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Proceedings Papers

Design for Reliability of Automotive Chip Scale Packages by Calibrated Virtual Prototyping

Ralf Döring, R. Dudek, S. Rzepka, L. Scheiter, E. Noack, B. Seiler
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A015, October 26–28, 2021
Paper No: IPACK2021-73970
DOI: https://doi.org/10.1115/IPACK2021-73970
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Topics: Design, Finite element analysis, Reliability, Simulation, Thermomechanics
Proceedings Papers

Nonlocal Damage Modeling of Solder Joint Failure Under Thermomechanical Cyclic Loading

Youssef Maniar, Alexander Kabakchiev, Marta Kuczynska, Masoomeh Bazrafshan, Peter Binkele, Siegfried Schmauder
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A003, October 26–28, 2021
Paper No: IPACK2021-73100
DOI: https://doi.org/10.1115/IPACK2021-73100
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Topics: Damage, Failure, Modeling, Solder joints, Thermomechanics, Finite element analysis, Simulation, Stress, Deformation, Solders
Proceedings Papers

Compact Thermosyphon Cooling System For High Heat Flux Servers: Validation Of Thermosyphon Simulation Code Considering New Test Data

Rémy Haynau, Jackson B. Marcinichen, Raffaele L. Amalfi, Filippo Cataldo, John R. Thome
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, October 26–28, 2021
Paper No: IPACK2021-72620
DOI: https://doi.org/10.1115/IPACK2021-72620
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Topics: Cooling systems, Heat flux, Simulation
Proceedings Papers

Efficient Thermal Analysis of Lab-Grown Diamond Heat Spreaders

Zihao Yuan, Tao Zhang, Jeroen Van Duren, Ayse K. Coskun
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 26–28, 2021
Paper No: IPACK2021-73017
DOI: https://doi.org/10.1115/IPACK2021-73017
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Topics: Diamonds, Flat heat pipes, Simulation, Thermal efficiency
Proceedings Papers

Numerical Modeling of Continuous Dynamic Recrystallization in Sn-Based Solder Connection Under Cyclic Loading

Marta Kuczynska, Ulrich Becker, Youssef Maniar, Steffen Weihe
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A004, October 26–28, 2021
Paper No: IPACK2021-73319
DOI: https://doi.org/10.1115/IPACK2021-73319
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Topics: Computer simulation, Finite element analysis, Recrystallization, Simulation, Solders, Stress, Tin
Proceedings Papers

PHM Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

A. Otto, E. Kaulfersch, P. Singh, C. Romano, M. Hildebrandt, S. Rzepka
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A005, October 27–29, 2020
Paper No: IPACK2020-2614
DOI: https://doi.org/10.1115/IPACK2020-2614
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Topics: Printed circuit boards, Thermomechanics, Stress, Ceramics, Control panels, Deformation, Electronic components, Experimental methods, Finite element analysis, Reliability
Proceedings Papers

Experimental Validation and Design Simulations of a Passive Two-Phase Cooling System for Datacenters

Jackson B. Marcinichen, John R. Thome, Raffaele L. Amalfi, Filippo Cataldo
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 27–29, 2020
Paper No: IPACK2020-2541
DOI: https://doi.org/10.1115/IPACK2020-2541
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Topics: Cooling systems, Design, Engineering simulation, Simulation, Cooling, Flow (Dynamics), Heat, Architecture, Boiling, Computer cooling
Proceedings Papers

High Performance Computing Package With Chip Module on Substrate Solutions

Ching Chia Chen, David Lai, Vito Lin, Yu Po Wang
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 27–29, 2020
Paper No: IPACK2020-2547
DOI: https://doi.org/10.1115/IPACK2020-2547
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Topics: Ball-Grid-Array packaging, Bridges (Structures), Cloud computing, Corners (Structural elements), Data centers, Deformation, Elongation, Flip-chip, Flip-chip devices, Fracture (Materials)
Proceedings Papers

CFD Simulation of Two-Phase Immersion Cooling Using FC-72 Dielectric Fluid

Amirreza Niazmand, Tushar Chauhan, Satyam Saini, Pardeep Shahi, Pratik Vithoba Bansode, Dereje Agonafer
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A009, October 27–29, 2020
Paper No: IPACK2020-2595
DOI: https://doi.org/10.1115/IPACK2020-2595
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Topics: Computational fluid dynamics, Cooling, Electronics, Fluids, Simulation
Proceedings Papers

Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective Behavior

Sukshitha Achar P. L., Huanyu Liao, Ganesh Subbarayan
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, October 7–9, 2019
Paper No: IPACK2019-6501
DOI: https://doi.org/10.1115/IPACK2019-6501
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Topics: Algorithms, Particulate matter, Packing (Shipments), Packings (Cushioning), Nonlinear programming, Optimization algorithms, Simulation, Computer programming, Gradient methods, Heat
Proceedings Papers

Effects of Cooling Architecture and PCB Layout Co-Design on the Concurrent Thermal and Electrical Performance of an On-Board Electric Vehicle Charger

Omri Tayyara, Kshitij Gupta, Carlos Da Silva, Miad Nasr, Amir Assadi, Olivier Trescases, Cristina H. Amon
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A012, October 7–9, 2019
Paper No: IPACK2019-6434
DOI: https://doi.org/10.1115/IPACK2019-6434
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Topics: Cooling, Design, Electric vehicles, Vehicles, Circuits, Density, Dynamics (Mechanics), Energy dissipation, Engineering prototypes, Engineering simulation
Proceedings Papers

Multi-Scale Thermal Analysis for Design of SiC-Based Medium Voltage Motor Drive

J. Emily Cousineau, Kevin Bennion, Karun Potty, He Li, Risha Na, Longya Xu, Jin Wang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A030, October 7–9, 2019
Paper No: IPACK2019-6631
DOI: https://doi.org/10.1115/IPACK2019-6631
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Topics: Design, Modeling, Motor drives, Porous materials, Thermal analysis, Computational fluid dynamics, Simulation, Boundary-value problems, Convection, Electronics
Proceedings Papers

System Electrothermal Transient Analysis of a High Current (40A) Synchronous Step Down Converter

Rajen Murugan, Jie Chen, Todd Harrison, C. T. Kao, Nathan Ai
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A004, October 7–9, 2019
Paper No: IPACK2019-6384
DOI: https://doi.org/10.1115/IPACK2019-6384
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Topics: Capacitors, Design, Inductors, Modeling, Multi-chip modules, Packaging, Power density, Silicon, Simulation, Transient analysis
Proceedings Papers

Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties

Promod R. Chowdhury, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A007, October 7–9, 2019
Paper No: IPACK2019-6561
DOI: https://doi.org/10.1115/IPACK2019-6561
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Topics: Fatigue life, Finite element analysis, Materials properties, Modeling, Stress, Viscoelasticity, Temperature, Polymers, Simulation, Relaxation (Physics)
Proceedings Papers

Double Side System in Package Development Challenge for Heterogeneous Integration

Feng Kao, Yu-Po Wang, Davidlion Wang, Jensen Tsai, Mike Tsai, Ryan Chiu, Eric He
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, October 7–9, 2019
Paper No: IPACK2019-6354
DOI: https://doi.org/10.1115/IPACK2019-6354
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Topics: System-in-package, Molding, Simulation, Accelerated life testing, Copper, Design, Energy dissipation, Internet of things, Manufacturing, Packaging
Proceedings Papers

Application of Electronics Packaging Fundamentals to Photovoltaic Interconnects and Packaging

Laura Spinella, Nick Bosco
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A003, October 7–9, 2019
Paper No: IPACK2019-6520
DOI: https://doi.org/10.1115/IPACK2019-6520
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Topics: Electronic packaging, Fatigue, Packaging, Simulation, Solders, Thermomechanics, Reliability, Climate, Architecture, Electronics
Proceedings Papers

Stress Evaluation of Flexible Displays With Multiple-Laminations Architecture Enabled by Experimental Measurement and Simulation Based Factorial Design

Chang-Chun Lee, Pei-Chen Huang, Chi-Wei Wang, Oscar Chuang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 7–9, 2019
Paper No: IPACK2019-6541
DOI: https://doi.org/10.1115/IPACK2019-6541
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Topics: Design, Finite element analysis, Lamination, Light-emitting diodes, Simulation, Stress, Adhesives, Coatings, Fatigue, Materials properties
Proceedings Papers

Automated Method Using Finite Element Analysis to Identify Plated Through Holes and Microvia Stacks at Failure Risk in Complex PCB Designs

Kourosh M. Kalayeh, Natalie Hernandez, Nathan Blattau, Craig Hillman
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 7–9, 2019
Paper No: IPACK2019-6347
DOI: https://doi.org/10.1115/IPACK2019-6347
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Topics: Failure, Finite element analysis, Risk, Reliability, Engineering simulation, Finite element methods, Finite element model, Simulation, Algorithms, Circuits
Proceedings Papers

Data Center Thermal Efficiency Improvement by Cooling Flow Vectoring Using Synthetic Jets

Eduardo Sepúlveda Jiménez, Jean Paul d’Alençon, Luis Silva-Llanca
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, October 7–9, 2019
Paper No: IPACK2019-6585
DOI: https://doi.org/10.1115/IPACK2019-6585
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Topics: Cooling, Data centers, Flow (Dynamics), Jets, Thermal efficiency, Energy consumption, Exergy, Tiles, Computer cooling, Computer software
Proceedings Papers

In-Plane Pre-Stress Analysis for Automotive Airbag Electronic Control Unit’s Printed Circuit Board Transverse Vibration

Guo Xiaochuan
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, August 27–30, 2018
Paper No: IPACK2018-8214
DOI: https://doi.org/10.1115/IPACK2018-8214
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Topics: Airbags, Printed circuit boards, Stress, Vibration, Design, Simulation, Simulation models, Finite element analysis, Manufacturing, Plate theory