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Proceedings Papers

Cold Gas Spray of Copper on Aluminum Nitride as Substrate for Power Electronics

Margie Guerrero, Pedro Quintero, Ozan Ozdemir, Tricia Schwartz

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 26–28, 2021

Paper No: IPACK2021-69270

DOI: https://doi.org/10.1115/IPACK2021-69270

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Topics: Aluminum, Copper, Electronics, Sprays, Ceramics, Manufacturing, Additive manufacturing, Bonding, Deformation, Electrical properties

Proceedings Papers

Assessing the Performance of Advanced Cooling Techniques on Thermal Management of Next-Generation Power Electronics

Palash V. Acharya, Vaibhav Bahadur, Robert Hebner, Abdelhamid Ouroua, Shannon Strank

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A001, October 7–9, 2019

Paper No: IPACK2019-6311

DOI: https://doi.org/10.1115/IPACK2019-6311

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Topics: Cooling, Electronics, Thermal management, Heat, Electronic packages, Energy dissipation, Heat sinks, Packaging, Silicon, Copper

Proceedings Papers

Numerical Investigation of Shape Effect on Microdroplet Evaporation

Shuai Shuai, Zichen Du, Binjian Ma, Li Shan, Baris Dogruoz, Damena Agonafer

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A010, August 27–30, 2018

Paper No: IPACK2018-8311

DOI: https://doi.org/10.1115/IPACK2018-8311

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Topics: Evaporation, Shapes, Drops, Vapors, Cooling, Computer cooling, Computer simulation, Design, Diffusion (Physics), Electric fields

Proceedings Papers

Numerical Approach to Cold Gas Spray on Ceramic Substrates for Power Electronics Packaging

Marco J. Echeverría, Pedro O. Quintero, Dimeji Ibitayo, Lauren Boteler

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A007, August 27–30, 2018

Paper No: IPACK2018-8279

DOI: https://doi.org/10.1115/IPACK2018-8279

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Topics: Ceramics, Electronic packaging, Sprays, Copper, Manufacturing, Reliability, Aluminum, Bonding, Brittleness, Computer simulation

Proceedings Papers

Arcing and Spacing Requirements for High Voltage Printed Circuit Boards

Prabjit Singh

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A011, July 6–9, 2015

Paper No: IPACK2015-48180

DOI: https://doi.org/10.1115/IPACK2015-48180

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Topics: Cellulosic fibers, Circuits, Coating processes, Coatings, Dust, Electric potential, Gates (Closures), Hardware, MOSFET transistors, Physics

Proceedings Papers

Microtexture and Electrical and Mechanical Properties of the Cold-Sprayed Copper Deposit

Yusuke Watanabe, Yuji Ichikawa, Kazuhiro Ogawa, Hideo Miura

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A007, July 16–18, 2013

Paper No: IPACK2013-73150

DOI: https://doi.org/10.1115/IPACK2013-73150

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Topics: Copper, Mechanical properties, Particulate matter, Brittle fracture, Ceramics, Coating processes, Coatings, Dielectric materials, Electrical properties, Electron backscatter diffraction

Proceedings Papers

Experiments and Modeling of a Liquid Droplet Transported by a Gas Stream Impinging on a Heated Surface: Single Phase Regime

Ryan P. Anderson, Alfonso Ortega

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 229-237, July 19–23, 2009

Paper No: InterPACK2009-89020

DOI: https://doi.org/10.1115/InterPACK2009-89020

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Topics: Drops, Modeling, Heat transfer coefficients, Sprays, Air flow, Convection, Cooling, Dynamics (Mechanics), Evaporation, Flow (Dynamics)

Proceedings Papers

A Fundamental Approach to Modeling Transport to an Impinging Spray

Andrea C. Ashwood, Curtis Lane, Benjamin M. Regner, Timothy A. Shedd

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 267-272, July 8–12, 2007

Paper No: IPACK2007-33898

DOI: https://doi.org/10.1115/IPACK2007-33898

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Topics: Modeling, Sprays, Liquid films, Computer simulation, Fittings, Simulation, Computational fluid dynamics, Drops, Fluids, Jets

Proceedings Papers

Effect of Orientation and Draining on Linear Spray Array Thermal Management

Benjamin M. Regner, Timothy A. Shedd

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 375-380, July 8–12, 2007

Paper No: IPACK2007-33833

DOI: https://doi.org/10.1115/IPACK2007-33833

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Topics: Drainage, Sprays, Thermal management, Cooling, Critical heat flux, Drops, Fluids, Geometry, Heart failure, Heat flux

Proceedings Papers

Modeling of Thin-Film Multi-Phase Heat Transfer With Statistical Thermodynamics

Adam G. Pautsch, Timothy A. Shedd

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 381-388, July 8–12, 2007

Paper No: IPACK2007-33846

DOI: https://doi.org/10.1115/IPACK2007-33846

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Topics: Bubbles, Heat transfer, Modeling, Nonequilibrium thermodynamics, Statistical mechanics, Thin films, Heat, Temperature, Cooling, Flow (Dynamics)

Proceedings Papers

Impact of Cubic Pin Finned Surface Structure Geometry Upon Spray Cooling Heat Transfer

Eric A. Silk, Jungho Kim, Ken Kiger

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1-9, July 17–22, 2005

Paper No: IPACK2005-73003

DOI: https://doi.org/10.1115/IPACK2005-73003

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Topics: Cooling, Geometry, Heat transfer, Sprays

Proceedings Papers

Indirect Spray Evaporative Thermal Management for Semiconductor Burn-In

Michael A. Benjamin, Andrew M. Odar, Erlendur Steinthorsson, Charles B. Cotten

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 259-266, July 17–22, 2005

Paper No: IPACK2005-73189

DOI: https://doi.org/10.1115/IPACK2005-73189

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Topics: Cooling, Semiconductors (Materials), Sprays, Thermal management

Proceedings Papers

An Investigation of Spray Cooling Thermal Management for Semiconductor Burn-In

T. Cader, B. Tolman, C. Tilton, M. C. Harris

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 65-71, July 6–11, 2003

Paper No: IPACK2003-35137

DOI: https://doi.org/10.1115/IPACK2003-35137

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Topics: Cooling, Semiconductors (Materials), Sprays, Thermal management, Temperature, Junctions, Engineering prototypes, Failure, Flow control, Forced convection

Proceedings Papers

Spray Cooling Thermal Management of a Semiconductor Chip Undergoing Probing, Diagnostics, and Failure Analysis

S. Ansari, T. Cader, N. Stoddard, B. Tolman, J. Frank, D. Cotton, T. Wong, N. Pakdaman

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 73-80, July 6–11, 2003

Paper No: IPACK2003-35206

DOI: https://doi.org/10.1115/IPACK2003-35206

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Topics: Cooling, Failure analysis, Semiconductors (Materials), Sprays, Thermal management, Temperature, Microscopes, Silicon, Coolants, Heat

Proceedings Papers

Orientation-Independent Atomization Heat Transfer Cell for Thermal Management of Microelectronics

Samuel N. Heffington, Ari Glezer

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 635-640, July 6–11, 2003

Paper No: IPACK2003-35299

DOI: https://doi.org/10.1115/IPACK2003-35299

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Topics: Cooling, Heat transfer, Microelectronic devices, Sprays, Thermal management

Proceedings Papers

Inkjet Assisted Spray Cooling of Electronics

Cullen E. Bash, Chandrakant D. Patel, Ratnesh K. Sharma

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 119-127, July 6–11, 2003

Paper No: IPACK2003-35058

DOI: https://doi.org/10.1115/IPACK2003-35058

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Topics: Cooling, Electronics, Sprays, Thermal management

Proceedings Papers

The Effects of Nozzle Configuration and Coolant Flow Rate on Spray Evaporative Cooling in a Multi-Chip Module Using FC-72

Adam G. Pautsch, Timothy A. Shedd

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 455-460, July 6–11, 2003

Paper No: IPACK2003-35227

DOI: https://doi.org/10.1115/IPACK2003-35227

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Topics: Coolants, Evaporative cooling, Flow (Dynamics), Multi-chip modules, Nozzles, Sprays, Heat, Cooling, Critical heat flux, Computers

NARROW

Cold Gas Spray of Copper on Aluminum Nitride as Substrate for Power Electronics

Assessing the Performance of Advanced Cooling Techniques on Thermal Management of Next-Generation Power Electronics

Numerical Investigation of Shape Effect on Microdroplet Evaporation

Numerical Approach to Cold Gas Spray on Ceramic Substrates for Power Electronics Packaging

Arcing and Spacing Requirements for High Voltage Printed Circuit Boards

Microtexture and Electrical and Mechanical Properties of the Cold-Sprayed Copper Deposit

Experiments and Modeling of a Liquid Droplet Transported by a Gas Stream Impinging on a Heated Surface: Single Phase Regime

A Fundamental Approach to Modeling Transport to an Impinging Spray

Effect of Orientation and Draining on Linear Spray Array Thermal Management

Modeling of Thin-Film Multi-Phase Heat Transfer With Statistical Thermodynamics

Impact of Cubic Pin Finned Surface Structure Geometry Upon Spray Cooling Heat Transfer

Indirect Spray Evaporative Thermal Management for Semiconductor Burn-In

An Investigation of Spray Cooling Thermal Management for Semiconductor Burn-In

Spray Cooling Thermal Management of a Semiconductor Chip Undergoing Probing, Diagnostics, and Failure Analysis

Orientation-Independent Atomization Heat Transfer Cell for Thermal Management of Microelectronics

Inkjet Assisted Spray Cooling of Electronics

The Effects of Nozzle Configuration and Coolant Flow Rate on Spray Evaporative Cooling in a Multi-Chip Module Using FC-72

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