Skip Nav Destination
ASME Press Select Proceedings
International Conference on Instrumentation, Measurement, Circuits and Systems (ICIMCS 2011)
By
ISBN:
9780791859902
No. of Pages:
1400
Publisher:
ASME Press
Publication date:
2011
eBook Chapter
55 Spot-Based Group Network Architecture in Heterogeneous Mobile Devices for Smart Mobile Services
By
Yu-Doo Kim
,
Yu-Doo Kim
Korea University of Technology and Education (KUT)
Search for other works by this author on:
Il-Young Moon
Il-Young Moon
Korea University of Technology and Education (KUT)
Search for other works by this author on:
Page Count:
4
-
Published:2011
Citation
Kim, Y, & Moon, I. "Spot-Based Group Network Architecture in Heterogeneous Mobile Devices for Smart Mobile Services." International Conference on Instrumentation, Measurement, Circuits and Systems (ICIMCS 2011). Ed. Ming, C. ASME Press, 2011.
Download citation file:
We propose the P2P chord service overlay network model to provide services and make sharing resources among mobile devices easy. The proposed SGN (Spot-based Group Network) has hierarchical service delivery network architecture. It delivers services and resources among distributed mobile devices. We suggested three business models which are plausible ubiquitous service architectures.
Abstract
Keywords:
Introduction
Architecture of Spot-Based Service Model
Service Scenario
Simulation
Conclusion
Acknowledgments
References
This content is only available via PDF.
You do not currently have access to this chapter.
Email alerts
Related Chapters
IEL: A New Localization Algorithm for Wireless Sensor Network
International Conference on Instrumentation, Measurement, Circuits and Systems (ICIMCS 2011)
Committee Network Model for HDD Functional Tests
Intelligent Engineering Systems through Artificial Neural Networks, Volume 20
Effects of Network Structure on Public Opinion Development (PSAM-0116)
Proceedings of the Eighth International Conference on Probabilistic Safety Assessment & Management (PSAM)
Sznajd Social Model on Weighted Network with Improved Rules
International Conference on Advanced Computer Theory and Engineering (ICACTE 2009)
Related Articles
Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 2—With Underfill
J. Electron. Packag (December,1999)
Latent Heat Fluxes Through Soft Materials With Microtruss Architectures
J. Heat Transfer (April,2008)
A Deep Convolutional Neural Network-Based Method for Self-Piercing Rivet Joint Defect Detection
J. Comput. Inf. Sci. Eng (April,2024)