.org/10.1115/1.4000281
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