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Proceedings Papers

Flow and Thermal Resistance Network Modeling of Finned Heat Sinks With Bypass Mounted in Rectangular Enclosure

Masaya Fukada, Takashi Fukue, Yasuhiro Sugimoto, Tomoyuki Hatakeyama, Masaru Ishizuka
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A006, October 26–28, 2021
Paper No: IPACK2021-72975
DOI: https://doi.org/10.1115/IPACK2021-72975
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Topics: Flow (Dynamics), Heat sinks, Modeling, Thermal resistance, Electronic equipment, Cooling, Design, Forced convection, Heat transfer, Network analysis
Proceedings Papers

Design and Fabrication of Graded Copper Inverse Opals (g-CIOs) for Capillary-Fed Boiling in High Heat Flux Cooling Applications

Qianying Wu, Chi Zhang, Mehdi Asheghi, Kenneth Goodson
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A011, October 27–29, 2020
Paper No: IPACK2020-2603
DOI: https://doi.org/10.1115/IPACK2020-2603
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Topics: Boiling, Cooling, Copper, Design, Heat flux, Manufacturing, Critical heat flux, Heat, Modeling, Permeability
Proceedings Papers

Experimental Validation and Design Simulations of a Passive Two-Phase Cooling System for Datacenters

Jackson B. Marcinichen, John R. Thome, Raffaele L. Amalfi, Filippo Cataldo
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 27–29, 2020
Paper No: IPACK2020-2541
DOI: https://doi.org/10.1115/IPACK2020-2541
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Topics: Cooling systems, Design, Engineering simulation, Simulation, Cooling, Flow (Dynamics), Heat, Architecture, Boiling, Computer cooling
Proceedings Papers

Ultra-Compact Micro-Scale Heat Exchanger for Advanced Thermal Management in Datacenters

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 27–29, 2020
Paper No: IPACK2020-2542
DOI: https://doi.org/10.1115/IPACK2020-2542
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Topics: Heat exchangers, Microscale devices, Thermal management, Cooling, Heat, Pressure drop, Density, Flow (Dynamics), Heat transfer, Refrigerants
Proceedings Papers

Liquid Cooling Utilizing a Hybrid Microchannel/Multi-Jet Heat Sink: A Component Level Study of Commercial Product

Cong Hiep Hoang, Mohammad Tradat, Yaman Manaserh, Bharath Ramakrisnan, Srikanth Rangarajan, Yaser Hadad, Scott Schiffres, Bahgat Sammakia
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A008, October 27–29, 2020
Paper No: IPACK2020-2627
DOI: https://doi.org/10.1115/IPACK2020-2627
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Topics: Cooling, Fins, Heat sinks, Microchannels, Pressure drop, Thermal resistance
Proceedings Papers

Experimental Study of a Set of Integrated Cross-Media Heat Exchangers (iCMHXs) for Liquid Cooling in Desktop Computers

Gargi Kailkhura, Raphael Mandel, Amir Shooshtari, Michael Ohadi
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A006, October 27–29, 2020
Paper No: IPACK2020-2591
DOI: https://doi.org/10.1115/IPACK2020-2591
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Topics: Additive manufacturing, Computational fluid dynamics, Computers, Cooling, Heat exchangers, Urethane elastomers, Sealants, Wire, Fluids, Calibration
Proceedings Papers

Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-and-Tube Heat Exchanger

Zhuo Yang, Tariq Amin Khan, Wei Li, Hua Zhu, Zhijian Sun, Zhengjiang Zhang, Jincai Du, Jianxin Zhou
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A022, August 27–30, 2018
Paper No: IPACK2018-8448
DOI: https://doi.org/10.1115/IPACK2018-8448
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Topics: Heat exchangers, Optimization, Artificial neural networks, Flow (Dynamics), Reynolds number, Friction, Pressure drop, Computational fluid dynamics, Computer simulation, Design
Proceedings Papers

Comparison of Evaporation and Condensation Characteristics Among Three Enhanced Tubes

Kunrong Shen, Zhichuan Sun, Xiaolong Yan, Wei Li, David J. Kukulka, Jianxin Zhou, Deyu Luan, Yan He, Bin Zhang
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A023, August 27–30, 2018
Paper No: IPACK2018-8449
DOI: https://doi.org/10.1115/IPACK2018-8449
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Topics: Condensation, Evaporation, Heat transfer, Heat transfer coefficients, Refrigerants, Pressure drop, Temperature, Vapors, Climate change, Flux (Metallurgy)
Proceedings Papers

A Thermo-Mechanical Study on Vertically Split Distribution-Wet Cooling Media Used in Data Centers

Mullaivendhan Varadharasan, Dereje Agonafer, Ahmed Al Khazraji, Jimil Shah, Ashwin Siddarth, James Hoverson, Mike Kaler
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, August 27–30, 2018
Paper No: IPACK2018-8378
DOI: https://doi.org/10.1115/IPACK2018-8378
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Topics: Cooling, Data centers, Thermomechanics, Flow (Dynamics), Incrustations, Temperature, Wetting, Air flow, Evaporative cooling, Water
Proceedings Papers

Impact of Tile Design on Thermal Performance of Open and Enclosed Aisles

Sadegh Khalili, Mohammad I. Tradat, Kourosh Nemati, Mark Seymour, Bahgat Sammakia
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A021, August 29–September 1, 2017
Paper No: IPACK2017-74339
DOI: https://doi.org/10.1115/IPACK2017-74339
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Topics: Design, Tiles, Air flow, Computational fluid dynamics, Containment, Cooling, Data centers, Density, Engineering simulation, Flow (Dynamics)
Proceedings Papers

High-Performance Microchannels Development Using Magnetic Stabilization

Seth Newport, Geoffrey Ormston, Michael Benedict, Ayyoub Mehdizadeh Momen
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A007, August 29–September 1, 2017
Paper No: IPACK2017-74147
DOI: https://doi.org/10.1115/IPACK2017-74147
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Topics: Microchannels, Particulate matter, Pressure drop, Heat transfer, Ferrites (Magnetic materials), Flow (Dynamics), Heat, Manufacturing, Mass transfer, Packing (Shipments)
Proceedings Papers

Embedded Two-Phase Cooling of Large 3D Compatible Chips With Radial Channels

Mark Schultz, Fanghao Yang, Evan Colgan, Robert Polastre, Bing Dang, Cornelia Tsang, Michael Gaynes, Pritish Parida, John Knickerbocker, Timothy Chainer
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A007, July 6–9, 2015
Paper No: IPACK2015-48348
DOI: https://doi.org/10.1115/IPACK2015-48348
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Topics: Cooling, Coolants, Temperature, Vehicles, Flux (Metallurgy), Heat, Dimensions, Flow (Dynamics), Heating, Pressure drop
Proceedings Papers

Validation Study for VOF Simulations of Boiling in a Microchannel

Catherine Gorlé, Hyoungsoon Lee, Farzad Houshmand, Mehdi Asheghi, Kenneth Goodson, Pritish R. Parida
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A022, July 6–9, 2015
Paper No: IPACK2015-48129
DOI: https://doi.org/10.1115/IPACK2015-48129
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Topics: Boiling, Microchannels, Simulation, Boundary-value problems, Temperature, Two-phase flow, Flow (Dynamics), Fluids, Heat flux, Heat transfer
Proceedings Papers

3D IC With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications

Xuchen Zhang, Xuefei Han, Thomas E. Sarvey, Craig E. Green, Peter A. Kottke, Andrei G. Fedorov, Yogendra Joshi, Muhannad S. Bakir
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A008, July 6–9, 2015
Paper No: IPACK2015-48584
DOI: https://doi.org/10.1115/IPACK2015-48584
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Topics: Cooling, Microfluidics, Heat sinks, Atmospheric pressure, Coolants, Heat flux, Heat transfer coefficients, Pressure drop, Silicon, Testing
Proceedings Papers

Modeling and Simulation Challenges in Embedded Two Phase Cooling: DARPA’s ICECool Program

Kaiser Matin, Avram Bar-Cohen, Joseph J. Maurer
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A024, July 6–9, 2015
Paper No: IPACK2015-48334
DOI: https://doi.org/10.1115/IPACK2015-48334
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Topics: Cooling, Modeling, Simulation, Critical heat flux, Corrosion, Design, Electrodiffusion, Erosion, Fluids, Gallium nitride
Proceedings Papers

Eulerian Multiphase Conjugate Model for Chip-Embedded Micro-Channel Flow Boiling

Pritish R. Parida, Hsin-Hua Tsuei, Timothy J. Chainer
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A027, July 6–9, 2015
Paper No: IPACK2015-48489
DOI: https://doi.org/10.1115/IPACK2015-48489
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Topics: Boiling, Cavities, Coolants, Cooling, Density, Evaporative cooling, Flow (Dynamics), Fluids, Heat transfer, Integrated circuits
Proceedings Papers

Thermal Solution of High Flux Phased Radar Antenna for Military Application

Murat Parlak, Murat Yaban
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A008, July 6–9, 2015
Paper No: IPACK2015-48055
DOI: https://doi.org/10.1115/IPACK2015-48055
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Topics: Defense industry, Radar, Design, Cooling, Heat flux, Manifolds, Computational fluid dynamics, Computer software, Finite element methods, Flow (Dynamics)
Proceedings Papers

Numerical Simulation of Advanced Monolithic Microcooler Designs for High Heat Flux Microelectronics

Sebastian Scholl, Catherine Gorle, Farzad Houshmand, Tanya Liu, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A009, July 6–9, 2015
Paper No: IPACK2015-48122
DOI: https://doi.org/10.1115/IPACK2015-48122
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Topics: Boundary-value problems, Computational fluid dynamics, Computer simulation, Cooling, Design, Fins, Flow (Dynamics), Fluid dynamics, Geometry, Heat conduction
Proceedings Papers

Micro-Feature Heat Exchanger Using Variable-Density Arrays for Near-Isothermal Cold Plate Operation

Noris Gallandat, Danielle Hesse, J. Rhett Mayor
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A011, July 6–9, 2015
Paper No: IPACK2015-48417
DOI: https://doi.org/10.1115/IPACK2015-48417
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Topics: Density, Heat exchangers, Flow (Dynamics), Heat, Temperature, Heat sinks, Heat transfer, Hydrofoil, Junctions, Water
Proceedings Papers

Computational Modeling of Extreme Heat Flux Microcooler for GaN-Based HEMT

Hyoungsoon Lee, Yoonjin Won, Farzad Houshmand, Catherine Gorle, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A018, July 6–9, 2015
Paper No: IPACK2015-48670
DOI: https://doi.org/10.1115/IPACK2015-48670
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Topics: Computer simulation, Gallium nitride, Heat flux, Microcoolers, Microchannels, Simulation, Computational fluid dynamics, Flow (Dynamics), Fluids, Heat conduction