This paper reports the design study performed on a heat conduction panel having several heat sources at separate locations and a heat sink on one of the panel corners. The panel is given a thickness distribution so as to provide spatially varying heat conduction paths from the heat sources to the heat sink. The objective of thickness distribution design is to reduce the variation among heat source temperatures and the maximum heat source temperature simultaneously. The genetic algorithm is used to search for an optimum thickness distribution. The problem is a generic representation of the situations that are becoming common in a compact electronic equipment.

Issue Section:
Thermal Issues in Emerging Technologies Theory and Applications, THETA
Keywords:
genetic algorithms, heat conduction, heat sinks, heat conduction path design, multiple heat sources, displaced heat sink, genetic algorithm application
Topics:
Design, Heat, Heat conduction, Heat sinks, Temperature, Tiles, Genetic algorithms
1.
Song
,
S.
,
Moran
,
K. P.
, and
Rearick
,
D. P.
, 1998, “
Thermal Performance Modeling and Measurements of Localized Water Cooled Cold Plate
,” pp.
69
–
81
(http://www.aavidthermalloy.com/technical/papers/pdfs/water.pdfhttp://www.aavidthermalloy.com/technical/papers/pdfs/water.pdf).
2.
Rawal
,
S. P.
,
Barnett
,
D. M.
, and
Martin
,
D. E.
, 1998, “
Thermal Management for Multifunctional Structures
,”
Proceedings of 1998 International Conference on Multichip Modules and High Density Packaging
, pp.
129
–
134
.
3.
Pang
,
Y. F.
,
Scott
,
E. P.
,
Chen
,
J. Z.
, and
Thole
,
K. A.
, 2005, “
Thermal Design and Optimization Methodology for Integrated Power Electronics Modules
,”
ASME J. Electron. Packag.
1043-7398,
127
(
1
), pp.
59
–
66
.
Crossref
Search ADS
 
4.
Aranyosi
,
A.
,
Ortega
,
A.
,
Griffin
,
R. A.
,
West
,
S.
, and
Edwards
,
D. R.
, 2000, “
Compact Thermal Models of Packages Used in Conduction Cooled Applications
,”
IEEE Trans. Compon. Packag. Technol.
1521-3331,
23
(
3
), pp.
470
–
480
.
Crossref
Search ADS
 
5.
Gerlach
,
D. W.
, and
Joshi
,
Y. K.
, 2006, “
Parametric Thermal Modeling of 3D Stacked Chip Electronics With Interleaved Solid Heat Spreaders
,”
Proceedings of the Tenth ITHERM
, pp.
1208
–
1212
.
6.
Quiepo
,
N.
,
Devarakonda
,
R.
, and
Humphrey
,
J. A. C.
, 1994, “
Genetic Algorithms for Thermosciences Research: Application to the Optimized Cooling of Electronic Components
,”
Int. J. Heat Mass Transfer
0017-9310,
37
(
6
), pp.
893
–
908
.
Crossref
Search ADS
 
7.
Scholand
,
A. J.
,
Fulton
,
R. E.
, and
Bras
,
B.
, 1999, “
An Investigation of PWB Layout by Genetic Algorithms to Maximize Fatigue Life
,”
ASME J. Electron. Packag.
1043-7398,
121
(
1
), pp.
31
–
36
.
Crossref
Search ADS
 
8.
Gopinath
,
D.
,
Joshi
,
Y.
, and
Azarm
,
S.
, 2005, “
An Integrated Methodology for Multiobjective Optimal Component Placement and Heat Sink Sizing
,”
IEEE Trans. Compon. Packag. Technol.
1521-3331,
28
(
4
), pp.
869
–
876
.
Crossref
Search ADS
 
9.
Suwa
,
T.
, and
Hadim
,
H.
, 2007, “
Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Boards
,”
ASME J. Electron. Packag.
1043-7398,
129
(
1
), pp.
90
–
97
.
Crossref
Search ADS
 
10.
Nakayama
,
W.
, 2003, “
A Methodology to Work on Geometrically Complex Heat Transfer Systems: The Cases of Heat Conduction Through Composite Slabs
,”
Int. J. Heat Mass Transfer
0017-9310,
46
, pp.
3397
–
3409
.
Crossref
Search ADS
 
11.
Goldberg
,
D. E.
, 1989,
Genetic Algorithms in Search, Optimization, and Machine Learning
,
Addison-Wesley
,
Reading, MA
.
12.
Sze
,
M. S.
, 1981,
Physics of Semiconductor Devices
, 2nd ed.,
Wiley
,
New York
, pp.
451
–
452
.
Copyright © 2008
 by American Society of Mechanical Engineers
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