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Keywords: electronics
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. May 2023, 90(5): 051005.
Paper No: JAM-22-1379
Published Online: January 23, 2023
... ) in the preliminary analysis. thin films cohesive zone modeling debonding electronics failure criteria structures National Natural Science Foundation of China 10.13039/501100001809 11521202 11890681 12032001 We may all have the experience of unsuccessfully trying to stick a thin film...
Journal Articles
Publisher: ASME
Article Type: Launch Dynamics
J. Appl. Mech. May 2013, 80(3): 031502.
Paper No: JAM-12-1360
Published Online: April 19, 2013
...L. E. Reinhardt; J. A. Cordes; A. S. Haynes; J. D. Metz Accurate modeling of the response of an electronic assembly including chips, circuit boards, and potting require the inclusion of solder pads for dynamic analyses. When the solder pads are not included and the chips are tied directly...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. May 2012, 79(3): 031022.
Published Online: April 5, 2012
...Shuodao Wang; Ming Li; Jian Wu; Dae-Hyeong Kim; Nanshu Lu; Yewang Su; Zhan Kang; Yonggang Huang; John A. Rogers Epidermal electronic system (EES) is a class of integrated electronic systems that are ultrathin, soft, and lightweight, such that it could be mounted to the epidermis based on van der...