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Keywords: additive manufacturing
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Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112012
... attachment in FHE. Such insights can aid in the development of reliable and efficient interconnectivity methods for FHE, which can contribute to the widespread adoption of FHE in various industries. additive manufacturing flexible electronics bonding materials direct write Proceedings of the ASME...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112001
...-mount components to printed pads. flexible hybrid electronic direct write polyimide additive manufacturing active lowpass filter Proceedings of the ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2023...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A001, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-109991
... the benefits of a pumped two-phase cooling with a capillary-driven two-phase cooling. The significance of the present study is to fabricate the CP integrated with evaporator wicks through one single additive manufacturing (AM) process. The CP was a compact enclosure including eight heaters located on both...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111725
... is needed to improve their reliability and performance. Thanks to the advancement of additive manufacturing, it is possible to investigate the heat-removal efficiency of various cold plate designs that are not achievable using conventional manufacturing. In this study, several water-cooled cold plate...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111312
.... drop testing printed hybrid electronics printed silver traces additive manufacturing reliability of electronics Proceedings of the ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2023 October 24-26, 2023...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111895
... shock amplifiers (DMSAs). Testing was completed at accelerations from 10,000 G up to 100,000 G with pulse durations of ∼0.05–0.1 ms and impact velocities of 6.5–20.5 m/s. The test samples were hemispherical domes fabricated using: (a) additive manufacturing with several different ABS compounds, and (b...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111575
... dissipates higher heat flux but also reduces power consumption of the chip by significantly lowering the chip operating temperature. In this work, the oblique-fin cold plate was fabricated using a hybrid manufacturing technique, whereby the fins were additively manufactured (AM) directly on a solid machined...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111958
... that the electrical properties are improved by varying these parameters, and optical methods have also been used to characterize the results of the printed trace and fitted regression models that have been developed for process optimization. Keywords: Additive manufacturing, process performance interaction, silver...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111957
... with the mechanical performance and optical methods have also been used to characterize the results of the printed trace. additive manufacturing process development water-based silver ink aerosol jet nScrypt surface mounted component electrical circuit Proceedings of the ASME 2023 International...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-96635
... investigation is performed as a point of comparison using a modular, additively manufactured jet setup. Thermal energy is applied to an aluminum base plate using a 200 W resistive heater to emulate a hot spot generated in high-power electronics. It is observed that the introduction of inclined and parallel jets...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97382
... was at the threads used for mounting to the fixture. drop testing shock resistance additive manufacturing hybrid printed electronics Proceedings of the ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2022 October 25...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97476
... Abstract This study focuses on a topology-based design approach that can be applied to liquid-cooled heat sinks for high-heat-flux devices with the goal of improving heat dissipation and manufacturability. Specifically, the study investigates the use of additively manufactured topology-based...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A025, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74199
... Abstract Re-distribution layer (RDL) is one key enabling technology for advance packaging. RDL is usually fabricated in wafer level by photolithography process. An alternative approach for implementing RDL by additive manufacturing (AM) method is proposed in this study. This allows RDL...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A012, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73367
... Abstract Additive manufacturing is rapidly revolutionizing the way products are designed and built. Its advantages in terms of mobile manufacturing, mass customization, part reduction, waste reduction, and just-in-time sparing are causing it to be considered for many electronics applications...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A003, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2532
... Abstract Significant levels of heat are generated in contemporary electronics, and next generation devices will continue to demand higher power despite decreasing size; therefore, highly effective cooling schemes are needed. Simultaneously, advances in metal additive manufacturing have enabled...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A010, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2596
... approach which involves an increased number of fabrication steps depending on the complexity of the structures. This current study involves the fabrication of these structures using a different approach, utilizing additive manufacturing that reduces the number of fabrication steps required to obtain...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A006, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2591
... Abstract The present study is an experimental investigation of a set of five additively-manufactured compact, lightweight, low-cost, air-to-water cross-media heat exchangers suitable for liquid cooling applications in desktop computers, among other applications. The heat transfer between...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6356
... Abstract AM (Additive manufacturing) technology has huge demand from industry for its high-speed fabricating, ability of fabricating complex shapes and low-cost fabrication which does not require expensive equipment such as molds. In particular, resolution of stereolithography technology...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A023, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6519
... in volume. To fully take advantage of the benefits offered by these devices, the packaging, including cooling infrastructure, must also be addressed. Additive manufactured (AM) structures, based on unit cells seen in stochastic foams, have been investigated as an improvement in thermal management...