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Proceedings Papers

Indentation Induced Tin Whisker Formation on Tin Plated Component Leads

Jin Liang, Xiaodong Li, Zhi-Hui Xu, Dongkai Shangguan
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1199-1205, July 17–22, 2005
Paper No: IPACK2005-73233
https://doi.org/10.1115/IPACK2005-73233
View Paper titled, Indentation Induced Tin Whisker Formation on Tin Plated Component Leads
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Topics: Coating processes, Coatings, Deformation, Elastic moduli, Finishes, Finite element analysis, Nanoindentation, Nucleation (Physics), Plating, Reliability
Proceedings Papers

A New Modified Crack Surface Displacement Extrapolation Method for Analysis of Package Delamination

Guojun Hu, Andrew A. O. Tay
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1207-1213, July 17–22, 2005
Paper No: IPACK2005-73238
https://doi.org/10.1115/IPACK2005-73238
View Paper titled, A New Modified Crack Surface Displacement Extrapolation Method for Analysis of Package Delamination
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Topics: Delamination, Displacement, Fracture (Materials), Reflow soldering, Vapor pressure, Density, Diffusion (Physics), Lead-free solders, Solders, Stress
Proceedings Papers

Damage Path Simulation of Solder Joints in QFP

Minoru Mukai, Kenji Hirohata, Hiroyuki Takahashi, Takashi Kawakami, Kuniaki Takahashi
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1215-1221, July 17–22, 2005
Paper No: IPACK2005-73297
https://doi.org/10.1115/IPACK2005-73297
View Paper titled, Damage Path Simulation of Solder Joints in QFP
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Topics: Damage, Simulation, Solder joints, Crack propagation, Electronic packages, Solders, Design, Fatigue cracks, Fracture (Materials), Cycles
Proceedings Papers

SnAgCu Micro-Ball Grid Array (BGA) Solder Joint Evaluation Using a Torsion Mechanical Fatigue Test Method

Claire Ryan, Bryan A. Rodgers, Jeff M. Punch
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1223-1228, July 17–22, 2005
Paper No: IPACK2005-73318
https://doi.org/10.1115/IPACK2005-73318
View Paper titled, SnAgCu Micro-Ball Grid Array (BGA) Solder Joint Evaluation Using a Torsion Mechanical Fatigue Test Method
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Topics: Ball-Grid-Array packaging, Fatigue testing, Solder joints, Torsion, Cycles, Failure, Solders, Chain, Copper, Electronic equipment
Proceedings Papers

A New Method for Evaluating Fatigue Life of Micro-Solder Joints in Semiconductor Structures

Hisashi Tanie, Takeshi Terasaki, Yasuhiro Naka
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1229-1235, July 17–22, 2005
Paper No: IPACK2005-73331
https://doi.org/10.1115/IPACK2005-73331
View Paper titled, A New Method for Evaluating Fatigue Life of Micro-Solder Joints in Semiconductor Structures
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Topics: Fatigue life, Semiconductors (Materials), Solders, Crack propagation, Fracture (Materials), Ball-Grid-Array packaging, Solder joints, Surface mount devices, Diluents, Damage
Proceedings Papers

Evolution of Die Stress and Delamination During Thermal Cycling of Flip Chip Assemblies

M. Kaysar Rahim, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1237-1252, July 17–22, 2005
Paper No: IPACK2005-73348
https://doi.org/10.1115/IPACK2005-73348
View Paper titled, Evolution of Die Stress and Delamination During Thermal Cycling of Flip Chip Assemblies
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Topics: Delamination, Flip-chip assemblies, Stress, Flip-chip, Flip-chip devices, Sensors, Silicon, Cycles, Manufacturing, Solder joints
Proceedings Papers

Measurement of Electronic Packaging Material Behavior and Flip Chip Die Stresses at Extreme Low Temperatures

M. Kaysar Rahim, Jeffrey C. Suhling, Richard C. Jaeger, M. Saiful Islam, Hongtao Ma, Chang Lin, Pradeep Lall, Roy Knight, Mark Strickland, Jim Blanche
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1253-1262, July 17–22, 2005
Paper No: IPACK2005-73349
https://doi.org/10.1115/IPACK2005-73349
View Paper titled, Measurement of Electronic Packaging Material Behavior and Flip Chip Die Stresses at Extreme Low Temperatures
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Topics: Electronic packaging, Flip-chip, Flip-chip devices, Low temperature, Stress, Temperature, Finite element model, Flip-chip assemblies, Modeling, Packaging
Proceedings Papers

Determination of the Anand Viscoplasticity Model Constants for SnAgCu

Bryan Rodgers, Ben Flood, Jeff Punch, Finbarr Waldron
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1263-1270, July 17–22, 2005
Paper No: IPACK2005-73352
https://doi.org/10.1115/IPACK2005-73352
View Paper titled, Determination of the Anand Viscoplasticity Model Constants for SnAgCu
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Topics: Alloys, ASTM International, Ball-Grid-Array packaging, Bone, Computer software, Constitutive equations, Displacement, Fatigue life, Finite element model, Fittings
Proceedings Papers

Prolonged Steady-State Exposure of Printed Wiring Boards Under Conditions of Temperature Humidity and Bias

M. Reid, J. Punch, B. Rodgers, T. Galkin, T. Stenberg, O. Rusanenc, E. Elonen, M. Vile`n, K. Va¨keva¨inen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1271-1276, July 17–22, 2005
Paper No: IPACK2005-73353
https://doi.org/10.1115/IPACK2005-73353
View Paper titled, Prolonged Steady-State Exposure of Printed Wiring Boards Under Conditions of Temperature Humidity and Bias
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Topics: Printed circuit boards, Steady state, Temperature, Failure, Condensation, Density, Electronic packaging, High temperature, Microelectronic packaging, Optical microscopy
Proceedings Papers

Thermal Gradient in Solder Joints Under Electrical Current Stressing

Da-Jeng Yao, Chung-Yi Hsu, Chih Chen, Sheng-Hsiang Chiu
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1277-1282, July 17–22, 2005
Paper No: IPACK2005-73356
https://doi.org/10.1115/IPACK2005-73356
View Paper titled, Thermal Gradient in Solder Joints Under Electrical Current Stressing
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Topics: Electric current, Solder joints, Temperature gradient, Temperature, Current density, Solders, Computer software, Errors, Finite element analysis, Heating
Proceedings Papers

A Simulated and Experimental Comparison of Lead-Free and Tin-Lead Solder Interconnect Failure Under Impact Stimuli

Greg Heaslip, Jeff Punch, Bryan Rogers, Claire Ryan, Michael Reid
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1283-1291, July 17–22, 2005
Paper No: IPACK2005-73366
https://doi.org/10.1115/IPACK2005-73366
View Paper titled, A Simulated and Experimental Comparison of Lead-Free and Tin-Lead Solder Interconnect Failure Under Impact Stimuli
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Topics: Ball-Grid-Array packaging, Failure, Failure analysis, Lead-free solders, Solders, Stress, Testing, Data acquisition systems, Design, Electronic components
Proceedings Papers

Reduce Vibration Analysis Errors With Precise Weight Predictions

Frank Fan Wang
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1075-1081, July 17–22, 2005
Paper No: IPACK2005-73004
https://doi.org/10.1115/IPACK2005-73004
View Paper titled, Reduce Vibration Analysis Errors With Precise Weight Predictions
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Topics: Errors, Vibration analysis, Weight (Mass), Design, Finite element analysis, Computers, Electronics, Modeling, Testing, Avionics
Proceedings Papers

Moisture Effects on the Reliability of Anisotropic Conductive Film Interconnection for Flip Chip on Flex Applications

Chunyan Yin, Hua Lu, Chris Bailey, Yan-Cheong Chan
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1293-1298, July 17–22, 2005
Paper No: IPACK2005-73367
https://doi.org/10.1115/IPACK2005-73367
View Paper titled, Moisture Effects on the Reliability of Anisotropic Conductive Film Interconnection for Flip Chip on Flex Applications
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Topics: Anisotropy, Flip-chip, Flip-chip devices, Reliability, Adhesives, Modeling, Contact resistance, Diffusion (Physics), Epoxy adhesives, Epoxy resins
Proceedings Papers

Comparing Shock, Random and Sine Vibration Loads of the Electronic Equipment

Frank Fan Wang
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1083-1088, July 17–22, 2005
Paper No: IPACK2005-73005
https://doi.org/10.1115/IPACK2005-73005
View Paper titled, Comparing Shock, Random and Sine Vibration Loads of the Electronic Equipment
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Topics: Electronic equipment, Shock (Mechanics), Stress, Vibration, Resonance, Damage, Excitation, Random vibration, Spectral energy distribution, Waves
Proceedings Papers

Creep Behavior of Lead Free Solder Interconnects in Microelectronic Packages: Impression Creep Testing and Constitutive Modeling

I. Dutta, D. Pan, S. Jadhav, R. Mahajan
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1299-1306, July 17–22, 2005
Paper No: IPACK2005-73408
https://doi.org/10.1115/IPACK2005-73408
View Paper titled, Creep Behavior of Lead Free Solder Interconnects in Microelectronic Packages: Impression Creep Testing and Constitutive Modeling
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Topics: Creep, Lead-free solders, Modeling, Testing, Solder joints, Ball-Grid-Array packaging, Tin, Stress, Intermetallic compounds, Particulate matter
Proceedings Papers

Understanding and Testing for Drop Impact Failure

S. K. W. Seah, E. H. Wong, R. Ranjan, C. T. Lim, Y.-W. Mai
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1089-1094, July 17–22, 2005
Paper No: IPACK2005-73047
https://doi.org/10.1115/IPACK2005-73047
View Paper titled, Understanding and Testing for Drop Impact Failure
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Topics: Failure, Testing, Inertia (Mechanics), Solder joints, Ball-Grid-Array packages, Electronics, Impact testing, Printed circuit boards, Shock (Mechanics), Stress
Proceedings Papers

Grain Formation and Intergrain Stresses in a Sn-Ag-Cu Solder Ball

Seungbae Park, Ramji Dhakal, Lawrence Lehman, Eric Cotts
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1095-1100, July 17–22, 2005
Paper No: IPACK2005-73058
https://doi.org/10.1115/IPACK2005-73058
View Paper titled, Grain Formation and Intergrain Stresses in a Sn-Ag-Cu Solder Ball
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Topics: Solders, Stress, Tin, Solder joints, Ball-Grid-Array packaging, Deformation, Optical microscopy, Fatigue life, Grain boundaries, Imaging
Proceedings Papers

Constitutive Modeling of Lead-Free Solders

M. Pei, J. Qu
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1307-1311, July 17–22, 2005
Paper No: IPACK2005-73411
https://doi.org/10.1115/IPACK2005-73411
View Paper titled, Constitutive Modeling of Lead-Free Solders
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Topics: Lead-free solders, Modeling, Solders, Thermomechanics, Tin, Alloys, Creep, Curve fitting, Deformation, Fatigue
Proceedings Papers

Plastic Strain Based Criterion for Reliability Assessment of CSP Packages Subjected to Dynamic Shock Loads

Liping Zhu, Rick Williams
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1101-1108, July 17–22, 2005
Paper No: IPACK2005-73059
https://doi.org/10.1115/IPACK2005-73059
View Paper titled, Plastic Strain Based Criterion for Reliability Assessment of CSP Packages Subjected to Dynamic Shock Loads
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Topics: Ball-Grid-Array packaging, Finite element analysis, Reliability, Shock (Mechanics), Stress, Failure, Ball-Grid-Array packages, Solder joints, Computer simulation, Computer software
Proceedings Papers

Lead-Free and PbSn Bump Electromigration Testing

Stephen Gee, Nikhil Kelkar, Joanne Huang, King-Ning Tu
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1313-1321, July 17–22, 2005
Paper No: IPACK2005-73417
https://doi.org/10.1115/IPACK2005-73417
View Paper titled, Lead-Free and PbSn Bump Electromigration Testing
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Topics: Electrodiffusion, Testing