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Proceedings Papers

Nondestructive Evaluation of Thermal Fatigue Crack Propagation in Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 761-769, July 19–23, 2009

Paper No: InterPACK2009-89155

DOI: https://doi.org/10.1115/InterPACK2009-89155

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Topics: Fatigue cracks, Nondestructive evaluation, Solder joints, Synchrotron radiation, Tin, X-rays, Solders, Crack propagation, Cycles, Computerized tomography

Proceedings Papers

Strain-Rate Effects on Constitutive Behavior of Sn3.8-Ag0.7-Cu Lead-Free Solder

Kok Ee Tan, John H. L. Pang

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 841-847, July 19–23, 2009

Paper No: InterPACK2009-89278

DOI: https://doi.org/10.1115/InterPACK2009-89278

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Topics: Lead-free solders, Solders, Yield stress, Stress-strain curves, Bone, Constitutive equations, Deformation, Elastic moduli, Finite element analysis, Mechanical properties

Proceedings Papers

Reliable Power Electronics for Wind Turbines

Patrick McCluskey, Peter Hansen, Douglas DeVoto

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 771-773, July 19–23, 2009

Paper No: InterPACK2009-89174

DOI: https://doi.org/10.1115/InterPACK2009-89174

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Topics: Electronics, Wind turbines, Electronic systems, Failure, Fatigue, Packaging, Heat, Temperature, Bonding, Ceramics

Proceedings Papers

Reliability Study of High-Temperature-Resistant Mounting Structure Considering Shear Behavior of Joint Layer

Masanori Yamagiwa, Masato Fujita, Qiang Yu, Hiromi Sugihara

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 849-855, July 19–23, 2009

Paper No: InterPACK2009-89284

DOI: https://doi.org/10.1115/InterPACK2009-89284

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Topics: Reliability, Shear (Mechanics), Temperature, Finite element analysis, Cycles, Displacement, Fatigue, Gallium nitride, Stress, Circuits

Proceedings Papers

Larger Array Fine Pitch Wafer Level Package Drop Test Reliability

Tiao Zhou, Robert Derk, Kaysar Rahim, Xuejun Fan

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 693-701, July 19–23, 2009

Paper No: InterPACK2009-89018

DOI: https://doi.org/10.1115/InterPACK2009-89018

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Topics: Reliability, Semiconductor wafers, Fracture (Materials), Corners (Structural elements), Failure, Alloys, Failure mechanisms, Finite element analysis, Solder joints, Solders

Proceedings Papers

Pb-Free Thin Small Outline Package (TSOP) Board Level Reliability Study

Weidong Xie, Kuo-Chuan Liu, Mark Brillhart

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 775-780, July 19–23, 2009

Paper No: InterPACK2009-89183

DOI: https://doi.org/10.1115/InterPACK2009-89183

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Topics: Reliability, Lead-free solders, Solders, Ball-Grid-Array packaging, Finite element analysis, Solder joints, Stress, Testing, Cycles, Failure

Proceedings Papers

Anomaly-Detection and Prognostication of Electronics Subjected to Shock and Vibration

Pradeep Lall, Prashant Gupta, Arjun Angral, Jeff Suhling

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 857-871, July 19–23, 2009

Paper No: InterPACK2009-89298

DOI: https://doi.org/10.1115/InterPACK2009-89298

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Topics: Electronics, Shock (Mechanics), Vibration, Failure, Damage, Solders, Principal component analysis, Failure mechanisms, Fracture (Process), Alloys

Proceedings Papers

Solder Joint Electromigration Mechanisms

Pilin Liu, Fan-yi Ouyang, Shenquan Ou, Zezhong Fu, Goyal Deepak

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 703-709, July 19–23, 2009

Paper No: InterPACK2009-89023

DOI: https://doi.org/10.1115/InterPACK2009-89023

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Topics: Electrodiffusion, Solder joints, Nucleation (Physics), Failure mechanisms, Warping

Proceedings Papers

Virtual Qualification Using Field Life Temperature Data

Patrick McCluskey, Peter Hansen, Christian Lenakakis, Wolfgang Wondrak

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 781-787, July 19–23, 2009

Paper No: InterPACK2009-89184

DOI: https://doi.org/10.1115/InterPACK2009-89184

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Topics: Temperature, Automotive engines, Cycles, Engines, Failure, Physics, Testing

Proceedings Papers

Remaining Useful-Life Based on Damage Pre-Cursors for Leadfree Electronics Subjected to Multiple Thermal-Environments

Pradeep Lall, Rahul Vaidya, Vikrant More, Jeff Suhling, Kai Goebel

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 873-885, July 19–23, 2009

Paper No: InterPACK2009-89299

DOI: https://doi.org/10.1115/InterPACK2009-89299

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Topics: Damage, Electronics, Service life (Equipment), Thermomechanics, Algorithms, Alloys, Circuits, Condition monitoring, Delamination, Fracture (Materials)

Proceedings Papers

Cure Profile Effects on the Mechanical Behavior and Reliability of Flip Chip on Laminate Assemblies

Guoyun Tian, Chang Lin, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 789-796, July 19–23, 2009

Paper No: InterPACK2009-89209

DOI: https://doi.org/10.1115/InterPACK2009-89209

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Topics: Flip-chip, Flip-chip devices, Hardening (Curing), Laminates, Mechanical behavior, Reliability, Stress-strain curves

Proceedings Papers

Damage Accumulation and Life-Prediction Models for SnAgCu Leadfree Electronics Under Shock-Impact

Pradeep Lall, Sandeep Shantaram, Arjun Angral, Mandar Kulkarni, Jeff Suhling

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 887-901, July 19–23, 2009

Paper No: InterPACK2009-89307

DOI: https://doi.org/10.1115/InterPACK2009-89307

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Topics: Damage, Electronics, Shock (Mechanics), Alloys, Failure mechanisms, Solders, Transients (Dynamics), Failure, Finite element analysis, Reliability

Proceedings Papers

Effect of Design Parameters on Thermo-Mechanical Stresses in 3D ICS

Leila J. Ladani

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 711-715, July 19–23, 2009

Paper No: InterPACK2009-89083

DOI: https://doi.org/10.1115/InterPACK2009-89083

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Topics: Design, Stress, Thermomechanics, Copper, Finite element analysis, Stiffness, Density, Diffusion (Physics), Finite element model, Integrated circuits

Proceedings Papers

Fracture Life Evaluation of Cu-Cored Solder Joint in BGA Package

Hisashi Tanie, Nobuhiko Chiwata, Motoki Wakano, Masaru Fujiyoshi, Takeyuki Itabashi

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 797-802, July 19–23, 2009

Paper No: InterPACK2009-89232

DOI: https://doi.org/10.1115/InterPACK2009-89232

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Topics: Ball-Grid-Array packages, Fracture (Materials), Solder joints, Solders, Crack propagation, Shapes, Finite element analysis, Particulate matter, Stiffness, Deformation

Proceedings Papers

Evaluation of the Bonding Strength at the Three-Dimensional Vertex in Silicon-Resin Joints

Hideo Koguchi, Masato Nakajima

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 717-727, July 19–23, 2009

Paper No: InterPACK2009-89091

DOI: https://doi.org/10.1115/InterPACK2009-89091

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Topics: Bonding, Resins, Silicon, Stress, Thermal stresses, Boundary element methods, Delamination, Materials properties, Stress concentration, Cooling

Proceedings Papers

Leading-Indicators Based on Impedance Spectroscopy for Prognostication of Electronics Under Shock and Vibration Loads

Pradeep Lall, Ryan Lowe, Jeff Suhling, Kai Goebel

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 903-914, July 19–23, 2009

Paper No: InterPACK2009-89308

DOI: https://doi.org/10.1115/InterPACK2009-89308

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Topics: Electrochemical impedance spectroscopy, Electronics, Shock (Mechanics), Stress, Vibration, Damage, Spectroscopy, Failure, Solders, Condition monitoring

Proceedings Papers

Plastic Strain Distribution as a Precursor for Transition From Ductile to Brittle Failure in Lead-Free Solder Joints

Feng Gao, Jianping Jing, Frank Z. Liang, Richard L. Williams, Jianmin Qu

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 729-736, July 19–23, 2009

Paper No: InterPACK2009-89098

DOI: https://doi.org/10.1115/InterPACK2009-89098

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Topics: Brittleness, Failure, Lead-free solders, Solders, Solder joints, Brittle fracture, Failure mechanisms, Design, Dynamic testing (Materials), Finite element analysis

Proceedings Papers

Solder Fatigue Impacts of Conformal Coating for Tin Whisker Mitigation on Chip-Scale Thin Small Outline Packages

Karl J. L. Geisler

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 915-920, July 19–23, 2009

Paper No: InterPACK2009-89312

DOI: https://doi.org/10.1115/InterPACK2009-89312

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Topics: Coatings, Fatigue, Solders, Fatigue life, Failure, Failure data, Shapes, Solder joints, Temperature, Urethane elastomers

Proceedings Papers

Life Prediction of SAC305 Interconnects Under Temperature Cycling Conditions Using an Arbitrary Loading Fatigue Model

Dominik Herkommer, Jeff Punch, Michael Reid

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 737-742, July 19–23, 2009

Paper No: InterPACK2009-89105

DOI: https://doi.org/10.1115/InterPACK2009-89105

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Topics: Ball-Grid-Array packaging, Failure, Fatigue, Finite element analysis, Modeling, Solders, Temperature, Testing

Proceedings Papers

Thermal Reliability of Low-Cost High-Power LED Package Module Under WHTOL Test

C. H. Chen, W. L. Tsai, C. Y. Tang, M. Y. Tsai

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 921-927, July 19–23, 2009

Paper No: InterPACK2009-89337

DOI: https://doi.org/10.1115/InterPACK2009-89337

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Topics: Junctions, Reliability, Temperature, Thermal resistance

2 3 4

NARROW

Nondestructive Evaluation of Thermal Fatigue Crack Propagation in Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography

Strain-Rate Effects on Constitutive Behavior of Sn3.8-Ag0.7-Cu Lead-Free Solder

Reliable Power Electronics for Wind Turbines

Reliability Study of High-Temperature-Resistant Mounting Structure Considering Shear Behavior of Joint Layer

Larger Array Fine Pitch Wafer Level Package Drop Test Reliability

Pb-Free Thin Small Outline Package (TSOP) Board Level Reliability Study

Anomaly-Detection and Prognostication of Electronics Subjected to Shock and Vibration

Solder Joint Electromigration Mechanisms

Virtual Qualification Using Field Life Temperature Data

Remaining Useful-Life Based on Damage Pre-Cursors for Leadfree Electronics Subjected to Multiple Thermal-Environments

Cure Profile Effects on the Mechanical Behavior and Reliability of Flip Chip on Laminate Assemblies

Damage Accumulation and Life-Prediction Models for SnAgCu Leadfree Electronics Under Shock-Impact

Effect of Design Parameters on Thermo-Mechanical Stresses in 3D ICS

Fracture Life Evaluation of Cu-Cored Solder Joint in BGA Package

Evaluation of the Bonding Strength at the Three-Dimensional Vertex in Silicon-Resin Joints

Leading-Indicators Based on Impedance Spectroscopy for Prognostication of Electronics Under Shock and Vibration Loads

Plastic Strain Distribution as a Precursor for Transition From Ductile to Brittle Failure in Lead-Free Solder Joints

Solder Fatigue Impacts of Conformal Coating for Tin Whisker Mitigation on Chip-Scale Thin Small Outline Packages

Life Prediction of SAC305 Interconnects Under Temperature Cycling Conditions Using an Arbitrary Loading Fatigue Model

Thermal Reliability of Low-Cost High-Power LED Package Module Under WHTOL Test

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