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Proceedings Papers

Experimental Investigation of Parameters Affecting Performance of Pulsating Heat Pipe

Pawan Singh Kathait, Rajnish N. Sharma
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A023, August 29–September 1, 2017
Paper No: IPACK2017-74119
DOI: https://doi.org/10.1115/IPACK2017-74119
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Topics: Heat pipes, Computer cooling, Heat, Oscillations, Vapors, Bubbles, Construction, Design, Flux (Metallurgy), Heat transfer
Proceedings Papers

Thermal Design Analysis of 2.5-D Packages With Analytical TSV Submodels

H. Y. Zhang, Xiao Yan, W. H. Zhu, Leon Lin
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A001, July 6–9, 2015
Paper No: IPACK2015-48088
DOI: https://doi.org/10.1115/IPACK2015-48088
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Topics: Design, Heat sinks, Silicon, Aluminum, Copper, Energy dissipation, Heat, Modeling, Slug flows, Cooling
Proceedings Papers

Quantitative Visualization of Vapor Bubble Growth in Diabatic Vapor-Liquid Microchannel Slug Flow

Todd A. Kingston, Justin A. Weibel, Suresh V. Garimella
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A014, July 6–9, 2015
Paper No: IPACK2015-48177
DOI: https://doi.org/10.1115/IPACK2015-48177
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Topics: Bubbles, Microchannels, Slug flows, Vapors, Visualization, Flow (Dynamics), Heating, Junctions, Boiling, Borosilicate glasses
Proceedings Papers

Use of Two-Phase CFD Simulations to Develop a Boiling Heat Transfer Prediction Method for Slug Flow Within Microchannels

Mirco Magnini, John R. Thome
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A020, July 6–9, 2015
Paper No: IPACK2015-48033
DOI: https://doi.org/10.1115/IPACK2015-48033
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Topics: Boiling, Computational fluid dynamics, Engineering simulation, Heat transfer, Microchannels, Simulation, Slug flows, Bubbles, Evaporation, Flow (Dynamics)
Proceedings Papers

A Cost-Effective Modeling Approach for Simulating Phase Change and Flow Boiling in Microchannels

Zhenhai Pan, Justin A. Weibel, Suresh V. Garimella
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A023, July 6–9, 2015
Paper No: IPACK2015-48178
DOI: https://doi.org/10.1115/IPACK2015-48178
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Topics: Boiling, Flow (Dynamics), Microchannels, Modeling, Vapors, Bubbles, Simulation, Currents, Errors, Evaporation
Proceedings Papers

A Numerical Study of Pulsating Heat Pipe Performance

Brian P. d’Entremont, John R. Thome
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A025, July 6–9, 2015
Paper No: IPACK2015-48350
DOI: https://doi.org/10.1115/IPACK2015-48350
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Topics: Heat pipes, Slug flows, Boiling, Condensation, Evaporation, Microchannels, Buoyancy, Condensers (steam plant), Flow (Dynamics), Heat transfer
Proceedings Papers

Visualization and Analysis of Venting From a Single Microchannel Two-Phase Copper Heat Exchanger

Milnes P. David, Julie Steinbrenner, Josef Miler, Kenneth E. Goodson
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 437-444, July 19–23, 2009
Paper No: InterPACK2009-89192
DOI: https://doi.org/10.1115/InterPACK2009-89192
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Topics: Copper, Heat exchangers, Microchannels, Visualization, Flow (Dynamics), Membranes, Vapors, Pressure, Air flow, Cooling
Proceedings Papers

Numerical Simulations for Digitized Heat Transfer

Eric Baird, Kamran Mohseni
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 923-931, July 19–23, 2009
Paper No: InterPACK2009-89264
DOI: https://doi.org/10.1115/InterPACK2009-89264
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Topics: Computer simulation, Heat transfer, Alloys, Electronics, Fluids, Heat, Heat flux, Heat sinks, Liquid metals, Microelectromechanical systems
Proceedings Papers

Control of Instabilities in Two-Phase Microchannel Flow Using Artificial Nucleation Sites

Rory J. Jones, Daniel T. Pate, Sushil H. Bhavnani
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 347-358, July 8–12, 2007
Paper No: IPACK2007-33602
DOI: https://doi.org/10.1115/IPACK2007-33602
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Topics: Microchannel flow, Nucleation (Physics), Flow (Dynamics), Microchannels, Heat, Subcooling, Cavities, Heat sinks, Bubbly flow, Electronics
Proceedings Papers

Analysis of Constant-Heat-Flux Heat Transfer in Metal Foam

Nihad Dukhan, Kuan-Chin Chen
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 21-28, July 8–12, 2007
Paper No: IPACK2007-33051
DOI: https://doi.org/10.1115/IPACK2007-33051
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Topics: Heat, Heat transfer, Metal foams, Fluids, Heat conduction, Heat flux, Temperature profiles, Thermal equilibrium, Aluminum, Convection
Proceedings Papers

Thermal Management on Hot Spot Elimination / Junction Temperature Reduction for High Power Density System in Package Structure

Chan-Yen Chou, Chung-Jung Wu, Hsiu-Ping Wei, Ming-Chih Yew, Chien-Chia Chiu, Kuo-Ning Chiang
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 227-232, July 8–12, 2007
Paper No: IPACK2007-33534
DOI: https://doi.org/10.1115/IPACK2007-33534
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Topics: Junctions, Power density, System-in-package, Temperature, Thermal management, Heat, Metals, Design, Slug flows, Solders
Proceedings Papers

Thermal Performance Evaluation and Enhancement for an Automotive Wireless Application Incorporating Multiple Dynamic Heat Sources

Victor Chiriac, Tien-Yu Tom Lee
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 233-239, July 8–12, 2007
Paper No: IPACK2007-33705
DOI: https://doi.org/10.1115/IPACK2007-33705
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Topics: Computer simulation, Heat, Performance evaluation, Transients (Dynamics), Cycles, Heat budget (Physics), Signals, Copper, Design, Dynamic systems
Proceedings Papers

Redesigns of HSOP Package for High Power Consumption Based on the Numerical Thermal Simulation Analysis

John Chia, Jinfa Chen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 703-708, July 17–22, 2005
Paper No: IPACK2005-73018
DOI: https://doi.org/10.1115/IPACK2005-73018
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Topics: Design, Energy consumption, Simulation analysis, Thermal conductivity, Fatigue life, Finite element methods, Finite element model, Heat, Heat conduction, Reliability
Proceedings Papers

System and Package Level Thermal Optimization of Power Amplifier Modules With Application in Wireless Communication

Victor Adrian Chiriac, Tien-Yu Tom Lee, David Lutz
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 443-450, July 6–11, 2003
Paper No: IPACK2003-35216
DOI: https://doi.org/10.1115/IPACK2003-35216
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Topics: Optimization, Temperature, Elastomers, Design, Slug flows, Computer software, Copper, Failure, High temperature, Numerical analysis