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Keywords: Ceramic substrate
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Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 429-436, July 6–8, 2011
Paper No: IPACK2011-52290
... 15 02 2012 The concept of micro-electro-mechanical systems (MEMS) sensors directly fabricated on a ceramic substrate, which can be used for a package of end product, was proposed. As demonstrations of the sensors directly fabricated on a ceramic package, an accelerometer...