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Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 445-450, July 17–22, 2005
Paper No: IPACK2005-73293
... for facilitating the introduction of liquid-cooling systems for future low-profile servers.   This paper was also originally published as part of the Proceedings of the ASME 2005 Heat Transfer Summer Conference . microprocessor cooling heat sink fan blower air cooling cold plate liquid cooling...
Topics: Cooling