Reducing integrated circuit (IC) plastic packaging production costs by improving the transfer mold and leadframe designs is a costly and time-consuming process. Rather than building mold and leadframe prototypes to perform empirical studies, this research describes how C-MOLD, a microchip encapsulation simulation software application, was used to validate and optimize an innovative mold and leadframe design that has the potential to reduce raw material waste associated with packaging by more than 59 percent. Estimates indicate that the proposed design will cut annual production costs by more than $600,000.

Issue Section:
Additional Technical Papers
Keywords:
integrated circuit packaging, plastic packaging, electronic design automation, encapsulation, moulding
Topics:
Cavities, Design, Flow (Dynamics), Molding, Resins, Simulation, Wire, Deformation, Computer software, Gates (Closures), Temperature, Integrated circuits
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Copyright © 2001
 by ASME
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