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Proceedings Papers

Parametric Study of Silicon-Based Embedded Microchannels With 3D Manifold Coolers (EMMC) for High Heat Flux (~1 kW/cm 2 ) Power Electronics Cooling

Ki Wook Jung, Sougata Hazra, Heungdong Kwon, Alisha Piazza, Edward Jih, Mehdi Asheghi, Man Prakash Gupta, Mike Degner, Kenneth E. Goodson
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A021, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6472
https://doi.org/10.1115/IPACK2019-6472
..., could enable higher power density that allows increase in the inverter peak power output. In the present work, we have conducted a parametric study on geometric dimensions of the EMMCs to analyze thermofluidic performance by using computational fluid dynamics (CFD) simulations. The study was conducted...
View Paper titled, <span class="search-highlight">Parametric</span> <span class="search-highlight">Study</span> of Silicon-Based Embedded Microchannels With 3D Manifold Coolers (EMMC) for High Heat Flux (~1 kW&#x2F;cm 2 ) Power Electronics Cooling
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Topics: Computational fluid dynamics, Computer cooling, Coolers, Heat flux, Manifolds, Microchannels, Silicon, Water
Proceedings Papers

Parametric and Sensitivity Analysis of Power Module Design

L. M. Boteler, M. C. Fish, M. S. Berman
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A029, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6592
https://doi.org/10.1115/IPACK2019-6592
... power modules and determining whether to integrate novel technologies. co-design co-engineering parametric study thermal analysis 3D network Parametric and Sensitivity Analysis of Power Module Design L. M. Boteler, M. C. Fish, M. S. Berman U.S. Army Research Laboratory Adelphi, MD, USA...
View Paper titled, Parametric and Sensitivity Analysis of Power Module Design
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Topics: Design, Sensitivity analysis