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Proceedings Papers

Surface Engineering Through Atomic Layer Deposition on Three-Dimensionally Structured Materials

Nhi V. Quach, Quang N. Pham, Ju-Hwan Han, Youngjoon Suh, Jin-Seong Park, Yoonjin Won
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2613
https://doi.org/10.1115/IPACK2020-2613
View Paper titled, Surface Engineering Through Atomic Layer Deposition on Three-Dimensionally Structured Materials
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Topics: Architecture, Coatings, Condensation, Condensed matter, Drops, Fluids, Hydrophilicity, Membranes, Metals, Nickel
Proceedings Papers

A Porous Medium Approach for Single-Phase Flow and Heat Transfer Modeling in Manifold Microchannel Heat Exchangers

Fabio Battaglia, Raphael Mandel, Amir Shooshtari, Michael M. Ohadi
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2564
https://doi.org/10.1115/IPACK2020-2564
View Paper titled, A Porous Medium Approach for Single-Phase Flow and Heat Transfer Modeling in Manifold Microchannel Heat Exchangers
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Topics: Flow (Dynamics), Heat exchangers, Heat transfer, Manifolds, Microchannels, Modeling, Porous materials
Proceedings Papers

Multi-Scale Thermal Analysis for Design of SiC-Based Medium Voltage Motor Drive

J. Emily Cousineau, Kevin Bennion, Karun Potty, He Li, Risha Na, Longya Xu, Jin Wang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A030, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6631
https://doi.org/10.1115/IPACK2019-6631
View Paper titled, Multi-Scale Thermal Analysis for Design of SiC-Based Medium Voltage Motor Drive
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Topics: Design, Modeling, Motor drives, Porous materials, Thermal analysis, Computational fluid dynamics, Simulation, Boundary-value problems, Convection, Electronics
Proceedings Papers

A Study on the Thermo-Fluid Simulation Model Using Porous Media in the Power Conversion System

Chang-Woo Han, You-Lim Moon, Seung-Boong Jeong, Jong-Hee Han
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A001, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48085
https://doi.org/10.1115/IPACK2015-48085
View Paper titled, A Study on the Thermo-Fluid Simulation Model Using Porous Media in the Power Conversion System
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Topics: Porous materials, Power conversion systems, Simulation models, Thermofluids, Heat sinks, Air flow, Power semiconductor devices, Temperature, Computation, Computer simulation
Proceedings Papers

Liquid Flow Analysis in Porous Media for Large Vapor Chamber With Multiple Heat Sources

Sergio Escobar, Niru Kumari, Rocky Shih, Sarah Anthony, Cullen Bash
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A060, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48770
https://doi.org/10.1115/IPACK2015-48770
View Paper titled, Liquid Flow Analysis in Porous Media for Large Vapor Chamber With Multiple Heat Sources
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Topics: Flow (Dynamics), Heat, Porous materials, Vapors, Cooling, Heat transfer, Approximation, Capillarity, Computational fluid dynamics, Design
Proceedings Papers

Analytic Optimization of Porous Medium Heat Sinks for Energy Efficiency and Minimum Mass

Ninad Trifale, Eric Nauman, Kazuaki Yazawa
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A039, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73187
https://doi.org/10.1115/IPACK2013-73187
View Paper titled, Analytic Optimization of Porous Medium Heat Sinks for Energy Efficiency and Minimum Mass
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Topics: Energy efficiency, Heat sinks, Optimization, Porous materials, Heat transfer, Porosity, Fluids, Density, Electrical conductivity, Energy consumption
Proceedings Papers

Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal Foams

Mahmood R. S. Shirazy, Luc G. Fréchette
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A024, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73106
https://doi.org/10.1115/IPACK2013-73106
View Paper titled, Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal Foams
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Topics: Copper, Foams (Chemistry), Evaporation, Computer cooling, Containers, Ethanol, Flux (Metallurgy), Heat, Heat conduction, Heat pipes
Proceedings Papers

Analysis of Single-Phase Multi-Layer Heat Sinks Using a Porous Media Approach: Influence of Spatially Varying Porosity

John J. Podhiny, Alfonso Ortega
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A040, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73189
https://doi.org/10.1115/IPACK2013-73189
View Paper titled, Analysis of Single-Phase Multi-Layer Heat Sinks Using a Porous Media Approach: Influence of Spatially Varying Porosity
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Topics: Heat sinks, Porosity, Porous materials, Design, Heat exchangers, Design methodology, Fluids, Modeling, Pressure drop, Scaling laws (Mathematical physics)
Proceedings Papers

Development of a Miniature Vapor Compression Refrigeration System for Electronic Cooling

Gareth F. Davies, Ian W. Eames, Paul B. Bailey, Michael W. Dadd, Adam Janiszewski, C. Richard Stone, Graeme G. Maidment, Brian Agnew
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 399-408, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89162
https://doi.org/10.1115/InterPACK2009-89162
View Paper titled, Development of a Miniature Vapor Compression Refrigeration System for Electronic Cooling
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Topics: Compression, Computer cooling, Refrigeration, Vapors, Compressors, Cooling, Heat, Heat exchangers, Porous materials, Transients (Dynamics)
Proceedings Papers

Approximate Analysis for Darcy-Flow Convection in Porous Media With Zero Fluid Conduction

Nihad Dukhan
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 881-886, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89231
https://doi.org/10.1115/InterPACK2009-89231
View Paper titled, Approximate Analysis for Darcy-Flow Convection in Porous Media With Zero Fluid Conduction
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Topics: Convection, Flow (Dynamics), Fluids, Heat conduction, Porous materials, Electrical conductivity, Heat, Thermal conductivity, Cooling, Design
Proceedings Papers

The Adiabatic Conditions on Inner Boundary for Natural Convection With Porous Medium in a Narrow Horizontal Cylindrical Annulus

Kamyar Mansour
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 129-134, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33086
https://doi.org/10.1115/IPACK2007-33086
View Paper titled, The Adiabatic Conditions on Inner Boundary for Natural Convection With Porous Medium in a Narrow Horizontal Cylindrical Annulus
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Topics: Annulus, Natural convection, Porous materials, Approximation, Computation, Rayleigh number, Temperature
Proceedings Papers

Analysis and Optimization of the Thermal Performance of Microchannel Heat Sinks

Dong Liu, Suresh V. Garimella
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 557-565, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35260
https://doi.org/10.1115/IPACK2003-35260
View Paper titled, Analysis and Optimization of the Thermal Performance of Microchannel Heat Sinks
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Topics: Heat sinks, Microchannels, Optimization, Computational fluid dynamics, Convection, Modeling, Porous materials, Temperature, Thermal resistance
Proceedings Papers

Heat Transfer in Triangular Microchannels

J. Todd Dickey, Tung T. Lam
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 303-307, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35133
https://doi.org/10.1115/IPACK2003-35133
View Paper titled, Heat Transfer in Triangular Microchannels
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Topics: Heat transfer, Microchannels, Porous materials, Cross section (Physics), Fluid dynamics, Fluids, Microchannel flow