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Proceedings Papers

Durability of Low Melt Alloys as Thermal Interface Materials

Chandan K. Roy, Daniel K. Harris, Sushil Bhavnani, Michael C. Hamilton, Wayne Johnson, Roy W. Knight
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A071, July 6–9, 2015
Paper No: IPACK2015-48083
DOI: https://doi.org/10.1115/IPACK2015-48083
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Topics: Alloys, Durability, Testing, ASTM International, Copper, Cycles, Gallium, Performance evaluation, Surface finishing, Tin
Proceedings Papers

In-Line Evaluation Method of the Intrinsic Stress of Thin Films Used for Transistor Structures

Hiroki Kishi, Takuya Sasaki, Nobuki Ueta, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 239-245, July 19–23, 2009
Paper No: InterPACK2009-89145
DOI: https://doi.org/10.1115/InterPACK2009-89145
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Topics: Evaluation methods, Stress, Thin films, Transistors, Gates (Closures), Electrodes, Finite element methods, Manufacturing, Stress concentration, Focused ion beams