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Keywords: Optimization
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Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A041, July 16–18, 2013
Paper No: IPACK2013-73194
... This paper presents the multi-objective optimization of cost-effective pinfin heatsinks. Heat transfer rate and pressure drop were the objective functions, and four parameters (height, diameter, longitudinal pitch, and transverse pitch) were the design variables. The relationship between...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 963-972, July 19–23, 2009
Paper No: InterPACK2009-89310
... with a comprehensive consideration of cost and thermal performance. A numerical simulation model is developed and validated against testing results. With the verified model, effects of fin arrangement on heat sink performance are analyzed. A study is conducted for optimization of base plate and fin thickness...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 605-614, July 19–23, 2009
Paper No: InterPACK2009-89376
... and charge are considered one-dimensional. thermoelectric module TEM thermoelectric cooler TEC refrigeration optimization coefficient of performance COP Proceedings of IPACK2009 InterPACK 09 July 19-July 23, 2009, San Francisco, USA IPACK2009-89376 OPTIMAL PELLET GEOMETRIES FOR THERMOELECTRIC...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 37-42, July 8–12, 2007
Paper No: IPACK2007-33503
... a sensor have on its dynamics — using this process dynamic characteristics of a sensor can be optimized by constraining its nominal dimensions and finding the optimum set of uncertainties in these dimensions that best satisfy design requirements/specifications) and the optoelectronic methodology...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 937-943, July 8–12, 2007
Paper No: IPACK2007-33857
.... The thermal cycling performance of the three sets of assemblies was found to be equivalent after 6000 cycles. Lead-free Pb-free Wave Soldering SAC DPA Optimization RoHS Proceedings of IPACK2007 ASME InterPACK '07 July 8-12, 2007, Vancouver, British Columbia, CANADA IPACK2007-33857 PB-FREE...