This paper presents the development of an initial, “first-cut”, mathematical model for the prediction of electrical interface reliability trends. The model pertains to gold plated contacts subject to loss of normal force and environmental corrosion with time. Stress relaxation over time and temperature in the base metal of the contact is accounted for. Utilizing the results of Mixed Flowing Gas (MFG) tests, the model can be used to estimate the statistical contact resistance at a particular load (normal force), aging and operating temperature in the class II and III environments. An attempt is made to correlate experimental data with the classical Holm’s equation and to introduce time dependence into the equation. Further work is proposed to correlate results with experimental connector performance data.
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December 1993
Research Papers
Modeling the Effects of Mixed Flowing Gas (MFG) Corrosion and Stress Relaxation on Contact Interface Resistance
Shrikar Bhagath,
Shrikar Bhagath
CALCE Electronic Packaging Research Center, University of Maryland, College Park, MD 20742
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Michael G. Pecht
Michael G. Pecht
CALCE Electronic Packaging Research Center, University of Maryland, College Park, MD 20742
Search for other works by this author on:
Shrikar Bhagath
CALCE Electronic Packaging Research Center, University of Maryland, College Park, MD 20742
Michael G. Pecht
CALCE Electronic Packaging Research Center, University of Maryland, College Park, MD 20742
J. Electron. Packag. Dec 1993, 115(4): 404-409 (6 pages)
Published Online: December 1, 1993
Article history
Received:
November 16, 1992
Revised:
August 27, 1993
Online:
April 28, 2008
Citation
Bhagath, S., and Pecht, M. G. (December 1, 1993). "Modeling the Effects of Mixed Flowing Gas (MFG) Corrosion and Stress Relaxation on Contact Interface Resistance." ASME. J. Electron. Packag. December 1993; 115(4): 404–409. https://doi.org/10.1115/1.2909349
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