Three-dimensional numerical analysis, for transitional characteristics of fluid flow and heat transfer in periodic fully developed region of an array of the heated square blocks deployed along one wall of the parallel plates duct, is carried out by using Lam-Bremhorst low-Reynolds-number two equation turbulence model. Computations were performed for Prandtl number of 0.7, in the Reynolds number range of 200 to 2000 and for two sets of geometric parameters characterizing the array. The predicted transitional Reynolds number is lower than the value for the parallel plate duct and it decreases with increasing the height above the module. Experiments were also performed for pressure drop measurements and for flow visualization and the results were compared with the numerical predictions.
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September 1999
Technical Papers
Numerical and Experimental Prediction of Transitional Characteristics of Flow and Heat Transfer in an Array of Heated Blocks
Y. Asako,
Y. Asako
Department of Mechanical Engineering, Tokyo Metropolitan University, Hachioji, Tokyo, 192-0397, Japan
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Y. Yamaguchi,
Y. Yamaguchi
Department of Mechanical Engineering, Tokyo Metropolitan University, Hachioji, Tokyo, 192-0397, Japan
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M. Faghri
M. Faghri
Department of Mechanical Engineering and Applied Mechanics, University of Rhode Island, Kingston, RI 02881
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Y. Asako
Department of Mechanical Engineering, Tokyo Metropolitan University, Hachioji, Tokyo, 192-0397, Japan
Y. Yamaguchi
Department of Mechanical Engineering, Tokyo Metropolitan University, Hachioji, Tokyo, 192-0397, Japan
M. Faghri
Department of Mechanical Engineering and Applied Mechanics, University of Rhode Island, Kingston, RI 02881
J. Electron. Packag. Sep 1999, 121(3): 202-208 (7 pages)
Published Online: September 1, 1999
Article history
Received:
March 31, 1998
Revised:
May 21, 1999
Online:
November 5, 2007
Citation
Asako, Y., Yamaguchi, Y., and Faghri, M. (September 1, 1999). "Numerical and Experimental Prediction of Transitional Characteristics of Flow and Heat Transfer in an Array of Heated Blocks." ASME. J. Electron. Packag. September 1999; 121(3): 202–208. https://doi.org/10.1115/1.2792685
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