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Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales
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Proceedings Papers

Physics of Interfacial Heat Transfer Events in Flow Boiling of FC-72 Liquid in Microchannels

Sajjad Bigham, Saeed Moghaddam
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A017, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48581
https://doi.org/10.1115/IPACK2015-48581
View Paper titled, Physics of Interfacial Heat Transfer Events in Flow Boiling of FC-72 Liquid in Microchannels
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Topics: Boiling, Flow (Dynamics), Heat transfer, Microchannels, Physics, Bubbles, Evaporation, Heat flux, Resolution (Optics), Thermal conductivity
Proceedings Papers

Integrate Monolithic Nanostructures in Microchannels to Enhance Flow Boiling Heat Transfer of HFE-7000

Fanghao Yang, Xiaochuan Li, Wenming Li, Chen Li
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A006, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48737
https://doi.org/10.1115/IPACK2015-48737
View Paper titled, Integrate Monolithic Nanostructures in Microchannels to Enhance Flow Boiling Heat Transfer of HFE-7000
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Topics: Boiling, Flow (Dynamics), Heat transfer, Microchannels, Nanostructures , Fluids, Heat sinks, Nanolithography, Nanoparticles, Nanoscale phenomena
Proceedings Papers

Film Boiling Heat Transfer Enhancement via Electrostatic Leidenfrost State Suppression

Arjang Shahriari, Vaibhav Bahadur
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A007, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48667
https://doi.org/10.1115/IPACK2015-48667
View Paper titled, Film Boiling Heat Transfer Enhancement via Electrostatic Leidenfrost State Suppression
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Topics: Film boiling, Heat transfer, Boiling, Vapors, Temperature, Energy / power systems, Energy dissipation, Heat, Nuclear power plant operations, Nucleate boiling
Proceedings Papers

Computational Modeling of Extreme Heat Flux Microcooler for GaN-Based HEMT

Hyoungsoon Lee, Yoonjin Won, Farzad Houshmand, Catherine Gorle, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A018, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48670
https://doi.org/10.1115/IPACK2015-48670
View Paper titled, Computational Modeling of Extreme Heat Flux Microcooler for GaN-Based HEMT
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Topics: Computer simulation, Gallium nitride, Heat flux, Microcoolers, Microchannels, Simulation, Computational fluid dynamics, Flow (Dynamics), Fluids, Heat conduction
Proceedings Papers

Thermal Solution of High Flux Phased Radar Antenna for Military Application

Murat Parlak, Murat Yaban
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A008, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48055
https://doi.org/10.1115/IPACK2015-48055
View Paper titled, Thermal Solution of High Flux Phased Radar Antenna for Military Application
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Topics: Defense industry, Radar, Design, Cooling, Heat flux, Manifolds, Computational fluid dynamics, Computer software, Finite element methods, Flow (Dynamics)
Proceedings Papers

Numerical Simulation of Advanced Monolithic Microcooler Designs for High Heat Flux Microelectronics

Sebastian Scholl, Catherine Gorle, Farzad Houshmand, Tanya Liu, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A009, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48122
https://doi.org/10.1115/IPACK2015-48122
View Paper titled, Numerical Simulation of Advanced Monolithic Microcooler Designs for High Heat Flux Microelectronics
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Topics: Boundary-value problems, Computational fluid dynamics, Computer simulation, Cooling, Design, Fins, Flow (Dynamics), Fluid dynamics, Geometry, Heat conduction
Proceedings Papers

Hybrid Mini/Micro-Channel Heat Sink Using Liquid Metal and Water as Coolants

Sheng-Fu Mei, Zhong-Shan Deng, Jing Liu
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A010, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48318
https://doi.org/10.1115/IPACK2015-48318
View Paper titled, Hybrid Mini/Micro-Channel Heat Sink Using Liquid Metal and Water as Coolants
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Topics: Coolants, Heat sinks, Liquid metals, Microchannels, Water, Cooling, Electronics, Flow (Dynamics), Specific heat, Computer cooling
Proceedings Papers

Intrinsic Thermal Conductivity of Wurtzite Al x Ga 1- x N, In x Ga 1- x N and In x Al 1- x N From First-Principles Calculation

Jinlong Ma, Baoling Huang, Wu Li, Xiaobing Luo
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A001, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48032
https://doi.org/10.1115/IPACK2015-48032
View Paper titled, Intrinsic Thermal Conductivity of Wurtzite Al x Ga 1- x N, In x Ga 1- x N and In x Al 1- x N From First-Principles Calculation
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Topics: Thermal conductivity, Alloys, Crystals, Gallium nitride, Mean free path, Size effect, Temperature
Proceedings Papers

Micro-Feature Heat Exchanger Using Variable-Density Arrays for Near-Isothermal Cold Plate Operation

Noris Gallandat, Danielle Hesse, J. Rhett Mayor
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A011, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48417
https://doi.org/10.1115/IPACK2015-48417
View Paper titled, Micro-Feature Heat Exchanger Using Variable-Density Arrays for Near-Isothermal Cold Plate Operation
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Topics: Density, Heat exchangers, Flow (Dynamics), Heat, Temperature, Heat sinks, Heat transfer, Hydrofoil, Junctions, Water
Proceedings Papers

The Prediction of the Thermal Conductivity of Gallium Arsenide: A Molecular Dynamics Study

Fernan Saiz, Cristina H. Amon
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A002, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48114
https://doi.org/10.1115/IPACK2015-48114
View Paper titled, The Prediction of the Thermal Conductivity of Gallium Arsenide: A Molecular Dynamics Study
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Topics: Gallium arsenide, Molecular dynamics, Thermal conductivity, Temperature, Acoustics, Density, Design, Electromagnetic scattering, Equilibrium (Physics), Heat
Proceedings Papers

Flow and Heat Transfer in Liquid Films Flowing Over Highly Curved Surfaces

Zezhi Zeng, Gopinath Warrier, Y. Sungtaek Ju
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A012, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48149
https://doi.org/10.1115/IPACK2015-48149
View Paper titled, Flow and Heat Transfer in Liquid Films Flowing Over Highly Curved Surfaces
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Topics: Flow (Dynamics), Heat transfer, Liquid films, Heat exchangers, Cooling, Design, String, Shapes, Computer simulation, Evaporative cooling
Proceedings Papers

Modeling of Flow and Heat Transfer in a Molten Glass Mini-Film for High Temperature Heat Collection in a Falling-Film Solar Central Receiver

Ruth H. Reed, Justin Raade, Benjamin Elkin, Van P. Carey
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A013, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48532
https://doi.org/10.1115/IPACK2015-48532
View Paper titled, Modeling of Flow and Heat Transfer in a Molten Glass Mini-Film for High Temperature Heat Collection in a Falling-Film Solar Central Receiver
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Topics: Flow (Dynamics), Glass, Heat, Heat transfer, High temperature, Modeling, Solar energy, Temperature, Viscosity, Fluids
Proceedings Papers

Experimental Study of Aqueous Binary Mixture Droplet Vaporization on Nanostructured Surfaces

Russell J. LaBrie, II, Jorge Padilla, Jr., Van P. Carey
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A003, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48153
https://doi.org/10.1115/IPACK2015-48153
View Paper titled, Experimental Study of Aqueous Binary Mixture Droplet Vaporization on Nanostructured Surfaces
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Topics: Drops, Heat transfer, Water, Nanocrystals, Heat transfer coefficients, Copper, Evaporation, Film thickness, Gravity (Force), Hydrophilicity
Proceedings Papers

Quantitative Visualization of Vapor Bubble Growth in Diabatic Vapor-Liquid Microchannel Slug Flow

Todd A. Kingston, Justin A. Weibel, Suresh V. Garimella
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A014, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48177
https://doi.org/10.1115/IPACK2015-48177
View Paper titled, Quantitative Visualization of Vapor Bubble Growth in Diabatic Vapor-Liquid Microchannel Slug Flow
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Topics: Bubbles, Microchannels, Slug flows, Vapors, Visualization, Flow (Dynamics), Heating, Junctions, Boiling, Borosilicate glasses
Proceedings Papers

Tailoring of Permeability in Copper Inverse Opal for Electronic Cooling Applications

Chi Zhang, Guoguang Rong, James W. Palko, Thomas J. Dusseault, Mehdi Asheghi, Juan G. Santiago, Kenneth E. Goodson
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A004, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48262
https://doi.org/10.1115/IPACK2015-48262
View Paper titled, Tailoring of Permeability in Copper Inverse Opal for Electronic Cooling Applications
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Topics: Computer cooling, Copper, Permeability, Sintering, Cooling, Fluids, Capillarity, Electrodeposition, Electronics, Heat flux
Proceedings Papers

Visualization of Confined Jet Impingement With Boiling Using Time-Resolved Stereo-PIV

Matthew J. Rau, Tianqi Guo, Pavlos P. Vlachos, Suresh V. Garimella
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A015, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48184
https://doi.org/10.1115/IPACK2015-48184
View Paper titled, Visualization of Confined Jet Impingement With Boiling Using Time-Resolved Stereo-PIV
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Topics: Boiling, Visualization, Vapors, Flow (Dynamics), Heat, Particulate matter, Bubbles, Heat flux, Imaging, Outflow
Proceedings Papers

Influence of Reynolds Number of Tube Flow on Coalescence of Droplets in a Tube Creeping Flow

Masahiro Muraoka, Yuuki Kumagai, Yuuta Yatagawa, Ichiro Ueno
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A016, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48241
https://doi.org/10.1115/IPACK2015-48241
View Paper titled, Influence of Reynolds Number of Tube Flow on Coalescence of Droplets in a Tube Creeping Flow
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Topics: Creeping flow, Drops, Flow (Dynamics), Reynolds number, Clearances (Engineering)
Proceedings Papers

Boiling/Evaporation Characteristics of a Droplet on a Nano-Particles-Accumlated Bi-Porous Layer

Kazuhisa Yuki, Katsuki Fukushima, Koichi Suzuki
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A005, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48628
https://doi.org/10.1115/IPACK2015-48628
View Paper titled, Boiling/Evaporation Characteristics of a Droplet on a Nano-Particles-Accumlated Bi-Porous Layer
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Topics: Boiling, Drops, Evaporation, Particulate matter, Nanoparticles, Adhesion, Temperature, Bubbles, Critical heat flux, Heat transfer