Fatigue life as a function of number of stress cycles has been determined for three-layer titanium-aluminum-titanium thin-film specimens. For nominal stresses ranging from 50 to 90 percent of the upper-bound ultimate strength, the fatigue lives ranged up to 76 cycles. In all specimens, active cracks were observed after only a few stress cycles. These cracks grew with repeated cycling. The fatigue life was reached when the specimen could no longer sustain the maximum cyclic stress.

1.
Sandor, Bela I., Fundamentals of Cyclic Stress and Strain, University of Wisconsin Press, Madison WI, 1972.
2.
Fuchs, H. O., and Stephens, R. I., Metal Fatigue in Engineering, Wiley, New York, 1980.
3.
Dieter, George E., Mechanical Metallurgy, Second Edition, McGraw-Hill, New York, 1976, pp. 403–447.
4.
Hardrath, H. F., Landers, C. B., and Utley, E. C., “Axial Load Fatigue Tests on Notched and Unnotched Specimens of 61S-T6 Aluminum Alloy, Annealed 347 Stainless Steel and Heat-Treated 403 Stainless Steel,” Nat. Adv. Co. Aero. Tech. Note 3017 (1953), reviewed in Forrest, P. G., Fatigue of Metals, Pergamon Press, Oxford, 1962, p. 162.
5.
Manson, S. S., “Fatigue: A Complex Subject—Some Simple Approximations,” Experimental Mechanics 5, No. 7, July 1965, p. 193.
6.
Dally, James W., Packaging of Electronic Systems, McGraw-Hill, New York, 1990, p. 382–383.
7.
Mandel, C. E. Neil, Jr., “Environmental Stress Screening,” Electronic Materials Handbook, Vol. 1 Packaging, C. A. Dostal et al., eds., ASM International, Metals Park, OH, 1989, p. 876, 882.
8.
Robock, Paul V., and Nguyen, Luu T. “Plastic Packaging,” Microelectronics Packaging Handbook, R. R. Tummala and E. J. Rymaszewski, eds., Van Nostrand Reinhold, New York, 1989, p. 631.
9.
Read
David T.
, and
Dally
James W.
, “
A New Method for Measuring the Constitutive Properties of Thin Films
,”
Journal of Materials Research
, Vol.
8
,
1993
, pp.
1542
1549
.
10.
American Society for Metals, Metals Handbook Ninth Edition, Vol. 2, American Society for Metals, Metals Park, OH, 1979.
11.
Hoffman, R. W., “The Mechanical Properties of Thin Condensed Films,” Physics of Thin Films, Vol. 3, edited by G. Hass and R. E. Thun, eds., Academic Press, 1966, pp. 211–273.
12.
Brotzen
F. R.
,
Rosenmayer
C. T.
, and
Gale
R. J.
, “
Mechanical Behavior of Aluminum and Al-Cu(2%) Thin Films
,”
Thin Solid Films
, Vol.
166
,
1988
, pp.
291
298
.
13.
Doerner
Mary F.
, and
Nix
William D.
, “
Stresses and Deformation Processes in Thin Films on Substrates
,”
CRC Critical Reviews in Solid State and Material Sciences
, Vol.
14
,
1988
, pp.
225
268
.
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