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Keywords: power electronics
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Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A001, October 25–27, 2022
Paper No: IPACK2022-96635
... using a 200 W resistive heater to emulate a hot spot generated in high-power electronics. It is observed that the introduction of inclined and parallel jets can have the simultaneous effect of increasing heat transfer and creating more predictable heat transfer. Keywords: Jet impingement, power...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A003, October 25–27, 2022
Paper No: IPACK2022-97283
... jet impingement power electronics thermal management wide bandgap Abstract This project describes the modeling process to design the packaging and heat exchanger for a half-bridge wide-bandgap (WBG) power semiconductor module. The module uses two silicon carbide, metal-oxide...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A004, October 25–27, 2022
Paper No: IPACK2022-97355
... power electronics multiphysics optimization double-sided cooling finite element analysis Abstract With the rapid growth of electric vehicles and hybrid electric vehicles, rigorous design targets in terms of cost, efficiency, and power density have been set for automotive power...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A002, October 26–28, 2021
Paper No: IPACK2021-69511
... to the existing grid requires the available materials providing thermal conductivities of 6.5 and widespread implementation of decentralized points of power 8.0 W/m-K. HALT specimen were prepared by applying TIM generation. Broadly, utilizing power electronics modules through a 4-mil stencil over AlSiC baseplates...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A013, October 27–29, 2020
Paper No: IPACK2020-2606
... Research Laboratory, Adelphi, MD ABSTRACT The increasing demand for high power density wide- bandgap power electronics has propelled heat transfer research leading to a constant increase in the thermal performance of cold plates and heat sinks. Most of this research has focused on reducing thermal...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A030, October 7–9, 2019
Paper No: IPACK2019-6631
... simulation for the converter design ranging from the die level up to the full system with 36 submodules. The modeling results were validated against experimental data from system tests performed by OSU. Keywords: Power Electronics, Thermal Modeling, Porous Media, Model Simplification, Effectiveness-NTU...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A023, October 7–9, 2019
Paper No: IPACK2019-6519
... by these devices, the packaging, including cooling infrastructure, must also be addressed. Additive manufactured (AM) structures, based on unit cells seen in stochastic foams, have been investigated as an improvement in thermal management for electric vehicle power electronics. Metal foams have a high specific...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A014, October 7–9, 2019
Paper No: IPACK2019-6440
...INTEGRATED OPTICAL PROBING OF THE THERMAL DYNAMICS OF WIDE BANDGAP POWER ELECTRONICS James Spencer Lundh1, Yiwen Song1, Bikram Chatterjee1, Albert G. Baca2, Robert J. Kaplar2, Andrew M. Armstrong2, Andrew A. Allerman2, Hyungtak Kim3, and Sukwon Choi1 1Department of Mechanical Engineering...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A026, October 7–9, 2019
Paper No: IPACK2019-6559
...Abstract Abstract Thermal management of high-power electronics is often a major obstacle in achieving improved packaging density. Emergence of SiC devices allows higher voltage and temperature limits, but thermal management is still a bottleneck in achieving compact, reliable and high...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A017, October 7–9, 2019
Paper No: IPACK2019-6453
... Graham Georgia Institute of Technology Atlanta, Georgia ABSTRACT Gallium oxide is an emerging wide band-gap material that has the potential to penetrate the power electronics market in the near future. In this paper, a finite-element gallium oxide semiconductor model is presented that can predict...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 577-589, July 17–22, 2005
Paper No: IPACK2005-73407
... industry in exploring jet impingement as an option for cooling power electronics components. The main purpose of this paper is to compare the different single-phase jet impingement configurations, which have been reported in the literature, primarily from a heat transfer viewpoint. The discussion is also...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 425-430, July 17–22, 2005
Paper No: IPACK2005-73284
... scale power electronics. The system is thermally optimized to reach high COP (Coefficients of Performance). An array of micro-channels is used for the evaporator/condenser units. A previous study indicated that the R-134s refrigerant provides the best COP/feasibility ratio, while being the most suitable...