The interaction between the damage state and the thermal conductivity is studied in this paper. The damage propagation and the effective thermal conductivity of the damaged continuum is studied using equilibrium molecular dynamics (EMD) method based on the Green-Kubo relation. A solid gold lattice is considered and the damage is initiated and propagated by stretching two opposite ends while system is maintained at constant volume, constant temperature (NVT) condition. Both Lennard-Jones (LJ) 6–12 and embedded-atom method (EAM) potentials are used to model the inter-atomic interactions. Results are presented illustrating the load-displacement relationship during damage growth and the thermal conductivity change behavior for a selected crack length.
Skip Nav Destination
2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems
June 3–5, 2008
Clear Water Bay, Kowloon, Hong Kong
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-4294-0
PROCEEDINGS PAPER
Molecular Dynamics Modeling of Thermal Transport in Damaged Continua
Navin Kumar,
Navin Kumar
Stevens Institute of Technology, Hoboken, NJ
Search for other works by this author on:
Kishore Pochiraju
Kishore Pochiraju
Stevens Institute of Technology, Hoboken, NJ
Search for other works by this author on:
Navin Kumar
Stevens Institute of Technology, Hoboken, NJ
Kishore Pochiraju
Stevens Institute of Technology, Hoboken, NJ
Paper No:
MicroNano2008-70070, pp. 297-302; 6 pages
Published Online:
June 12, 2009
Citation
Kumar, N, & Pochiraju, K. "Molecular Dynamics Modeling of Thermal Transport in Damaged Continua." Proceedings of the 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems. 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems. Clear Water Bay, Kowloon, Hong Kong. June 3–5, 2008. pp. 297-302. ASME. https://doi.org/10.1115/MicroNano2008-70070
Download citation file:
6
Views
Related Proceedings Papers
Related Articles
Equilibrium Molecular Dynamics Study of Lattice Thermal Conductivity/Conductance of Au-SAM-Au Junctions
J. Heat Transfer (March,2010)
In-Plane and Out-Of-Plane Thermal Conductivity of Silicon Thin Films Predicted by Molecular Dynamics
J. Heat Transfer (November,2006)
Molecular Dynamics Study of Solid Thin-Film Thermal Conductivity
J. Heat Transfer (August,2000)
Related Chapters
Concluding Remarks and Future Work
Ultrasonic Welding of Lithium-Ion Batteries
Influence of Defects in Body-Centered Cubic Iron on Simulated Low-Energy Displacement Cascades
Properties of Reactor Structural Alloys After Neutron or Particle Irradiation
Thermodynamic Performance
Closed-Cycle Gas Turbines: Operating Experience and Future Potential