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Just Accepted Manuscript
Research-Article September 29, 2023
Publisher's Note: “Dynamic Modeling Framework for Evaluating Electromagnetic- Electro-Thermal Behavior of Power Conversion System During Load Operation” [ASME J. Electron. Packag., 2023, 145(2), p. 021005; DOI: 10.1115/1.4055591]
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4063546
Research-Article September 29, 2023
Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4063541
Research-Article September 23, 2023
The Resistor Network Approach to Modeling Screen-Printed Silver Ink Under Uniaxial Stretch
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4063485
Technical Briefs September 23, 2023
Machine Learning Analysis of Autonomous Vehicle Sensors Under Extreme Conditions in Alaska
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4063486
Research-Article September 23, 2023
Converging Jet Impingement for Enhanced Liquid Cooling
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4063484
Research-Article September 2, 2023
Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single-Crystals
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4063325
Research-Article June 29, 2023
Automotive Silicon Carbide Power Module Cooling With A Novel Modular Manifold And Embedded Heat Sink
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4062869
Research-Article June 29, 2023
Leadfree Sac Solder Materials Characterization At High Strain Rates At Low Test Temperatures And Drop & Shock Simulation Using Input-G Method
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4062868
