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Research-Article January 10, 2022
Heat Transfer Analysis of Supercritical Methane in Microchannels with Different Geometric Configurations On High Power Electromechanical Actuator
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4053433
Research-Article January 10, 2022
Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4053432
Technical Briefs December 24, 2021
Simplified and Detailed Analysis of Data Center Particulate Contamination At Server and Room Level Using CFD
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4053363
Research-Article December 24, 2021
Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4053365
Research-Article December 20, 2021
Numerical and Parametric Investigation of the Effect of Heat Spreading On Boiling of a Dielectric Liquid for Immersion Cooling of Electronics
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4053310
Research-Article December 20, 2021
Prediction of Board Level Pad Cratering Strength with the Pre-Defined Failure Criteria From Joint Level Testing
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4053309
Research-Article November 25, 2021
Validation and Parametric Investigations of an Internal Permanent Magnet Motor Using a Lumped Parameter Thermal Model
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4053121
Research-Article October 1, 2021
Remaining Useful Life Estimation and Prognostication of SAC305 PCB's for Dynamic Conditions of Temperature and Vibration Loads
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4052630
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Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation
J. Electron. Packag (June 2022)
Special Issue on InterPACK2020
J. Electron. Packag (June 2022)
