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Keywords: solder
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Journal Articles
Publisher: ASME
Article Type: Launch Dynamics
J. Appl. Mech. May 2013, 80(3): 031502.
Paper No: JAM-12-1360
Published Online: April 19, 2013
...L. E. Reinhardt; J. A. Cordes; A. S. Haynes; J. D. Metz Accurate modeling of the response of an electronic assembly including chips, circuit boards, and potting require the inclusion of solder pads for dynamic analyses. When the solder pads are not included and the chips are tied directly...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. January 2010, 77(1): 011008.
Published Online: September 30, 2009
...Fei Qin; Tong An; Na Chen As traditional lead-based solders are banned and replaced by lead-free solders, the drop impact reliability is becoming increasingly crucial because there is little understanding of mechanical behaviors of these lead-free solders at high strain rates. In this paper...