Skip Nav Destination
Just Accepted Manuscript
Technical Briefs January 23, 2023
A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the BoR and PoEF Tests
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4056717
Email alerts
RSS Feeds
Reviewer's Recognition
J. Electron. Packag (June 2023)
Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches
J. Electron. Packag (September 2023)
Special Section on InterPACK2021
J. Electron. Packag (March 2023)