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Keywords: computational fluid dynamics (CFD)
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Proceedings Papers

Parametric Study of Silicon-Based Embedded Microchannels With 3D Manifold Coolers (EMMC) for High Heat Flux (~1 kW/cm 2 ) Power Electronics Cooling

Ki Wook Jung, Sougata Hazra, Heungdong Kwon, Alisha Piazza, Edward Jih, Mehdi Asheghi, Man Prakash Gupta, Mike Degner, Kenneth E. Goodson
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A021, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6472
https://doi.org/10.1115/IPACK2019-6472
..., could enable higher power density that allows increase in the inverter peak power output. In the present work, we have conducted a parametric study on geometric dimensions of the EMMCs to analyze thermofluidic performance by using computational fluid dynamics (CFD) simulations. The study was conducted...
View Paper titled, Parametric Study of Silicon-Based Embedded Microchannels With 3D Manifold Coolers (EMMC) for High Heat Flux (~1 kW/cm 2 ) Power Electronics Cooling
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Topics: Computational fluid dynamics, Computer cooling, Coolers, Heat flux, Manifolds, Microchannels, Silicon, Water
Proceedings Papers

Computational Fluid Dynamics Investigation on FCBGA Die Bulk Penetrating Cracks After Thermal Shock Test

Kuo-Ying Tsai, Shih-Chang Ku
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 143-149, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33585
https://doi.org/10.1115/IPACK2007-33585
... A crack with unusual failure mode after thermal shock test (TST) is observed on the die bulk of certain bare-die FCBGA, in which the crack penetrates longitudinally within silicon die region. The computational fluid dynamics (CFD) method is introduced to investigate this phenomenon...
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Topics: Computational fluid dynamics, Fracture (Materials), Thermal shock
Proceedings Papers

A Hybrid Methodology for the Optimization of Data Center Room Layout

Shrishail Guggari, Dereje Agonafer, Christian Belady, Lennart Stahl
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 605-612, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35273
https://doi.org/10.1115/IPACK2003-35273
... center. In this paper, first an under floor analysis is done to find an optimized layout based on flow distribution through perforated tiles, then a complete Computational Fluid Dynamics (CFD) model of the data center facility is done to check for desired cooling and air flow distribution throughout...
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Topics: Computational fluid dynamics, Data centers, Optimization