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Keywords: computer cooling
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Proceedings Papers

Experimental Study of a Set of Integrated Cross-Media Heat Exchangers (iCMHXs) for Liquid Cooling in Desktop Computers

Gargi Kailkhura, Raphael Mandel, Amir Shooshtari, Michael Ohadi
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A006, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2591
https://doi.org/10.1115/IPACK2020-2591
... post-processing approaches such as by using a thinned sealant and by using a single layer of sealant. computer cooling additive manufacturing air-to-liquid cooler staggered tube-banks experiment polyurethane coating CFD Experimental Study of a Set of Integrated Cross-Media Heat...
View Paper titled, Experimental Study of a Set of Integrated Cross-Media Heat Exchangers (iCMHXs) for Liquid Cooling in Desktop Computers
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Topics: Additive manufacturing, Computational fluid dynamics, Computers, Cooling, Heat exchangers, Urethane elastomers, Sealants, Wire, Fluids, Calibration
Proceedings Papers

Advanced Micro-Channel Vapor Chamber for Cooling High Power Processors

Masataka Mochizuki, Yuji Saito, Fumitoshi Kiyooka, Thang Nguyen, Tien Nguyen, Vijit Wuttijumnong
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 695-702, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33611
https://doi.org/10.1115/IPACK2007-33611
...-channel Computer cooling Fan heat sink Proceedings of IPACK2007 ASME InterPACK 07 July 8-12, 2007, Vancouver, British Columbia, CANADA Copyright @ 2007 by ASME 1 IPACK2007-33611 ADVANCED MICRO-CHANNEL VAPOR CHAMBER FOR COOLING HIGH POWER PROCESSORS Masataka Mochizuki Yuji Saito, Fumitoshi Kiyooka...
View Paper titled, Advanced Micro-Channel Vapor Chamber for Cooling High Power Processors
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Topics: Cooling, Heat pipes, Microchannels, Vapors
Proceedings Papers

Revolution in Fan Heat Sink Cooling Technology to Extend and Maximize Air Cooling for High Performance Processors in Laptop / Desktop / Server Application

Masataka Mochizuki, Yuji Saito, Thang Nguyen, Vijit Wuttijumnong, Xiaoping Wu, Tien Nguyen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 431-437, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73286
https://doi.org/10.1115/IPACK2005-73286
... its performance. Included in this paper are the design, data, photos and discussion of various fan sink air cooling designs showing how the design changes can push the limit of the air cooling capability. 03 04 2009 Heat pipe Vapor chamber Computer cooling Fan heat sink...
View Paper titled, Revolution in Fan Heat Sink Cooling Technology to Extend and Maximize Air Cooling for High Performance Processors in Laptop / Desktop / Server Application
Open the PDF for Revolution in Fan Heat Sink Cooling Technology to Extend and Maximize Air Cooling for High Performance Processors in Laptop / Desktop / Server Application in another window
Topics: Cooling, Heat pipes, Heat sinks, Laptop computers, Vapors, Energy dissipation, Heat, Clocks, Design, Heat flux