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Proceedings Papers
Bidzina Kekelia, Qianying Wu, Sreekant Narumanchi, Joshua Major, Gilbert Moreno, Mehdi Asheghi, Ercan M. Dede, James Palko, Kenneth Goodson
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A017, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113781
Proceedings Papers
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A005, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111736
Proceedings Papers
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97266
Proceedings Papers
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6307
Proceedings Papers
Hyoungsoon Lee, Tanmoy Maitra, James Palko, Chi Zhang, Michael Barako, Yoonjin Won, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74090
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A047, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48771
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A032, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73153
Proceedings Papers
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 123-131, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52056
Proceedings Papers
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 81-94, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52042
Proceedings Papers
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 753-760, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89101
Proceedings Papers
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 359-373, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33620
Proceedings Papers
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 985-991, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33069
Proceedings Papers
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 575-585, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35267
Proceedings Papers
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 675-680, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35316