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Keywords: Thermal Resistance
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Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 26–28, 2021
Paper No: IPACK2021-74010
... conceptualizes a single-phase microchannel serpentine microchannel, thermal management, thermal resistance, pumping power heat sink for thermal management of concentrated photovoltaic cells; details of the model-based parametric study that is carried NOMENCLATURE out on the heat sink is also detailed...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, October 27–29, 2020
Paper No: IPACK2020-2569
...Abstract Abstract Frost formation on evaporators negatively affects the cooling performance of refrigerators. It increases the thermal resistance between the refrigerant and air leading to a reduction in the system cooling capacity. In this study, the effect of frost accumulation over a bare...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A008, October 27–29, 2020
Paper No: IPACK2020-2627
... that the thermal resistance of pin-fins/multi-jet heat sink was reduced by 29.4 % as compared to original microchannel/multi- jet heat sink and without changing pressure drop significantly. In this specific heat sink design, the combination of multiple jets and pin fins leads to improvement of thermal performance...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A009, October 7–9, 2019
Paper No: IPACK2019-6416
... structure at the interface, which indicated the formation of voids due to TIM degradation. Applying this testing method for future TIM development could help in optimizing TIM structure for particular package applications. mechanical cycling TIMs accelerated test thermal resistance THERMO...
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A018, July 16–18, 2013
Paper No: IPACK2013-73087
...-expansion composites. KEYWORDS: heat spreader, heat pipe, vapor chamber, thermal resistance, sintered powder wick, high-g environment NOMENCLATURE Thermal resistance (°C/W) : Calibrated resistor temperature (°C) : Coolant inlet temperature (°C) . : Temperature in Al block below resistor (°C) Heat...
Topics: Flat heat pipes
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 213-220, July 6–8, 2011
Paper No: IPACK2011-52122
... by combining scaled-down sintered Cu powder and nanostructured materials in the vapor chamber wick to achieve low thermal resistance. Cu-coated vertically aligned carbon nanotubes is the nanostructure of choice in this development. Unique design and construction techniques are employed to achieve CTE-matching...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 761-767, July 19–23, 2009
Paper No: InterPACK2009-89110
... fluctuations per transient cycle). A correlation to predict the peak temperatures reached by the dynamic system after a long number of powering cycles is provided. Keywords - transient, thermal, numerical simulation, thermal resistance, dynamic, IC motor driver Nomenclature DUT Device Under Test HS Heat Source...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 921-927, July 19–23, 2009
Paper No: InterPACK2009-89337
... with and without phosphors are evaluated in terms of their thermal resistance and reliability under wet high temperature operation life (WHTOL) test. The WHTOL test is with the condition of 85°C/85% RH and 350mA of forward current for 1008 hrs, specified in JESD22 Method A101-B. First of all, the thermal behaviors...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 581-587, July 8–12, 2007
Paper No: IPACK2007-33698
... transfer experiments coefficient of performance thermal resistance 1 Copyright © 2007 by ASME Proceedings of IPACK2007 ASME InterPACK '07 July 8-12, 2007, Vancouver, British Columbia, CANADA IPACK2007-33698 AN INTEGRATED THERMOELECTRIC NANOFLUID HEAT EXCHANGER William Rutherford, Wessam Elomar, A. G...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 205-212, July 8–12, 2007
Paper No: IPACK2007-33281
... 12 01 2010 An effective semi-empirical method that combines thermal network models and empirical correlations for exploring the thermal performance of heat sinks and HS/TEC assemblies under different external thermal resistances is successfully established. A series of parametric...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 213-220, July 8–12, 2007
Paper No: IPACK2007-33285
... performance correlations of the temperature difference (Δ T ) and terminal voltage ( V ) of the TEC modules are proposed. Besides, two new correlations of steady-state average Nusselt number and external thermal resistance in terms of relevant influencing parameters for confined ppf heat sinks in a ducted...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 233-239, July 8–12, 2007
Paper No: IPACK2007-33705
.... A thorough study of the transient patterns and needed system improvements are included. Keywords - transient, thermal, numerical simulation, thermal resistance, dynamic, IC driver Nomenclature DUT Device Under Test HS Heat Source k Thermal conductivity (W/mK) P Power dissipation (W) FET Field Effect...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 365-372, July 17–22, 2005
Paper No: IPACK2005-73262
... . Server cooling Heat exchanger Thermo-syphon Thermal resistance Micro-channel Proceedings of IPACK2005 ASME InterPACK '05 channels advantag Keyword Server c resistanc INTROD Rack introduct more po appear to cooled b through rack can dissipatin in the ra chassis h1 Copyright © 2005by ASME...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 385-391, July 17–22, 2005
Paper No: IPACK2005-73268
... for the effective thermal resistance of a PCB and captures an approximate 2-dimensional temperature distribution within the PCB copper layer using simple one-dimensional fin equations in successive copper-glass epoxy layers. The results for effective thermal resistance and temperature distributions in copper layers...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 655-662, July 17–22, 2005
Paper No: IPACK2005-73457
.... The evaporation resistances of these two surfaces vary from 0.12 to 0.26 K/W. The minimum evaporation resistance of the best cross-grooved surface was 0.125 K/W at 86.5 W. Because the evaporator area is much smaller than the condenser or the heat sink area, the thermal resistance is dominated by the evaporator...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 43-50, July 17–22, 2005
Paper No: IPACK2005-73040
... enhancement structure microchannels metallic foam thermal resistance pressure drop Proceedings of IPACK2005 ASME InterPACK '05 K m dr In Th pa co ac m ev de co 1m he is Proceedings of IPACK2005 ASME InterPACK '05 July 17-22, San Francisco, California, USA1 eywords: liquid cooling, enhancement...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 221-227, July 6–11, 2003
Paper No: IPACK2003-35102
... in contact with the devices to be cooled is measured together with the air temperature and flow, by varying the air flow rate. The pressure drop in the air through the heat sinks is also measured. The thermal resistance of the disspators is then calculated and compared to that of commercially available heat...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 325-333, July 6–11, 2003
Paper No: IPACK2003-35095
..., and the evaporator, adiabatic and condensation resistances of the heat pipe were calculated separated. The effects of mesh size, charge volume, and inclination angle on each thermal resistance were discussed. In general, the #80 mesh yields lower thermal resistances than the #50 mesh; inclination angle has more...