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Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 381-388, July 8–12, 2007
Paper No: IPACK2007-33846
... cooling, have the capability to remove the heat from the chips and maintain uniform junction temperatures. For the best possible performance, the contribution of bubbles in the flow must be better understood. Near a heat transfer surface, a temperature gradient exists in the flow. At the surface...