An analytical model describing thin film evaporation is developed that includes the effects of surface tension, frictional shear stress, wetting characteristics and disjoining pressure. The effects of thermal conductivity of working fluids and operating temperature on the evaporating thin film region are also studied. The results indicate that when the thermal conductivity of the working fluid increases, a high heat flux can be removed from the evaporating thin film region. The operating temperature affects the thin film evaporation. The higher the operating temperature, the more heat flux can be removed from the region. The information of thin film evaporation presented in the paper results in a better understanding of heat transfer mechanism occurring in micro heat pipes.
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ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer
June 6–9, 2008
Tainan, Taiwan
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-4292-4
PROCEEDINGS PAPER
Thermal Conductivity and Operating Temperature Effect on the Interline Region in a Micro/Miniature Heat Pipe
Hani H. Sait,
Hani H. Sait
Jeddah College of Technology, Jeddah, Saudi Arabia
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Steve M. Demsky,
Steve M. Demsky
University of Missouri, Columbia, MO
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HongBin Ma
HongBin Ma
University of Missouri, Columbia, MO
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Hani H. Sait
Jeddah College of Technology, Jeddah, Saudi Arabia
Steve M. Demsky
University of Missouri, Columbia, MO
HongBin Ma
University of Missouri, Columbia, MO
Paper No:
MNHT2008-52043, pp. 941-962; 22 pages
Published Online:
June 22, 2009
Citation
Sait, HH, Demsky, SM, & Ma, H. "Thermal Conductivity and Operating Temperature Effect on the Interline Region in a Micro/Miniature Heat Pipe." Proceedings of the ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer. ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B. Tainan, Taiwan. June 6–9, 2008. pp. 941-962. ASME. https://doi.org/10.1115/MNHT2008-52043
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