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Keywords: cold plate
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Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A016, October 26–28, 2021
Paper No: IPACK2021-73954
...) and cold plate with different fin Tapproach Package Case Temperature designs. Thermal simulations were conducted and correlated Tc Temperature, Inlet to the cold plate with experimental data. The concept of power density approach Tin Temperature, Outlet from the cold plate is introduced for predicting...
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A053, July 16–18, 2013
Paper No: IPACK2013-73294
... COMBINING COMPUTATIONAL FLUID DYNAMICS (CFD) AND FLOW NETWORK MODELING (FNM) FOR DESIGN OF A MULTI-CHIP MODULE (MCM) COLD PLATE John Fernandes University of Texas at Arlington Arlington, TX, USA Saeed Ghalambor University of Texas at Arlington Arlington, TX, USA Akhil Docca Future Facilities Inc...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 389-394, July 19–23, 2009
Paper No: InterPACK2009-89144
...Proceedings of IPACK2009 ASME InterPACK 09 July 19-23, 2009, San Francisco, CA, USA Copyright @ 2009 by ASME 1 IPACK2009-89144 APPLICATION OF MICRO-CHANNEL FIN FOR COLD PLATE OF LIQUID COOLING SYSTEM AND VAPOR CHAMBER Koichi Mashiko, Masataka Mochizuki, Yuji Saito, Yasuhiro Horiuchi, Thang Nguyen...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 445-450, July 17–22, 2005
Paper No: IPACK2005-73293
...-cooled systems. One method to reduce cost is to use fabricate the cold plate using heatsink manufacturing techniques. Case studies are presented to show liquid-cooling with these lower cost cold plates can provide performance that exceeds air-cooling solutions. Finally, suggestions are offered...
Topics: Cooling